Senju Metal Industry Co., Ltd.

Toshihiko Mutsuji

Hideki Nakamura

Takashi Nauchi

Ryoichi Suzuki

Takashi Sugihara

Tsutomu Hiyama

Kazuya Kitazawa

Hirokazu Ichikawa

Kaname Nagata

Takashi Usuba

In conventional fluid discharge devices, a discharge head used should be increased in size according to increase in size of a workpiece such as silicon wafer. However, if the discharge head increases in length, a deformation amount of a mask used for discharging the fluid on the workpiece increases, thereby the discharging amount varies. Discharging the fluid in a reciprocating manner is performed using a fluid discharging device including a head unit having a width shorter than a length of the workpiece. A suction port having opening portions each having a slit shape are disposed on the both sides of the discharge nozzle in a vicinity of the discharge nozzle.

Method for discharging fluid

Fluid discharge device

A defect may occur in which as the amount of fluid discharged by a fluid discharge device decreases, a mask is not filled with the fluid even when the fluid is discharged. In order to fill a workpiece with the fluid, it is necessary to replace air in the workpiece corresponding to a discharge part with the fluid. The air in the workpiece is removed in advance, thereby filling the workpiece with the discharged fluid. A fluid discharge device in which, at one end of a discharge head, a suction port for sucking air in the mask on the workpiece, and a fluid discharge device having a discharge nozzle formed thereon for discharging the fluid are formed is used.

Fluid discharge device, fluid discharge method, and fluid application device

The semiconductor wafer conveying tool which can realize the uniform heating to a surface of a semiconductor wafer when heating the semiconductor wafer is a semiconductor wafer conveying tool which holds the semiconductor wafer having a predetermined diameter to convey it wherein the tool is provided with a main body having an opening with a diameter which is larger than a diameter of the semiconductor wafer, and at least three supporting members each having a predetermined length, containing plural pins which are arranged corresponding to the diameter of the semiconductor wafer and being configured to be a holding mechanism for holding the semiconductor wafer concentrically at a projection position from an inner periphery portion of the main body around the opening, as shown in FIG.

Semiconductor wafer conveying tool

A positioning jig has a circular part with a diameter that is identical with a diameter of a semiconductor wafer and knock-pins for connecting a periphery of base plate around an opening in a base plate of a conveying tool for a semiconductor wafer. These knock-pins are respectively provided in four blades protruded from predetermined positions of the circular portion at least three directions. When adjusting the projection positions of supporting plates, the knock-pins are fitted into the opening of the base plate of the conveying tool for the semiconductor wafer. The supporting plates moves so that the knock-pins come into contact with an outer edge of the circular part of the prepared positioning jig. The adjusted supporting plates are then fixed on the base plate. The semiconductor wafer is mounted on the adjusted and fixed supporting plates so that the semiconductor wafer is positioned.

Positioning jig and method of adjusting position

To enable the circuit board to be fixed on a predetermined position and to be conveyed to the solder processing portion. Conveying hooksthat hold the printed circuit board Wtherebetween, conveying chainsthat drive so that the conveying hooksare movable from a heater partto a solder bath, first framesA that guide the conveying chainsalong the heater part, second framesB that guide the conveying chainalong the solder bath, and an absorbing memberthat is provided between each of the first framesA and each of the second framesB and absorbs an expansion and contraction based on difference of any thermal expansion between the framesA,B and the conveying chainsare provided. Since the absorbing memberabsorbs the expansion and contraction based on difference of any thermal expansion between the framesA,B and the conveying chains, it is possible to prevent the conveying chainsfrom being deviated from the framesA,B. This enables the printed circuit board Wto be fixed on the predetermined position and to be conveyed to the heater partand the solder bath

Automatic soldering device and carrier device

In a conventional reflow furnace equipped with a fume removal device, fume solids adhere to the inside of piping connecting it to the removal device, and a great amount of trouble was required for removal of the fume solids. The present invention maintains a fumes-containing gas discharged from a furnace at a temperature of at least the liquefication temperature of the fumes until the gas reaches a removal device so that fume solids do not adhere to the inside of piping. A removal device installed on a reflow furnace according to the present invention comprises an elongated-hole filter and a labyrinth filter, and fumes are completely removed by both filters.

Growing community of inventors

Tokyo, Japan

Toshihiko Mutsuji