Fujitsu Component Limited

Fujitsu Corporation

Fujisu Component Limited

Toshihiro Kusagaya

Osamu Daikuhara

Kazuhiro Mizukami

Takeshi Okuyama

Tadashi Kumamoto

Tohru Yamakami

Hideo Miyazawa

Shigemi Kurashima

Takashi Arita

Takashi Yuba

Masahiro Yanagi

Koichi Kiryu

Hideki Iwata

Kazuhiko Ikeda

Shigeyuki Takizawa

Hiroshi Matsumiya

Kazuo Nomura

Yuko Ikeda

Yasuhiko Furuno

Shunji Baba

Hidehiko Kira

Masahiro Kaneko

Yasuhiro Yoneda

Kenji Kobae

Norio Kainuma

Junichi Akama

Daisuke Mizutani

Manabu Shimizu

Naoki Ishikawa

Akira Fujii

Yasuyuki Miki

Yuriko Segawa

Tetsugaku Tanaka

Takahiro Kondou

Satoshi Emoto

Toru Yamakami

Kazuhisa Tsunoi

Yuji Suwa

Kazuhiko Iijima

Nobuyoshi Shimizu

Satoshi Moriyama

Hajime Hasegawa

Akira Tamura

Yoshihiro Morita

Yasushi Masuda

Ayumu Akabane

Fumio Kurotori

Michinao Nomura

Fumihiko Tokura

Hiroaki Tamura

Noboru Shimizu

Mitsuhiro Ueno

Byung Hoon Jeon

Toshio Hashi

Kanji Nagashima

Hirohisa Ishikawa

Yuji Yamada

Kazuhiko c/o Fujitsu Limited Iljima

Daisuke c/o Fujitsu Limited Mizutani

Yuji c/o Fujitsu Limited Suwa

Yasuhiro c/o Fujitsu Limited Yoneda

An optical member includes a base having a surface, and a plurality of protrusions formed on the surface of the base. The plurality of protrusions is arranged in a form to cause a space between the protrusions to be filled up with adhesive to adhere an adhesion target component above the base by a capillary phenomenon.

Optical member and optical module

Disclosed is a surface mount device to be mounted on a base member, including plural lead units, each of the plural lead units including, a lead including a body portion and a foot formed at an end of the lead; a solder portion formed at the foot of the lead to protrude toward the direction of the base member to have a summit portion, and a diffusion prevention portion provided on the lead for preventing a diffusion of a solder along the body portion of the lead.

Method of manufacturing surface mount device

A connectorwhich comprises a plurality of signal contacts, each of which is provided with two aligned first connecting partsat one end and two aligned second connecting partsat the other end and which form balanced transmission lines, further comprises a first holding memberwhich holds the first connecting partsof the plurality of signal contactsand a second holding memberwhich holds the second connecting parts, intermediate parts of the plurality of signal contactsbetween the first holding memberand the second holding memberbeing exposed to the air.

Connector

Surface mount device

A connectorcomprises an optical module which has an optical element which is mounted on a mounting surface of a circuit board, said mounting surface being vertical to a connection direction of said connector and an optical waveguide memberwhich has a clad partand a core partwhich is formed inside of the clad part, the optical waveguide memberbeing provided with a first end facewhich is arranged facing the mounting surface of the circuit boardand a second end faceat an opposite side to the first end face, the core partbeing formed so as to propagate light between an optical fiberwhich is supported by another connectorwhich is arranged facing the second end faceand the optical element

A connector includes a lead part configured to be connected to a board; and a solder sheet having a plate shape. The solder sheet is engaged with and fixed to the lead part with the lead part passing through a hole in the solder sheet. At least one of the lead part and the solder sheet has a structure configured to prevent the solder sheet from coming off the lead part.

