Panasonic Intellectual Property Management Co., Ltd.

Toshihiko Nagaya

Masahiro Kihara

Masahiro Taniguchi

Koji Sakurai

Satoshi Furuichi

Hiroyuki Fujiwara

Tetsuya Tanaka

Shinji Yamamoto

Ryouji Eguchi

Yoichi Makino

Shuuichi Kubota

Masahiko Akasaka

Shigeo Ogata

Yoshinori Konda

Tadashi Endo

Hiroshi Okamura

Yasuyuki Ishitani

Syozo Kadota

Kimio Iizuka

Makoto Nakashima

Gouki Chiba

Tomoo Hama

Kimio Ilzuka

There is provided an inspection apparatus which inspects a board on which a mounting apparatus mounts a component, including a detecting unit (an inspection process unit and an inspection camera) that detects inspection information including a positional deviation amount of the component which is mounted on the board, a determining unit that determines whether the detected positional deviation amount falls within a predetermined first range, a transmission unit that transmits the detected positional deviation amount to the mounting apparatus; and a determination unit that determines whether to transmit the detected positional deviation amount to the mounting apparatus. In addition, in a case where it is determined that the positional deviation amount falls within the first range and it is determined that a predetermined condition is satisfied, the determination unit suspends transmission of the positional deviation amount to the mounting apparatus.

Inspection apparatus, component mounting system, and component mounting method

In component mounting for mounting a pin connecting component having a pin on a board having a through-hole electrode, a solder paste is printed on the through-hole electrode through a screen mask having an opening corresponding to the through-hole electrode, a flux is transferred onto the pin by holding the pin connecting component and immersing the pin into a flux tank filled with the flux, and the pin onto which the flux is transferred is inserted into the through-hole electrode on which the solder paste is printed to mount the pin connecting component on the board.

Component mounting method, component mounting system, and manufacturing method of component mounting board

There is provided a component mounting method for mounting an electronic component provided with a connecting pin on a board having a through-hole, including inserting the pin of the electronic component into an inner hole filled with solder paste at a first electrode provided in the through-hole to execute a component mounting operation of lowering the pin to a predetermined mounting height position and pulling up the pin once inserted and lowered into the inner hole in the component mounting operation to a preset intermediate height position.

Component mounting method and method for manufacturing component-mounted board

A method includes a component mounting step of mounting components on a board; a positional deviation amount acquisition step of acquiring a positional deviation amount of each of the components mounted on the board, from a corresponding normal position; and a correction value calculation step of calculating a feedback correction value for correcting a mounting operation in the component mounting step, based on the acquired positional deviation amount. In the correction value calculation step, the feedback correction value is calculated based on the positional deviation amount of each of the components mounted in each of a plurality of division areas on the board, for each of the plurality of division areas, and in the component mounting step, the mounting operation is corrected by using the feedback correction value of the plurality of division areas in which the components are mounted.

Component mounting using feedback correction

A mounting board manufacturing system includes: a component placer including a placing head and a placing head mover that moves the placing head to a target position for placing the component on the board; an inspector that inspects a placement position of the component by imaging the board; a correction value calculator that calculates a correction value for correcting the target position; a target position calculator that calculates the target position using the correction value; and a correction value changer that changes a latest correction value used immediately before stopping an operation of the component placer to a correction value different from the latest correction value when the operation is resumed.

Mounting board manufacturing system and mounting board manufacturing method

A component mounting system includes a plurality of component supply devices (tape feeders) each of which supplies components from a component supply position and a component mounter that sucks the components from the component supply position of each of the plurality of component supply devices with a plurality of nozzles (suction nozzles) to install the components onto a board. A suction position correction value for correcting a suction position shift from a regular suction position when each of the nozzles sucks the components from the component supply position is calculated. The suction position is corrected based on the suction position correction value to suck the components. A suction position shift amount from the regular suction position is calculated. A feeder evaluation value, which is a sum of the suction position correction value and the suction position shift amount, is calculated for each of the plurality of component supply devices.

Component mounting system

There is provided a mounting board manufacturing system including: a component placer including a placing head having a holding tool that holds a component and places the component on a board, and a placing head mover that moves the placing head to a target position for placing the component held by the holding tool at a component placement position of the board; an inspector that inspects a placement position of the component placed on the board by imaging the board on which the component is placed by the component placer; a correction value calculator that calculates a correction value for correcting the target position using an inspection result, and updates the correction value using a new inspection result when the new inspection result is obtained; a target position calculator that calculates the target position using the correction value; and a correction value changer that changes a latest correction value used immediately before stopping an operation of the component placer to a correction value different from the latest correction value when the operation is resumed after the component placer stops the operation and the component is to be placed by the component placer.

A substrate conveyance mechanism that includes conveyance units and a working area length change part to easily change the types of substrates to allow substrates of different lengths to be selected to mount electronic components onto the substrate. The conveyance units include a working area for substrates having different length that are conveyed from a stand-by area, an area length of the working area that is variable in accordance with the length of the substrate, and a stand-by unit corresponding to a stand-by area for the substrate to be carried in to the working area. The working area length change part changes an interval between a commonly used first pulley and one of a plurality of second pulleys selectively used in accordance with the area length of the working area by changing a belt winding path of a conveyance belt wound on the pulleys in the working unit.

Substrate conveyance mechanism and component mounting method

An electronic component mounter having a mounting head includes: a board transporter (transport mechanism) that transports a board with a transport belt supporting the board; a recognizer (a board recognition camera or a height sensor) that is provided in the mounting head and recognizes a state of a front surface of the transport belt; and a determiner (wear determiner) that determines a degradation state (wear degree) of the transport belt based on the state of the front surface of the transport belt recognized by the recognizer.

Electronic component mounter and electronic component mounting system

A component mounting apparatus includes a carriage that holds a part feeder for supplying a component in a state of being attached to a base and attaches the part feeder to the base in a state of being coupled to the base; a mounting head that mounts the component to a substrate after the component is taken out of the part feeder held by the carriage coupled to the base through an opening formed between the base and a cover member formed so as to cover an upward side of the base; and a shutter moved from an opened position in which the opening is opened to a closed position in which the opening is closed when the carriage is separated from the base.

Component mounting apparatus

A substrate conveyance mechanism includes conveyance units and a clamp mechanism. The conveyance units include a working unit corresponding to a working area for types of substrates having different sizes of length taken as objects, an area length of the working area being variable in accordance with the sizes of length, and a stand-by unit corresponding to a stand-by area for the substrate to be carried-in to the working area. The clamp members include commonly used first clamp members and second clamp members which are attachable and detachable and are selectively used in accordance with the sizes of length of the plurality of types of substrates in addition to the first clamp members.

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Fukuoka, Japan

Toshihiko Nagaya