Other

Tokyo Electron Limited

Sony Corporation

Kabushiki Kaisha Toshiba

Fujitsu Corporation

Nec Corporation

Sharp Kabushiki Kaisha Corporation

Sanyo Electric Co., Ltd.

Rohm Co., Ltd.

Nippon Telegraph and Telephone Corporation

Matsushita Electric Industrial Co., Ltd.

Oki Electric Industry Co., Ltd.

Hitachi, Ltd.

Mitsubishi Denki Kabushiki Kaisha

Panasonic Corporation

Toshihiro Itoh

Tadatomo Suga

Kenichi Kataoka

Kiyoshi Takekoshi

Shinji Iino

Shigekazu Komatsu

Shin Kamei

Hiroshi Fukuda

Naoki Fujiwara

Hiroshi Yamazaki

Masahiro Suzuki

Hiroshi Koizumi

Hideyuki Nosaka

Koichi Murata

Hiroyuki Uzawa

Ken Tsuzuki

Munehiko Nagatani

Hiroyuki Fukuyama

Masatoshi Akagawa

Takashi Saida

Kengo Horikoshi

Kiyofumi Kikuchi

Hiroto Kawakami

Nobuhiro Kikuchi

Hiroaki Katsurai

Tomoyoshi Kataoka

Shigeki Aisawa

Masafumi Nogawa

Yuriko Kawamura

Mikio Yoneyama

Hideto Nakazawa

Takao Waho

Yves Bouvier

An optical receiver is configured so as to be as less susceptible to noise as possible even in the case where high noise occurs inside an optical transceiver. The optical receiver includes a connection part that connects two photodiodes (PDs) constituting a dual photodiode and a transimpedance amplifier (TIA), wherein signal lines from the dual photodiode are surrounded by a conductor pattern that is not connected to each of the signal lines for each channel, and the conductor pattern is connected to a ground pattern on the transimpedance amplifier or a power source pattern for the PDs.

Optical receiver

An optical modulator driver circuit () includes an amplifier (, Q, Q, R-R), and a current amount adjustment circuit () capable of adjusting a current amount of the amplifier () in accordance with a desired operation mode. The current amount adjustment circuit () includes at least two current sources (IS) that are individually ON/OFF-controllable in accordance with a binary control signal representing the desired operation mode.

Optical modulator driver circuit and optical transmitter

The present invention relates to a semiconductor device in which electrodes formed on a semiconductor chip and electrodes formed on a wiring board are electrically connected via projecting elastic electrodes, and further relates to a mounting method of reducing a pressure applied to electrodes formed on a substrate or underlying wirings when a semiconductor chip and a wiring board are bonded.

Semiconductor device and process for manufacturing the same

At least one pair of electrode formed on a mounting surface of a stage is in contact with a conductive layer formed on a first surface of an inspection object, and an electrical path is formed between the both by using a fritting phenomenon.

Inspection method and inspection apparatus for inspecting electrical characteristics of inspection object

Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.

Inspection apparatus to break the oxide of an electrode by fritting phenomenon

Inspection method and inspection apparatus

The present invention relates to a high-reliable semiconductor device in which electrodes formed on substrates are prevented from deteriorating by sealing the electrodes with a frame member rather than a sealing material. The frame member in the present invention surrounds electrodes formed on the substrates. The inside of the frame member is vacuous or filled with a gas which does not react with the electrodes such as an inert gas and, thereby, the electrodes are prevented from deteriorating by attacks of oxygen or moisture.

High-reliable semiconductor device using hermetic sealing of electrodes

A method of mounting an electronic part on a board, in which an electronic part and a mounting board on which the electronic part is to be mounted are placed in a vacuum or inert atmosphere, and the electronic part is mounted on the board by bringing the bonding members of the electronic part and the board into contact with each other at normal temperature to thereby mount the electronic part on the board, the method comprising forming the bonding members of at least one of the electronic part and the board out of a solder material, and bringing the bonding members of the electronic part and the board into contact with each other without preprocessing the bonding surfaces of the bonding members.

Method of mounting an electronic part

An analog-to-digital conversion device includes quantization circuits and binarization circuits. Each quantization circuit samples an input analog signal at a predetermined period to obtain a sample, quantizes the sample into a (n&plus;1)-valued signal with n (n is an integer of two or more) thresholds, and outputs the quantized value. Each binarization circuit converts the (n&plus;1)-valued quantized value output from the quantization circuit into a binary code.

Analog-to-digital conversion device

Growing community of inventors

Chiba, Japan

Toshihiro Itoh