Connector and solder sheet

A connection member to be inserted into a through-hole of a socket module that is electrically connected between an electronic component and a substrate, the connection member includes: a first end portion that is connected to the electronic component; a second end portion that is connected to the substrate; a plurality of upper flexure portions that correspond to projections of a waveform arranged near the electronic component; and a plurality of lower flexure portions that correspond to projections of the waveform arranged near the substrate; wherein the connection member is a single conductor member with elasticity and is formed in the shape of the waveform.

Connection member, socket module, socket and method for manufacturing connection member

A connector includes: a housing; and a connector module; the connector module including: a projection portion that projects outside from the housing; a substrate composed of a material with thermal conductivity; and a terminal that is fixed to a lower part of the substrate and contacts on an external substrate.

Electrical connector with thermal conductive substrate

An electronic connector includes a plurality of pairs of terminal parts for transmitting an electric signal; and grounding parts shaped like plates and connected to have a ground potential, wherein the grounding parts have protrusions protruding on a side of the pairs of terminal parts, and the protrusions are respectively interposed between the pairs of terminal parts which are adjacent to each other.

Electronic connector including grounding part having protrusion interposed between terminal connecting parts

An optical connector includes an optical element to be optically connected to an optical fiber; and an optical component. The optical component includes an element fixation part configured to fix the optical element to the optical component; a ferrule attachment part to which a ferrule having the optical fiber connected thereto is to be attached; and a lens to face the optical fiber when the ferrule is attached to the ferrule attachment part. The optical element is positioned relative to the optical fiber in response to attachment of the ferrule to the ferrule attachment part.

Optical connector

An electronic component includes: an electronic component body; and a lead secured to the electric component and including a projection portion defined by first and second inclined portions facing each other. The solder wettability of the first inclined portion is smaller than the solder wettability of the second inclined portion.

Electronic component, board unit, and information-processing device

A connector includes a plug connector and a jack connector configured to be connected with the plug connector. The plug connector includes a plug ground electrode, and a pair of plug terminals configured to transmit electric signals and having plug terminal connecting parts formed at first ends of the plug terminals. The jack connector includes a jack ground electrode, and a pair of jack terminals configured to transmit electric signals and having jack terminal connecting parts formed at first ends of the jack terminals. The jack terminal connecting parts are configured to be inserted between the plug terminal connecting parts and brought into contact with opposing surfaces of the plug terminal connecting parts when the jack connector is connected with the plug connector.

Connector with ground electrode terminals having different lengths

A male connector includes male connector modules placed in tiers and having respective first and second surfaces facing away from each other. The male connector modules each includes interconnection parts for electrical signal transmission on the first surface; a male connector ground part formed on the second surface so as to substantially cover the second surface; male connector contact parts provided at respective first ends of the interconnection parts on the first surface; male connector terminal parts joined to respective second ends of the interconnection parts on the first surface; and a male connector shield part provided on the side on which the male connector is configured to be connected to a female connector to be connected to the male connector ground and project relative to ends of the male connector contact parts in a direction in which the male connector is configured to be connected to the female connector.

Male and female connectors with modules having ground and shield parts

A photoelectric conversion module includes: a plurality of optical connectors each connectable to an optical communication path; an electrical connector connectable to an electrical communication path; a circuit board equipped with a light receiving and emitting element, the light receiving and emitting element converting an optical signal received by the optical connector into an electrical signal to be transmitted to the electrical connector and converting an electrical signal received by the electrical connector into an optical signal to be transmitted to the optical connector; and a waveguide optically connecting the optical connector and the electrical connector.

Photoelectric conversion module and photoelectric conversion device

A printed circuit board of a card edge connector type includes interconnections formed on a surface of a substrate to be electrically coupled to respective connecting terminals formed by electrolytic plating on an edge of the substrate, and connecting terminal-forming wirings being respectively in connection with the interconnections, when the connecting terminals are formed by the electrolytic plating. The interconnections are electrically isolated from the connecting terminal-forming wirings by process openings formed in the substrate.

Printed circuit board and manufacturing method therefor

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Shinagawa, Japan

Toshihiro Kusagaya