Sharp Kabushiki Kaisha Corporation

Toshihiko Nakagawa

Katsunori Nagata

Shinichi Sugimoto

Masaaki Ooga

Yoshihiro Izumi

A mounting apparatus includes: a heater head for bonding a liquid crystal display and a flexible printed circuit board by thermocompression; a cylinder as a heater head driving means for driving heater head to compress the liquid crystal display and flexible printed circuit board by a prescribed load; and a control mechanism as a stretch amount controlling means for adjusting a load change per unit of time after the heater head starts compressing the flexible printed circuit board by the cylinder as well as a time at which a required load is attained to control the stretch amount of the flexible printed circuit board by thermocompression. Preferably, the mounting apparatus is provided with a mechanism which performs measurement after preliminary bonding and which performs regular bonding while controlling based on the obtained information.

Mounting apparatus and mounting method

A wiring substrate is arranged so that a first periphery electric wiring and a second periphery electric wiring are patterned on an active matrix substrate, and a TCP as a electronic component is provided on a portion of the patterned electric wiring. The first periphery electric wiring and the second periphery electric wiring are formed by including a metal thin film and a transferred metal film. Further, in the portion where the TCP is provided, the first periphery electric wiring and the second periphery electric wiring either have a monolayer structure with one of the metal thin film and the transferred metal film, or have a lamination structure with both of the metal thin film and the transferred metal film. On this account, connection failure can be prevented on a low resistance wiring substrate.

Growing community of inventors

Matsuzaka, Japan

Toshihiko Nakagawa