Denso Corporation

Nippondenso Co., Ltd.

Nippon Soken, Inc.

Toshihiro Miyake

Yoshitaro Yazaki

Koji Kondo

Makoto Totani

Tomohiro Yokochi

Masashi Hori

Taku Iida

Yoshio Hironaka

Takashi Kamiya

Satoshi Takeuchi

Takashi Kurahashi

Makoto Takagi

Nozomu Okumura

Kazuya Sanada

Katsuaki Kojima

Takehito Teramae

Kazuyuki Deguchi

Hajime Nakagawa

Hiroki Kamiya

Yasushi Matsumura

Hideharu Ishihara

Koichi Shigematsu

Masashi Hiramatsu

Hiroyasu Iwama

Yoshihiko Shiraishi

Toshikazu Harada

Tadatomo Suga

Kenji Ochi

Masayuki Aoyama

Mitsutoshi Miyazaki

Yasuo Ishihara

Kazuo Tada

Fumio Kojima

Toshiaki Yagura

Yosuke Ozaki

Tomoyuki Nanami

Katsumi Yamazaki

Eiji Higurashi

Akinari Higashida

Hiroki Miyagawa

Koii Kondo

Kenzo Hirano

Katuya Bando

Seiji Konishi

Seiichi Shindou

Hiroaki Maeda

An electronic device includes a heat generator including at least an electronic component generating heat, a case dissipating heat from the heat generator, a heat conductive member conducting heat of the heat generator to a heat dissipation member, and a metal bonding layer interposing between the heat generator and the heat conductive member and including at least a first bonding layer using gold or gold alloy as a constituting material. Thickness of the metal bonding layer is smaller than flatness of a bonding region which is bonded to a metal bonding layer on a facing surface of the heat generator and a facing surface of the heat conductive member. The heat conductive member has flexibility, is joined to the heat generator via the metal bonding layer, and is in contact with the case.

Electronic device

A joint structure includes a first member, a second member and a metal joint layer. The first member has including a first surface and is made of material having one of copper, copper alloy, aluminum, or aluminum alloy. The second member includes a second surface that faces the first surface of the first material. The metal joint layer includes a gold joint layer made of material having gold or gold alloy and is disposed between the first surface of the first material and the second surface of the second material. A thickness of the metal joint layer is smaller than flatness of the first surface of the first material and flatness of the second surface of the second material. Fluorine is dispersed inside at least the gold joint layer included in the metal joint layer.

Joint structure, electronic device and method for manufacturing the joint structure

An electronic device includes a metal member and a connected member. A metal connecting layer is provided between a lower-side surface of the metal member and an upper-side surface of the connected member, to connect the metal member and the connected member to each other. The metal connecting layer includes at least one of metal films, each of which is made of gold or gold alloy. A thickness of the metal connecting layer in an opposing area between the metal member and the connected member is smaller than a flatness of each of the lower-side surface and the upper-side surface. A rust-preventing film is formed on a side wall of the metal member in such a way that the rust-preventing film extends from an outer periphery of the metal connecting layer to a position away from the outer periphery by a predetermined distance.

A composite material includes a metal material having conductivity and an oxidation inhibitor mixed with the metal material. The oxidation inhibitor forms a complex with the metal material to exert a resistance to oxidation of the metal material. For example, the composite material is formed on a surface of a base material as a plating material. As another example, the composite material is plated on a surface of an electrode.

Composite material, method for forming the composite material, electrode plated with the composite material, and connection structure having the composite material

An electronic apparatus includes a connection target member that has a first connection portion including copper or copper alloy, a connection terminal that has a second connection portion including copper or copper alloy, the second connection portion mechanically connecting with the first connection portion by spring reaction force of the connection terminal, and a joint portion that is provided with a contact point between the first connection portion and the second connection portion. At least one of the first connection portion and the second connection portion includes an oxide film at a periphery of the joint portion on a surface thereof, the oxide film including copper oxide. The joint portion directly joints copper included in the first connection portion and copper included in the second connection portion metallurgically.

Electronic apparatus and manufacturing method of electronic apparatus

An electric connection structure electrically connecting an electric device and a circuit board includes a connection terminal including a press-welded terminal portion welded to a device terminal of the electric device by pressing, and a press-fit terminal portion fitted in a through-hole of the circuit board by pressing. A direction of the pressing of the press-welded terminal portion against the device terminal is the same as a direction of the pressing of the press-fit terminal portion into the through-hole.

