Nitto Electric Industrial Co., Ltd.

Nitto-Denko Corporation

Toshihiko Kitaura

Kouichi Takashima

Masayuki Sakamoto

Kiyotaka Hirakawa

Matao Mizota

Akio Nakamura

Kazunori Mizutani

Minoru Noo

A method of applying a mold-releasing agent to the molding surfaces of a mold after cleaning the surface. This method involves inserting a mold-releasing sheet between said molding surfaces of a mold coating the molding surfaces with the mold releasing agent by heating and pressing the mold-releasing sheet to cure it, and removing the cured sheet from the molding surfaces of the mold. This mold-releasing sheet is composed of (i) uncured rubber, (ii) a curing agent, and (iii) a mold releasing agent. The uncured rubber can be selected from a group consisting of chloroprene rubber, butadiene rubber, nitrile rubber, ethylene-propylene terpolymer rubber, styrene-butadiene rubber, polyisoprene rubber, butyl rubber, silicone rubber, and fluoridated rubber.

Method for applying mold-releasing agent onto mold surfaces using a

A mold-cleaning composition and sheet comprising an uncured rubber composition comprising an uncured rubber and a curing agent, and at least one removal aid selected from imidazoles and imidazolines, and a method for cleaning a mold using the mold-cleaning sheet, are disclosed. The mold-cleaining sheet is suitably used to clean molding surfaces of a mold or to remove contaminants such as burr formed at peripheries thereof in the continuous production of semiconductor devices by transfer molding.

Mold cleaning composition, sheet for cleaning mold, and method for

A method of assembling split, hollow package sections housing an electronic element, having an internal lead wire and having external lead wires extending outwardly therefrom, wherein the package sections are adhesively secured together with external lead wires interposed between the mating surfaces by a fibrous sheet carried by the mating surface of the base portion with the sheet impregnated with a partially-cured plastic polymer.

Hollow cavity package electronic unit

Growing community of inventors

Saga, Japan

Toshihiko Kitaura