Denso Corporation

Tohoku University

Chiba University

Toshihiko Takahata

Yasuki Furutake

Masayoshi Esashi

Shuji Tanaka

Akihiko Teshigahara

Takao Iwaki

Kenya Hashimoto

Eiichi Taketani

Haruhisa Koike

Takashige Saito

Masahiro Honda

Shinpei Taga

A method for manufacturing a semiconductor device includes: preparing a first substrate; forming a metal film having a Ti layer as the most outermost surface on one surface of the first substrate a metal film having a Ti layer as the outermost surface; patterning the metal film to form a first pad portion; preparing a second substrate; forming on one surface of the second substrate a metal film having a Ti layer as the outermost surface; patterning the metal film to form a second pad portion; vacuum annealing the first substrate and the second substrate to remove an oxide film formed on the Ti layer in the first pad portion and the second pad portion; and bonding the first pad portion and the second pad portion together.

Semiconductor device and method for manufacturing same

An optical lens device forms a condenser lens having a first lens of a positive focal length and a second lens of a negative focal length. The first and second lenses are stacked with their optical axis aligned. The first lens has a lens section, edge section and glass member having a linear expansion coefficient smaller than that of the lens section and the edge section to suppress shape change of the first lens due to temperature change of the first lens. The second lens, which is stacked with the first lens, is used for offsetting a change of the positive focal length generated in the first lens when the temperature varies. The glass member having a small linear expansion coefficient suppresses that shape change of the first lens which is not compensated by the second lens.

Optical lens device

A surface acoustic wave (SAW) sensor includes a surface acoustic wave material and a comb-teeth electrode. The surface acoustic wave material is to be arranged at a place where the surface acoustic wave material is distorted by physical quantity such as stress. The comb-teeth electrode is arranged on the surface of the surface acoustic wave material to excite a surface acoustic wave to the surface acoustic wave material. The surface acoustic wave material has a sapphire board and a ScAlN film arranged on a surface of the sapphire board.

Surface acoustic wave sensor

In manufacturing a sensor device, a sensor chip having a sensing portion on a surface thereof is mounted on one surface of a substrate, and a resin having a volatile property is arranged on the surface of the sensor chip, thereby covering the surface of the sensor chip. Then, the sensor chip and the substrate are sealed by a sealing member. After that, the sealing member is cured, and the resin is heated to be vaporized so that a void is formed between a covered portion in the surface of the sensor chip, which is covered by the sealing member, and the sealing member.

Sensor device and manufacturing method thereof

Growing community of inventors

Kariya, Japan

Toshihiko Takahata