Electric connection structure

A composite material includes a metal matrix of a metal and a reducing agent. The reducing agent is dispersed in the metal matrix and is capable of reducing an oxide of the metal at room temperature. Even when the oxide of the metal is generated on a surface of the composite material, the reducing agent reduces the oxide of the metal to the metal

Composite material, electric contact electrode, electric contact film, conductive filler, electric contact structure using composite material, and manufacturing method of composite material

A tip end and a base end therebetween define an opening located between a first conductive portion and a second conductive portion. The opening includes a pair of first linear portions, a pair of second linear portions, and a pair of third linear portions, which are located between the first conductive portion and the second conductive portion. The pair of first linear portions is in straight liner shapes and distant from both the tip end and the base end. The second linear portions are in straight liner shapes and located on the side of the tip end to have therebetween a distance decreasing toward the tip end. The third linear portions are in straight liner shapes and located on the side of the base end to have therebetween a distance decreasing toward the base end.

Press-fit pin, connection structure including the press-fit pin, and electronic device including the press-fit pin

A card edge connector for electrically connecting harnesses to contact electrodes that are located in different positions on a surface of an electronic substrate in an insertion direction includes a housing, harness terminals, and relay terminals. The housing defines a substrate insertion hole for receiving the electronic substrate. The harness terminals are separately connected to the harnesses and located in different positions in a height direction perpendicular to the insertion direction. The relay terminals separately connect the harness terminals to the contact electrodes upon insertion of the electronic substrate into the substrate insertion hole.

Card edge connector and method of manufacturing the same

A card edge connector for electrically coupling between contact electrodes on an electric circuit board and harnesses includes: a housing with a board insertion opening; harness terminals coupling with the harnesses; and junction terminals coupling between contact electrodes and harness terminals. The contact electrodes include first and second contact electrodes on both of first and second surfaces of the board. Each first contact electrode is nearer one end of the board than each second contact electrode. The first and second contact electrodes on the first or second surface are aligned alternately along with a width direction of the board. A first or second end of the junction terminal contacting the contact electrode on the first or second surface extends from a first or second inner wall of the board insertion opening to reach a centerline of the board.

Card edge connector and method for assembling the same

A card edge connector includes a housing, a first conductive part, a second conductive part, a connecting element, a first harness, and a second harness. The housing has an insertion hole for receiving an electronic substrate therein. The first conductive part and the second conductive part are disposed in the insertion hole and are configured to come in contact with respective terminals disposed on a surface of the electronic substrate. The connecting element is coupled with the second conductive part and extends in a direction approximately vertical to a planer direction of the electronic substrate so as to be away from the surface of the electronic substrate. The first harness is coupled with the first conductive part and the second harness penetrates a penetrated part of the connecting element.

A card edge connector includes a housing, a first conductive part, a second conductive part, a supporting conductive part, a connecting element, a first harness, and a second harness. The housing has an insertion hole for receiving an electronic substrate therein. The first conductive part and the second conductive part are disposed in the insertion hole and are configured to come in contact with respective terminals disposed on a surface of the electronic substrate. The supporting conductive part is disposed in the housing in such a manner that supporting conductive part is farther away from the surface of the electronic substrate than the first conductive part is. The connecting element couples the second conductive part and the supporting conductive part, the first harness is coupled with the first conductive part, and the second harness is coupled with the supporting conductive part.

A hydrocarbon compound mixed with an organic peroxide is placed between a copper electrode and a solder-coated electrode, and is heated at a temperature of about 300&#xb0; C. The organic peroxide is exposed to a heating energy and thermally decomposed into an organic peroxide radical whose oxygen-oxygen bond has been released. Since this organic peroxide radical is active, it abstracts hydrogen from the hydrocarbon compound. The formation of a hydrocarbon compound radical is accelerated by the organic peroxide so that even at a relatively low heating temperature, a sufficient amount of a hydrocarbon compound radical can be formed. As a result, an oxide film can be removed from the metal surface even at a relatively low heating temperature by the reduction caused by a hydrocarbon compound radical.

Metal bonding method

A printed circuit boardand an FPC boardto be connected together are each given a multilayer structure wherein insulating filmsand interconnection patternsare stacked alternately. In the FPC board, connecting signal lines are distributed among the multilayered interconnection patterns, and in the printed circuit board, interconnecting to landsformed on a connection face thereof is carried out using interconnection patternsof inner layers. By this means, it is possible to greatly increase the number of connecting signal lines between the printed circuit boardand the FPC board

Circuit board and circuit board connection structure

A multilayer printed circuit board with a built-in capacitor includes a plurality of resin films, each of which is made of thermoplastic resin and has a plurality of via-holes at predetermined positions, a plurality of conductive patterns, which are located on the resin films, and a plurality of conductive pattern interconnecting members, which are located in the via-holes to electrically interconnect the conductive patterns that are electrically separated by the resin films. Two of the conductive patterns are respectively located on two surfaces, which are opposite to each other, of one of the resin films while overlapping. The two of the conductive patterns and the one of the resin films make up a capacitor.

Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit board

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Inuyama, Japan

Toshihiro Miyake