Kyocera Corporation

The Furukawa Electric Co., Ltd.

Japan Aviation Electronics Industry, Limited

Nec Corporation

International Superconductivity Technology Center

Tohoku Electric Power Company, Inc.

Other

Central Research Institute of Electric Power Industry

Sumitomo Electric Industries, Limited

Research Development Corporation of Japan

Toshihiko Maeda

Yoshinori Mizusawa

Osamu Hashiguchi

Masahiro Yamada

Hisashi Ishida

Kazuomi Sato

Hiroyuki Tsuzuki

Masahiro Yamauchi

Shoji Tanaka

Shin-ichi Koriyama

Hisao Yamauchi

Kazuhiro Sakuyama

Isao Takahashi

Ataru Ichinose

Tsuyoshi Masumoto

Teruo Izumi

Kunihide Shikata

Katsuya Hasegawa

Yuh Shiohara

Hiroyuki Nakae

Shin Kamiyamane

Toshio Hirai

Satoru Nagase

Akira Oyobe

Katsuyuki Yoshida

Shigenobu Asada

Kouzou Makinouchi

Toru Izumi

An optical apparatus includes an element substrate on whose surface an optical element is provided; a wiring board disposed so as to face the optical element; a sealing member and a conductive member provided between the element substrate and the wiring board. The sealing member surrounds and hermetically seals the optical element. The conductive member electrically connects the optical element and the wiring board. The wiring board has a light-transmitting area transmitting light to the optical element.

Optical apparatus, sealing substrate, and method of manufacturing optical apparatus

The present invention relates to a microelectromechanical device having a simple structure in which strains of the semiconductor substrate can be reduced. Both a semiconductor substrateand a second substrateare disposed to face a first main surfaceof the first substrateand connected to the first main surfaceof the first substrate. With this structure, no internal line or side surface line is necessary, and the structure of the first substratecan be simplified. The length of the line can be decreased to decrease the resistance of the line, and good electrical characteristics can be achieved at low energy consumption. The strains in the semiconductor substratecan also be reduced.

Microelectromechanical device and method for manufacturing the same

An electronic component sealing substrate capable of configuring an electronic apparatus in which the influence of electromagnetic coupling and radio frequency noises between an electrical connection path and a micro electronic mechanical system is suppressed is provided. An electronic component sealing substrate () for hermetically sealing a micro electronic mechanical system () of an electronic component () that includes a semiconductor substrate (), the micro electronic mechanical system () formed on a main face of the semiconductor substrate (), and an electrode () electrically connected to the micro electronic mechanical system (), includes an insulating substrate () that has a first main face joined to the main face of the semiconductor substrate () so as to hermetically seal the micro electronic mechanical system (), and a wiring conductor () that has an end extending to the first main face of the insulating substrate () and is electrically connected to the electrode () of the electronic component (), and the end of the wiring conductor () is positioned outside a joined portion of the main face of the semiconductor substrate () and the first main face of the insulating substrate ().

Electronic component sealing substrate for hermetically sealing a micro electronic mechanical system of an electronic component

A metal substrate for an oxide superconducting wire, which comprises a polycrystalline metal substrate with a rolled aggregate structure having a {100} plane which is parallel to the rolled surface and a &#x3c;001&#x3e; axis which is parallel to the rolling direction, and an oxide crystal layer comprising an oxide of the polycrystalline metal and formed on a surface of the polycrystalline metal substrate, wherein at least 90% of grain boundaries in the oxide crystal layer have an inclination of 10&#xb0; or less, and at least 90% of the {100} plane of the oxide crystal layer make an angle of 10&#xb0; or less with the surface of the polycrystalline metal substrate.

Method of manufacturing a metal substrate for an oxide superconducting wire

In a ZIF connector having first and second connectors, the first connector includes an operating member rotatably held by a first insulator portion holding first contacts arranged adjacent to one another in a predetermined direction. The second connector includes a floating member held by a second insulator portion to be rotatable and slidable in the predetermined direction. The floating member has a first and a second surface which face the first contacts and the operating member, respectively, in a mutually fitted state of the first and the second connectors. Second contacts have one parts held by the first surface and arranged adjacent to one another in the predetermined direction. The floating member is rotated in a first rotating direction to bring the second contacts into contact with the first contacts when the operating member is rotated in the mutually fitted state.

