Panasonic Intellectual Property Management Co., Ltd.

Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Toshihiko Tsujikawa

Akira Yamada

Yasutaka Tsuboi

Seiji Mizuoka

Kazuhiro Ikurumi

Kenji Okamoto

Masanori Yasutake

Takashi Iwahashi

Masao Nagamoto

Satoshi Adachi

Shinjiro Tsuji

Osamu Nakao

Masaharu Tsujimura

Atsushi Katayama

Satoshi Yamauchi

Yasuhiro Okada

Chihiro Igarashi

Masayuki Kajiyama

Suehiro Tanaka

Hiroshi Uchiyama

Akira Kameda

Yasuhiro Narikiyo

Tetsuro Ueno

Youichiro Ueda

Ken Ishimatsu

In a component press-bonding device that performs work related to component mounting on a board after a mark provided on a transparent end region of the board is recognized, an imaging camera provided with an imaging optical axis extending downwards, a light emitter that irradiates the end region with illumination light from above the board in a state where the mark is positioned within an imaging visual field of the imaging camera, and a light reflecting member that is provided below the imaging camera and reflects the illumination light, which is emitted by the light emitter and is transmitted downwards through the end region, back to the end region are included. The imaging camera images the mark under the illumination light, which is reflected by the light reflecting member and is transmitted upwards through the end region.

Component mounter and mounting board manufacturing method

A bonding apparatus includes: a backup unit including a light-transmissive transmission member having a support surface which supports at least a bonding region of a light-transmissive board from below; a pressure-bonding unit which presses an electronic component placed on the bonding region via a photo-curable adhesive agent; and a light irradiation unit which irradiates the supporting surface with light which promotes hardening of the adhesive agent. The electronic component is bonded to the board by pressing the electronic component mounted on a top surface of the adhesive agent in a state in which light from the light irradiation unit is incident upon the adhesive agent through the supporting surface. The bonding apparatus further includes a light distribution measuring unit which measures a distribution of light from the light irradiation portion in the supporting surface.

Bonding apparatus

A component crimping apparatus includes: a substrate holding part that holds a substrate of a transparent material, a component previously attached to each electrode of electrodes juxtaposed in an edge of the substrate through a photo-curable adhesive member; a supporting part that supports, by a transparent member, a region under the electrodes in the substrate; crimping tools that are juxtaposed over the transparent member and press the components to the substrate; and a light irradiating part that irradiates the adhesive member with light through the transparent member when the crimping tools press the components to the substrate. The crimping tools are configured movably in an arrangement direction of the crimping tools, the transparent member has a dimension capable of covering a whole region of a movable range of the crimping tools, and the light irradiating part irradiates a whole region of the transparent member with the light.

Component crimping apparatus

A component mounting apparatus crimps a component to a transparent substrate. The component is mounted on the transparent substrate through a photo-modifiable resin portion. The component mounting apparatus includes a receiving portion that receives a surface of the substrate by an upper surface of a transparent member, a pressing portion that presses the component against the substrate, an emission portion that emits light to the photo-modifiable resin portion through the transparent member, and a control portion that controls a timing when the pressing portion starts pressing of the component and a timing when the emission portion starts emission of the light so that the emission of the light is started a predetermined differential time earlier or later than the start of the pressing of the component.

Component mounting apparatus

A component crimping apparatus includes: a substrate holding part that holds a substrate of a transparent material, a component previously attached to each electrode of electrodes juxtaposed in an edge of the substrate through a photo-curable adhesive member; a supporting part having a base part with an optical path and a transparent member on the base part and connected to the optical path, and supports, by the transparent member, a region under a targeted electrode in the substrate; a crimping tool arranged over the transparent member and presses the component to the substrate; a light irradiating part that irradiates the adhesive member attached to the targeted electrode with light through the optical path; and a light shielding member that covers a portion in which the transparent member is not installed in an opening part of the optical path in the base part.

A component mounting apparatus that compresses a component to a transparent substrate on which the component is placed with a photocurable resin interposed therebetween. The component mounting apparatus includes: a receiving unit that includes a base member and a transparent member provided on an upper surface of the base member and receives a surface of the substrate, which is positioned below the component, on an upper surface of the transparent member; a pressing unit that presses the component against the substrate received by the receiving unit; and a light irradiation unit that irradiates the photocurable resin with light through the transparent member.

A component mounting apparatus includes a tape attaching unit, a component mounting unit and a component compression unit provided in this order. A time measuring unit measures time having passed after completion of predetermined work performed on all the substrates transferred to the tape attaching unit, the component mounting unit, and the component compression unit, respectively. When preparation for transferring the substrates to the tape attaching unit is not completed within a predetermined time after the start of measurement performed by the time measuring unit, the respective substrates, which wait in the tape attaching unit, the component mounting unit, and the component compression unit, are forcibly transferred to the downstream sides and predetermined work is performed on the respective substrates that are forcibly transferred to the component mounting unit and the component compression unit.

