Kyocera Corporation

Casio Computer Co., Ltd.

Toshihiro Hashimoto

Ryuji Mori

Masaaki Miyahara

Naotomo Miyamoto

Masaharu Shioya

Tadao Yamamoto

Kaoru Saito

Atsushi Ogasawara

Yoshihiro Basho

Yukio Morita

Mitsuharu Sakai

Ryuuji Mori

Shou Yamasaki

Natsumi Ochi

A light emitting module and the like having a higher heat-dissipation effect includes a light emitting element mounting substrate, one or more light emitting elements, a heatsink including a through-hole in a position corresponding to a screw hole, a bolt screwed in the screw hole and fastening the heatsink and a metal plate or a full thread and a nut for the fastening. In the light emitting element mounting substrate, the metal plate, an insulating layer, and an electrode layer on which the one or more light emitting elements are mountable are stacked in this order. The metal plate includes a bottomed screw hole opened at a surface opposite to a surface in contact with the insulating layer. The bolt or the full thread and the nut have a heat conductivity equal to or greater than that of the metal plate.

Light emitting element mounting substrate, light emitting device, and light emitting module

A thin-film wiring substrate includes a base B including a ceramic substrate having an upper surface and a wiring conductor provided on the upper surface of the ceramic substrate; a bonding layer and a thin-film wiring layer laminated in order on the upper surface of the ceramic substrate; and a through conductor that passes through the bonding layer in a thickness direction and electrically connects the wiring conductor to the thin-film wiring layer, Wherein the bonding layer includes a core layer composed of a thermosetting resin and adhesive layers respectively laminated on an upper surface and a lower surface of the core layer, the adhesive layers being composed of a thermosetting resin having an elastic modulus smaller than that of the thermosetting resin constituting the core layer.

Thin-film wiring substrate and substrate for probe card

The invention relates to a reaction apparatus having an enhanced connection, and a fuel cell system and an electronic device that include such a reaction apparatus. A reaction apparatus () a reformer () in which a reforming reaction chamber () is formed, a CO remover in which a removing reaction chamber () where a chemical reaction is performed at a temperature lower than that in the reforming reaction chamber () is formed, and a connecting portion () having a communicating path that communicates between the reforming reaction chamber () and the removing reaction chamber (). The reformer () and the CO remover () are arranged spaced apart from each other, at least one of which () is configured by combining ceramic parts () and metal components (), and the ceramic parts () and the metal components () are connected with connecting members () interposed therebetween. The connecting members () have thermal conductivities higher than those of the ceramic parts ().

Reaction apparatus, fuel cell system and electronic device

The invention relates to a reaction apparatus that efficiently heats a reaction portion, and a fuel cell system and an electronic device that include such a reaction apparatus. A reaction apparatus () includes a reformer () in which formed are a reforming reaction chamber () and a reformer combustion chamber () that generates heat to be supplied to the reforming reaction chamber (), which () are adjacent to each other with a partition interposed therebetween; a CO remover () in which formed are a removing reaction chamber () where a chemical reaction is performed at a temperature lower than that in the reforming reaction chamber () and a remover combustion chamber () that generates heat to be supplied to the removing reaction chamber (), which () are adjacent to each other with a partition interposed therebetween; and a connecting portion () that connects the reformer () and the remover (). At least one of the reformer () and the CO remover () is configured by combining ceramic parts () and metal components (), and the ceramic parts () and the metal components () are connected with second members () interposed therebetween.

A reacting apparatus includes a reactor having a supply port and a discharge port, a first member connected to the surface of the reactor having a through hole associated with the supply port, and a second member connected to the surface of the reactor and having a through hole associated with the discharge port, a supply pipe connected to the supply port by way of the through hole of the first member, to supply a fluid before the reaction to the supply port, and a discharge pipe connected to the discharge port by way of the through hole of the second member, to discharge a fluid after the reaction from the discharge port. The supply port and discharge port include a portion covered by a surface of the first member and a portion communicating with the through hole of the first member. The discharge port includes a portion covered by a surface of the second member and a portion communicating with the through hole of the second member. A first opening of the through hole of the first member includes a portion covered by the surface of the reactor and a portion communicating with the supply port. A second opening of the through hole of the second member includes a portion covered by the surface of the reactor and a portion communicating with the discharge port.

Reacting apparatus, method of assembling reacting apparatus and reactor containing package

A multilayer circuit board comprising low inductance through-conductors is disclosed. The multilayer circuit board comprises first ceramic substrate means, first layered section means, and second ceramic substrate means that allow insulation layers to be substantially thin, a length of through-conductors to be substantially short, and low relative permittivity of the insulation layers compared to resin insulation layers. Thus, increases in operation frequency of the multilayer circuit board are possible.

Multilayer circuit board

There are provided a fuel reformer housing container and a fuel reforming apparatus, which are capable of maintaining a level of vacuum inside the fuel reformer housing container favorably and which have less power generation loss. A fuel reformer housing container includes a base having a concave portion for housing a fuel reformer in which reformed gas containing hydrogen gas is generated from fuel, a discharge pipe for communicating inside of the concave portion with outside thereof to discharge the reformed gas from the fuel reformer, a supply pipe for communicating inside of the concave portion with outside thereof to supply the fuel to the fuel reformer, and a gas adsorbent housed in the concave portion, for adsorbing gas in the concave portion.

Growing community of inventors

Kirishima, Japan

Toshihiro Hashimoto