ZIF connector in which a position of a contact is automatically adjusted during a connecting operation

In a connector comprising a housing () and a contact () held by the housing, the contact is brought into contact with a connection object under a pressing force obtained by operating an operating member (). An elastic member () elastically deformable is interposed between the contact and the operating member. The operating member has a first cam surface () for applying the pressing force to the contact with elastic deformation of the elastic member and a second cam surface () for releasing the pressing force. An insulating actuator () cooperating with the contact may be interposed between the contact and the elastic member. The elastic member may be a leaf spring member held by the actuator.

Electrical connector having a mechanism for supplementing spring characteristics of a contact

There is provided an insertion and withdrawal connector apparatus in which a plurality of connectors can move only in a range of capable of engaging and separating with and from a plurality of mating connectors within a connector receiving body. A connector receiving body ( ) has a pair of parallel frames ( ), a pair of frame blocks ( ) positioned at both end portions, and a plurality of partition members ( ). One connector ( ) and one mating connector are received in each of a plurality of space portions, that is, receiving chambers partitioned by a pair of frames, a pair of frame blocks, and a plurality of partition members. Each of the partition members has a pair of lances ( ) having a spring characteristic and each of the connectors has a pair of interlocking groove portions ( ) on both side surfaces. The lance ( ) interlocks with the interlocking groove portion on one of the side surfaces in the connector, and the lance ( ) interlocks with the interlocking groove portion on the other of the side surfaces in the connector. Each of the connectors has a convex portion ( ) at an upper end portion on one of the side surfaces and at a lower end portion on the other of the side surfaces, and each of the convex portions interlocks with each of the partition members.

INSERTION AND WITHDRAWAL CONNECTOR APPARATUS, STRUCTURE OF REMOTE CONTROLLING ENGAGEMENT AND SEPARATION THEREOF, AND CONNECTING FRAME BLOCK STRUCTURE FOR INSERTION AND WITHDRAWAL CONNECTOR APPARATUS OR THE LIKE

There is provided an insertion and withdrawal connector apparatus in which a plurality of connectors can move only in a range of capable of engaging and separating with and from a plurality of mating connectors within a connector receiving body. A connector receiving body ( ) has a pair of parallel frames ( ), a pair of frame blocks ( ) positioned at both end portions, and a plurality of partition members ( ). One connector ( ) and one mating connector are received in each of a plurality of space portions, that is, receiving chambers partitioned by a pair of frames, a pair of frame blocks, and a plurality of partition members. Each of the partition members has a pair of lances ( ) having a spring characteristic and each of the connectors has a pair of interlocking groove portions ( ) on both side surfaces. The lance ( ) interlocks with the interlocking groove portion on one of the side surfaces in the connector, and the lance ( ) interlocks with the interlocking groove portion on the other of the side surfaces in the connector. Each of the connectors has a convex portion ( ) at an upper end portion on one of the side surfaces and at a lower end portion on the other of the side surfaces, and each of the convex portions interlocks with each of the partition

A connector engaging/disengaging mechanism comprises a frame member (,) and connector carriers (,) for engaging and disengaging first connector (,) mounted on a printed circuit board (,) fixed onto the frame (,) and second connectors (,) held on said connector carriers (,). The frame member is provided with guide grooves (,) in which the connector carriers (,) are received to be slidable in an engaging direction (A) and a disengaging direction (B). Each of the connector carriers (,) has connector holding portions for holding the second connectors and an operating portion (,) for moving the connector carrier to engage and disengage the second connectors (,) to and from the first connector (,). When the operating portion (,) is manually operated to move the connector carrier in the engaging direction, the second connectors (,) are connected with the first connectors (,). When the connector carrier is moved in the disengaging direction, the second connectors (,) are disconnected from the first connectors (,).

