Kyocera Corporation

Toshihiko Kitamura

Mahiro Tsujino

Takeo Satake

In an embodiment of the present disclosure, a wiring base includes an insulative base, a signal conductor, a first lead terminal, a first ground conductor, and a second lead terminal. The insulative base includes a first face and a second face. The signal conductor is provided on the first face. The first lead terminal is provided on the signal conductor. The first lead terminal extends in a first direction and includes a portion projecting from the insulative base in plan view toward the first face. The first ground conductor is provided on the second face. The second lead terminal is provided on the first ground conductor. At least a part of the second lead terminal overlaps the first lead terminal in the plan view toward the first face.

Wiring base and electronic device

A dielectric substrate has a first surface including a first terminal connector and a second terminal connector located along a first side surface. A recess is between the first terminal connector and the second terminal connector. The recess has a first inner surface continuous with the first terminal connector, a second inner surface continuous with the second terminal connector, and a bottom surface between the first inner surface and the second inner surface. The first terminal connector has first wettability with a bond on its surface, and a first region has second wettability with the bond on its surface lower than the first wettability.

Wiring board, electronic component package, and electronic apparatus

A dielectric substrate has a first surface including a first terminal joint and a second terminal joint arranged along a first side surface. A first lead terminal is bonded to the first terminal joint with a bond. A second lead terminal is bonded to the second terminal joint with a bond. The first lead terminal includes a first base bonded to the first terminal joint and a first lead extending from the first base. The second lead terminal includes a second base bonded to the second terminal joint and a second lead extending from the second base. The first lead terminal includes the first base having a larger thickness than the first lead.

A wiring board that includes a first dielectric layer having a rectangular plate form, a ground conductor wiring, a pair of signal conductor wirings, a ground conductor layer, and a second dielectric layer having a rectangular plate form. The ground conductor wiring is positioned on a first face of the first dielectric layer. The pair of signal conductor wirings carrying out signal transmission is positioned on the first face of the first dielectric layer. The ground conductor layer is positioned on a second face of the first dielectric layer. A first end portion of the signal conductor wiring extends to a first side of the first face. The region of the ground conductor layer where the first end portion of the signal conductor wiring is positioned in plan view is cut away inwardly from a first side of the second face opposing the first side of the first face.

Wiring board, optical semiconductor element package, and optical semiconductor device

A semiconductor element housing package includes a rectangular ceramic package having a recess section on an upper surface thereof or a penetration section from the upper surface to a lower surface thereof, and a heat radiation plate attached to the lower surface of the ceramic package, extending from one side toward the other side of the lower surface up to a region in which the heat radiation plate overlays the recess section or the penetration section, which plate has a width on a side of the other side which is narrower than that on a side of one side. The package includes a plurality of first lead pins disposed on the lower surface of the ceramic package along the other side, and a pair of second lead pins disposed on the lower surface of the ceramic package on both sides of a narrow portion of the heat radiation plate.

Growing community of inventors

Omihachiman, Japan

Toshihiko Kitamura