Mitsubishi Denki Kabushiki Kaisha

Other

Renesas Technology Corp.

Toshihiko Noguchi

Toshio Komemura

Hiroshi Ohnishi

Takeshi Iwamoto

Shigeo Sasaki

Yoshihiko Kusakabe

Kouichirou Tsutahara

Kazuo Yoshida

Nobuyuki Kosaka

Yoshimi Kinoshita

Kenichiro Yamanishi

Taizo Eshima

Tomoyuki Kanda

Hideki Komori

Katsuhisa Kitano

Toru Takahama

Masakazu Taki

Yasuhiro Kimura

Minoru Hanazaki

Kenji Shintani

Hirotoshi Ise

Mutumi Tuda

Toshiki Oono

Masato Toyota

Keiichi Sugahara

Toshiki Ono

Shiro Yamasaki

Toshihiro Yamashita

A high-frequency current detector of a plasma processing apparatus detects a high-frequency current produced when high-frequency power in the range that does not cause generation of plasma in a chamber is supplied from a high-frequency power supply source to the chamber. The high-frequency current detector outputs the detected high-frequency current to a computer. The computer compares the high-frequency current received from the high-frequency current detector with a reference high-frequency current. When the received high-frequency current matches the reference high-frequency current, the computer determines that the process performance is normal. Otherwise, the computer determines that the process performance is abnormal. In this way, high-frequency characteristics specific to the apparatus are detected and the process performance are evaluated based on the detected high-frequency characteristics.

Plasma processing apparatus capable of evaluating process performance

A defect inspecting device for a wafer is built in a positioning device for positioning a wafer , as a substrate to be processed, in a semiconductor manufacturing process. Light is irradiated on the wafer held on a vacuum holding base while rotating the wafer at least one rotation from a position where the wafer is positioned and the scattered light is received. An operation unit and a control unit judge that if the intensity of the scattered light exceeds a predetermined threshold, a defect is detected on the wafer

Defect inspecting device for substrate to be processed and method of manufacturing semiconductor device

A conveyor is provided that is capable of preventing degradation in quality of an article being conveyed. The conveyor includes a conveyor belt; and a rolling element rotatably provided at a surface of the conveyor belt. A plurality of rolling elements are provided along a conveying direction. The conveyor further includes a holder provided at the surface of the conveyor belt, for rotatably holding the corresponding rolling element. The rolling element has a ball shape.

Conveyor, method for conveying a semiconductor wafer, and method for manufacturing a semiconductor device

It is an object of the present invention to obtain a vacuum chucking which can vacuum suck a wafer even if dusts attach thereon. The main body of vacuum chuck (101) has a plurality of block grooves (125) on the surface on which the wafer (1) is sucked and fixed, in which vacuum evacuation paths (105) each for vacuum evacuating each block groove (125) are provided for each block groove (125). When the wafer (1) is sucked and fixed under low pressure, even if the degree of vacuum in one of the block grooves (125) decreases due to attachment of dusts on part of the suction surface, or the like, the wafer (1) can surely be sucked and held.

Semiconductor producing apparatus, and wafer vacuum chucking device, gas

It is an object of the present invention to obtain a vacuum chucking which can vacuum suck a wafer even if dusts attach thereon. The main body of vacuum chuck (101) has a plurality of block grooves (125) on the surface on which the wafer (1) is sucked and fixed, in which vacuum evacuation paths (105) each for vacuum evacuating each block groove (125) are provided for each block groove (125). When the wafer(1) is sucked and fixed under low pressure, even if the degree of vacuum in one of the block grooves (125) decreases due to attachment of dusts on part of the suction surface, or the like, the wafer (1) can surely be sucked and held.

Semiconductor producing apparatus comprising wafer vacuum chucking device

A semiconductor wafer cleaning apparatus provided with an ice making unit and a jet nozzle for ejecting fine ice particles against a wafer held within a cleaning vessel includes an exhaust chamber having an expanded portion and connected to the cleaning vessel. Curved guide plates extend from cleaning vessel into the exhaust chamber equidistant from each other into the expanded portion to guide the jet particles into the expanded portion. A flow regulator plate having a multitude of inverted frustum-shaped tapered holes regulates the jetted particles within the cleaning bath in accordance with the downward flow direction. Further, the upward flow from the exhaust chamber along the side walls is caught by stopper plates and exhausted via exhaust ports.

Semiconductor wafer cleaning apparatus

Growing community of inventors

Hyogo, Japan

Toshihiko Noguchi