Connector engaging/disengaging device accommodating a plurality of connector pairs to mate with each other

A thermally conductive compound which comprises 15 to 60 volume % of thermoplastic carrier resin consisting of a copolymer of a plasticizer with ethylene or of a polymer of the plasticizer, polyethylene and the copolymer, 40 to 85 volume % of thermally conductive filler particles dispersed in the carrier resin, and 0.5 to 5 weight % (for the filler particles) of a dispersing agent having (a) hydrophilic group(s) and (a) hydrophobic group(s). The thermally conductive compound has a high thermal conductivity and a plasticity in the range of temperatures of &minus;40 to 50&deg; C., and when it is interposed between an insulator body and a semiconductor element mounted thereon or between the semiconductor element and a cap, the heat generated by an operation of the semiconductor element is rapidly transferred and the thermal stress caused by the difference of coefficients of thermal expansion between the semiconductor element and the insulator body or cap is absorbed and relieved to cause no phase separation between them. The semiconductor device using the thermal compound, accordingly, is highly reliable.

Thermally conductive compound and semiconductor device using the same

There is provided an insertion and withdrawal connector apparatus in which a plurality of connectors can move only in a range of capable of engaging and separating with and from a plurality of mating connectors within a connector receiving body. A connector receiving body (,) has a pair of parallel frames (,), a pair of frame blocks (,) positioned at both end portions, and a plurality of partition members (,). One connector (,) and one mating connector are received in each of a plurality of space portions, that is, receiving chambers partitioned by a pair of frames, a pair of frame blocks, and a plurality of partition members. Each of the partition members has a pair of lances (,) having a spring characteristic and each of the connectors has a pair of interlocking groove portions (,) on both side surfaces. The lance (,) interlocks with the interlocking groove portion on one of the side surfaces in the connector, and the lance (,) interlocks with the interlocking groove portion on the other of the side surfaces in the connector. Each of the connectors has a convex portion (,) at an upper end portion on one of the side surfaces and at a lower end portion on the other of the side surfaces, and each of the convex portions interlocks with each of the partition members.

Insertion and withdrawal connector apparatus, structure of remote controlling engagement and separation thereof, and connecting frame block structure for insertion and withdrawal connector apparatus or the like

There is provided an insertion and withdrawal connector apparatus in which a plurality of connectors can move only in a range of capable of engaging and separating with and from a plurality of mating connectors within a connector receiving body. A connector receiving body (1) has a pair of parallel frames (3), a pair of frame blocks (4) positioned at both end portions, and a plurality of partition members (5). One connector (10) and one mating connector are received in each of a plurality of space portions, that is, receiving chambers partitioned by a pair of frames, a pair of frame blocks, and a plurality of partition members. Each of the partition members has a pair of lances (5f, 5g) having a spring characteristic and each of the connectors has a pair of interlocking groove portions (10g) on both side surfaces. The lance (5f) interlocks with the interlocking groove portion on one of the side surfaces in the connector, and the lance (5g) interlocks with the interlocking groove portion on the other of the side surfaces in the connector. Each of the connectors has a convex portion (10d) at an upper end portion on one of the side surfaces and at a lower end portion on the other of the side surfaces, and each of the convex portions interlocks with each of the partition members.

Insertion and withdrawal connector apparatus, structure of remote

A method for manufacturing a Pb-based Cu oxide superconductor. The method includes the steps of mixing powders of a raw material containing at least Pb, Sr, Ce, M, where M is at least one element selected from the group consisting of Y, La, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Yb, and Lu, and Cu in a proportion to have the composition of the formula (I),

Method of manufacturing an oxide superconductor

An oxide superconductor which has a composition expressed by the following general formula and whose crystal structure is 1222-phase structure.

Oxide superconductor having the formula Pb.sub.a (M.sub.1-x-y Ce.sub.x

A superconducting material is disclosed which includes oxides of metals having the following composition:

Growing community of inventors

Tokyo, Japan

Toshihiko Maeda