Momentive Performance Materials Japan LLC

Toshihiko Matsukura

Masanari Shimakawa

Hiroyoshi Iijima

Hiroyoshi Lijima

Provided is a resin composition with high dielectric insulation properties that has a dielectric constant of at least 20, a dielectric tangent of 0.1 or less, outstanding insulation properties (at least 10&#x3a9;&#xb7;cm), and for use in electrical power, communication devices, and the like. A resin composition with high dielectric insulation properties comprises a constituent (A), which is 100 parts by mass of a polymer material that acts as a dispersion medium for constituent (B), and a constituent (B), which is 100-3000 parts by mass of a perovskite complex oxide powder comprising secondary particles formed by the mutual bonding of primary particles through sintering and represented by the formula: ABO.

Resin composition with high dielectric insulation properties

A silicone rubber composition contains: (A) 100 parts by weight of a dimethylpolysiloxane sequestered at both ends of the molecular chain thereof by a dimethylvinylsiloxy group; (B) 5 to 100 parts by weight of a dry silica, treated by a vinyl group-containing organosilicon compound and having a specific surface area of 50 m/g or more; (C) 5 to 100 parts by weight of a copolymer of dimethylsiloxane and methylhydrogen siloxane; (D) platinum or a platinum compound as a curing agent in an amount of 1 to 1,000 ppm as platinum atom to the total amount of component (A) and component (C); and (E) triazole or a derivative of triazole, in an amount of 1 to 10,000 ppm to the total amount of (A) component and (C) component.

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Joso, Japan

Toshihiko Matsukura