Kabushiki Kaisha Toshiba

Toshihiro Kato

Takashi Kimura

Hiroshi Matsumoto

Toshikazu Fukuda

Shinjiro Kojima

Kouji Araki

Takao Emoto

Masashi Otsuka

Yoshihito Fukasawa

Masamichi Shindo

A lead frame for a multichip type semiconductor device includes at least two square or rectangular islands each of which has four sides and is supported by island supports. Each of the sides of the islands is not parallel to each of the sides of the lead frame to reduce an unwanted bend of leads.

Lead frame having at least two islands and resin molded semiconductor

A packaged semiconductor device having a semiconductor chip mounted on a bed part, a first molded layer which seals the bed part and the semiconductor chip such that the back of the bed part is exposed, a heat sink under the exposed back of the bed part and with a prescribed distance between it and the back of the bed part a second molded layer which is formed such that it covers the outside of the heat sink and the first molded layer, and also fills the gap between the exposed surface of the bed part and the heat sink, and leads which are disposed such that they pass through the second molded layer and their ends are in the first molded layer, and which are connected via bonding wires to the internal terminals of the semiconductor chip.

Recessed thermally conductive packaged semiconductor devices

A wire bonding capillary for a bonding process comprises an elongated capillary body having an axial bore through the body for receiving a wire of a predetermined diameter to be bonded, and a working face on one end of the body for applying force to the bonding wire during the bonding process. The working face includes a first surface portion surrounding the bore and having a first radius of curvature, and a second surface portion adjacent to the first surface portion and having a second radius of curvature smaller than the first radius curvature.

Semiconductor bonding means having an improved capillary and method of

A highly magnetic Hall element comprising a substrate, a Hall element chip mounted on the substrate, and a magnetic member interposed between the substrate and the chip. The magnetic member increases the coercive force of the element, and is formed by laminating resin layers mixed with powder having a high magnetic permeability, one upon another, by stencil printing on that side of a semiconductor wafer in which a Hall element is mounted. The wafer and the magnetic member are diced together, to provide a Hall element chip. The magnetic member formed on the Hall element chip is adhered to substrate, with half-cured surface put in contact with the substrate.

Semiconductor hall element with magnetic powder in resin

An apparatus and a method for inspecting semiconductor devices, where a focused laser beam scans the semiconductor device, and the reflected beam thereof indicating height information of the reflection positions on the semiconductor device is detected for producing detected signals. The detected signals are compared with predetermined acceptance levels of height and distance.

Method and apparatus for inspecting semiconductor devices for their

Disclosed is a method of manufacturing a semiconductor device which comprises the step of forming grooves in the form of a grid on the upper surface of a semiconductor wafer formed with elements, the step of grinding or polishing the underside of the semiconductor wafer to thereby reduce the thickness thereof, the step of applying a first single-sided, self-adhesive sheet onto the underside of the semiconductor wafer, and the step of stretching the second single-sided, self-adhesive sheet so as to space out each other a multiplicity of semiconductor chips divided along the gridlike grooves of the semiconductor wafer. Each semiconductor chip is picked up and mounted on a lead frame.

Growing community of inventors

Chigasaki, Japan

Toshihiro Kato