Shinkawa Ltd.

Toshihiko Toyama

Shinsuke Tei

Yuu Hasegawa

A manufacturing method of a semiconductor device includes: a first step of, after joining a wire to an electrode using a capillary, forming a wire part by moving the capillary to a third target point while feeding out the wire; a second step of forming a bent part by moving the capillary to a fourth target point while feeding out the wire; a third step of processing the bent part into a planned cut part by repeating lowering and raising of the capillary for multiple times; and a fourth step of cutting the wire at the planned cut part by raising the capillary with a wire clamper closed to form a pin wire.

Manufacturing method of semiconductor device and wire bonding apparatus

Provided is a wire tension adjuster () that adjusts tension (T) applied to a wire () of a wire bonding apparatus (). In the wire tension adjuster (), in a state in which the wire () is gripped by a wire clamper (), air is supplied to a wire tensioner () and a height position (H) of a tip () of a bonding arm () is detected, and a flow rate (G) of the air supplied to the wire tensioner () is adjusted based on the height position (H) detected, thereby adjusting the tension (T) applied to the wire ().

Wire tension adjustment method and wire tension adjuster

A wire bonding apparatus of an aspect includes: a clamp apparatus, having a pair of arms; a stage, moving the clamp apparatus in a horizontal direction; a rod member; a contact detection part, detecting contact between the rod member and the clamp apparatus; and a control apparatus, controlling opening and closing of the pair of arms and an operation of the stage and acquiring position information of the clamp apparatus. The control apparatus obtains an opening amount of the pair of arms based on position information of the clamp apparatus at a time when an outer side surface of a first arm contacts the rod member in a state where the pair of arms are closed and position information of the clamp apparatus at the time when the outer side surface of the first arm contacts the rod member in a state where the pair of arms are open.

Wire bonding apparatus, method for measuring opening amount of clamp apparatus, and method for calibrating clamp apparatus

Provided is a wire bonding apparatus including: a wire cutting unit configured to cut a wire by bonding the wire using a capillary and then moving the capillary and a first clamper upward while the first clamper remains closed; and a wire extending unit configured to extend a tail wire from a tip end of the capillary by moving the capillary upward and then moving the capillary and the first clamper upward in a state in which the first clamper is opened and a second clamper is closed. The wire bonding apparatus having such a structure effectively prevents the wire from falling out and bending.

Growing community of inventors

Tokyo, Japan

Toshihiko Toyama