Hitachi Chemical Company, