Toshiba Memory Corporation

Kioxia Corporation

Toshihiko Ohda

Masatoshi Fukuda

Tetsuya Kurosawa

A semiconductor manufacturing method of mounting a semiconductor chip or a stacked body of semiconductor chips on a support substrate placed on a stage, determines whether a predetermined condition is satisfied during a mounting processing of the semiconductor chip or the stacked body, evacuates, together with the support substrate, the semiconductor chip or the stacked body that has mounted on the support substrate before the determination when it is determined that the predetermined condition is satisfied, determines whether to resume the mounting processing of the semiconductor chip or the stacked body after the evacuation; and returns the evacuated semiconductor chip or the evacuated stacked body to a position before the evacuation and continuing the mounting processing when it is determined that the mounting processing is resumed.

Semiconductor manufacturing apparatus

A semiconductor manufacturing apparatus that sequentially stacks a plurality of semiconductor chips while aligning the plurality of semiconductor chips on a stage. A condition determinator determines whether an apparatus performing a mounting processing stops during a mounting processing of the plurality of semiconductor chips. An evacuation controller evacuates, when it is determined that the apparatus performing the mounting processing stops, a group of semiconductor chips that has been stacked before the determination. A resuming determinator determines whether to resume the mounting processing after it is determined that the predetermined condition is satisfied. A return controller returns the evacuated group of semiconductor chips to a position before the evacuation and continues the mounting processing when it is determined that the mounting processing is resumed.

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Yokkaichi, Japan

Toshihiko Ohda