A component mounting apparatus includes a tape attaching unit, a component mounting unit and a component compression unit provided in this order. A time measuring unit measures time having passed after attachment of the adhesive tape in the tape attaching unit. When a predetermined time has passed after the start of measurement performed by the time measuring unit, the substrate, to which the adhesive tape of a measuring target is attached, is forcibly transferred to the downstream side, and the component is compressed to the substrate in the component compression unit.

A component mounting apparatus, an illuminating apparatus used in imaging in the component mounting apparatus and an illuminating method are provided which can support various recognition objects and can meet the requirement of downsizing by reducing the occupied space. In the component mounting apparatus which performs an operation for mounting a component on a board (), when illumination light is irradiated to the board () at the time of imaging with a board recognition camera (), and when the illumination light is irradiated from a light emitting panel () which is formed by laminating a light source portion () and a color liquid crystal panel () and in which a plurality of light emitting portions whose light emission states can be individually changed are orderly arranged, the irradiation range of the illumination light which is irradiated from the respective light emitting portions are made to be changed on the basis of the imaging object. Therefore, while the imaging can be made on conditions suitably corresponding to various recognition objects, the requirement of downsizing can be met by reducing the occupied space of an illuminating portion ().

Component mounting apparatus, illuminating apparatus used in imaging and illuminating method

An object of the present invention is to provide an inspection apparatus and an inspection method for precisely detecting an amount of misalignment of a component mounted on a panel through an adhesive which contains conductive particles. An inspection apparatus according to an implementation of the present invention detects an amount of misalignment, from a predetermined mounting position, of a component mounted on a surface of a panel through an ACF. The inspection apparatus includes: an infrared light illuminator which illuminates with an infrared light a panel recognition mark and a component recognition mark, the panel recognition mark being formed on the surface of the panel, and the component recognition mark being formed on a surface of the component; an IR camera which is provided opposite the infrared light illuminator in relation to the panel, and captures an image of the panel recognition mark and an image of the component recognition mark which are illuminated with the infrared light; and an amount of misalignment calculation unit which calculates, using the images captured by the IR camera, an amount of misalignment in a positional relationship between the panel recognition mark and the component recognition mark from a predetermined positional relationship, and an optical axis of the infrared light illuminator is inclined with respect to a normal found on the surfaces of the panel or the component.

Inspection apparatus and inspection method

Aims to provide an inspection apparatus which precisely detects an amount of misalignment of a component mounted on a panel through an adhesive which contains conductive particles. The inspection apparatus includes: an infrared-light illuminator () which is provided on a bottom-surface side of the panel and illuminates with light a panel recognition mark formed on the panel and a component recognition mark formed on the component; an IR camera () which is provided opposite to the illuminator () and captures images of the light-illuminated recognition marks; and an amount-of-misalignment calculation unit () which calculates, using the images captured by the camera (), an amount of misalignment of the recognition marks as an amount of misalignment in mounting position, wherein the illuminator () emits light in an amount which causes halation, the light having a wavelength that allows the light to pass through the panel and the component but does not allow or does not easily allow the light to pass through the conductive particles.

A bonding sheet applying apparatus of the present invention includes an applying stage for supporting a board, an applying unit having a bonding-sheet supplying device for supplying a bonding sheet to above the board supported by the applying stage and an applying head provided above the board so as to be movable up and down, for sequentially pressing the bonding sheet supplied by the bonding-sheet supplying device on a plurality of applying positions arranged on the board, a transfer device for transferring the applying unit, which has completed a bonding sheet applying operation for one of the applying positions, to a position upward above another applying position at which a bonding sheet applying operation has not been completed, and an inspection device for inspecting an applied state of the bonding sheet which has already been applied by the applying unit, while the applying unit is successively performing the bonding sheet applying operations.

Bonding sheet applying apparatus and method

Provided is a component bonding method with higher bonding precision in a process of bonding an electrode of a component to an electrode formed on a flat panel. A preliminary press bonding device includes: a control unit which includes a position displacement amount correction unit to which a position displacement amount after the press bonding process is fed back and which corrects the position displacement on the next component to be preliminarily bonded; and a component position determining unit which determines a position of the component using the fed back correction amount. On the other hand, a press bonding device includes a bonding recognition device for use in the recognition of positions of the electrodes on the flat panel and the component. The bonding recognition device includes a position displacement amount calculating unit which calculates the position displacement amount based on the recognized position information.

Component bonding method and component bonding device

A high-precision inspection apparatus and method for inspecting a large board with a line sensor camera, the coordinate positions of correction marks on a pair of holding members are read by the camera and compared with predetermined coordinates, and an amount of positional discrepancy of the board is computed. The board is adjusted according to the positional discrepancy, if necessary, and then scanned.

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Yamanashi, Japan

Toshihiko Tsujikawa