Hitachi, Ltd.

Nof Corporation

Toshihiko Ohta

Hiroshi Fukuda

Shinichi Kazui

Yasuhiro Iwata

Kaoru Katayama

Mitsugu Shirai

Mitsunori Tamura

Yasuaki Takada

Ryohei Satoh

Kenji Kusumoto

Osamu Yamada

Takashi Inoue

Akio Hayashi

Hisashi Nagano

Fumiyuki Kobayashi

Masahide Okamoto

Kazuo Hirota

Yoshishige Murata

Takaji Takenaka

Osamu Miyazawa

Shigeru Kitano

Masao Sekibata

Yoshihiro Nishikawa

Minoru Tanaka

Seiji Tanaka

Hideki Watanabe

Akihiro Ando

Kazuo Matsuyama

Keiko Nakashige

Toshinori Ameya

Hirofumi Tsutsumi

Kenichiro Nakamoto

Akio Torii

Tomoyuki Hisada

Hiroshi Suzuki

A terminal system has a mass spectrometric for inspecting of dangerous substances is installed in an inspection area, and a support system for determining whether or not a dangerous substance is present and identifying the type of the substance, based on the mass spectrometric data on the target element that has been measured by the mass spectrometric, is installed in a security service enterprise's office. Both systems are connected to each other via a communication network so that they can exchange information. Thus, the support system can send the determination result of dangerous substances and a precautions guide to the terminal system via the communication network.

Security system and method of security service business

A method and apparatus for analyzing vapors generated from explosives in which vapors containing nitrogen monoxide and/or nitrogen dioxide are generated by decomposing explosives by increasing the temperature of the explosives, primary ions and neutral molecules are generated from air. The generated primary ions and the nitrogen monoxide and/or nitrogen dioxide contained in the generated vapors are allowed to react with each other in an area inhibited or prevented from being penetrated by the generated neutral molecules, and the nitrogen monoxide and/or nitrogen dioxide contained in the generated vapors is ionized. The ionized nitrogen monoxide and/or nitrogen dioxide is subjected to mass spectrometry, and an amount of the nitrogen monoxide and/or nitrogen dioxide contained in the generated vapors by decomposing the explosives is determined.

Method and apparatus for analyzing vapors generated from explosives

The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.

Process for manufacturing electronic circuits

Process for producing (meth)acrylate derivatives

A process for manufacturing electronic circuits, according to which soldering can be carried out without using flux by applying a metal surface treatment procedure which allows oxide film, organic matters, carbon or the like on the surface of metal to be easily removed without using a complex process nor unfavorably affecting electronic devices or circuit substrates. A process of connecting an electronic device and a circuit substrate by means of solder comprises the steps of irradiating the solder with a laser beam to clean the solder, aligning and mounting the electronic device on the circuit substrate, and hot-melting said solder in a low-oxygen content atmosphere to bond the electronic device and the circuit substrate.

In an electronic circuit device having an input/output pin junction electrode, in order to remarkably improve the junction characteristics such as wettability and junction strength and to drastically simplify the production process, in forming an electronic circuit board in which glass ceramics is used for board material and a wiring conductor and junction electrode wherein the Cu is sized to extend beyond the pin hole so that solder only contacts it and not the ceramic circuit board. The wiring and junction electrode is formed in a same process while forming a cover coat on the electrode using board material, and Au or Au--Ni laminated film is formed on this electrode as occasion demands, and then an electronic component is connected thereto using a solder such a Au--Sn or Au--Ge.

Electronic circuit device

Oxide films, and residues of organic matters, carbons, if any, are removed from a metal surface simply without using complicated steps and without giving adverse effects on electronic parts or electronic devices by irradiating the metal surface with a laser beam of lower energy level than energy capable of changing the metal surface structure, thereby cleaning the metal surface.

Process for making electronic device

Disclosed is an electronic circuit device in which the solder (14) connecting lead pins (6) to the ceramic substrate (2) has a melting point of 356.degree. C. to 450.degree. C. and has a tensile strength being low in such an extent that a thermal contraction stress generated in a cooling process of the solder (14) from the melting point thereof is low and the substrate (2) does not break. The solder (14) is a Au-Ge alloy containing 10-15 wt % of Ge. Electronic circuit devices, which employ the above solder (14) in the connections, are free from damages in the ceramic wiring substrate (2) due to the bonding. Further, when the electronic circuit device undergoes a series of assembly processes after the above bonding, such solder (14) does not melt, and wettability of such solder (14) is favorable.

Electronic circuit device provided with a ceramic substrate having lead

Before Au-plating onto the metallic surface of an electronic part, Ni-plating and then Co-plating are applied to form a primer coating for Au-plating. But in the steps of Ni and Co-platings, hydrogen gas produced during the plating is occluded into a plating layer. On the other hand, when a pellet connected onto an Au-plated metal, an Au-Si alloy is formed, but hydrogen gas in the plating layer remains as voids in the Au-Si alloy during a subsequent heating step of the electronic part, resulting in a serious defect. This invention of a plating method is characterized by annealing after Au-plating of an electronic part to eliminate the residual gas.

Plating process for an electronic part

Growing community of inventors

Hadano, Japan

Toshihiko Ohta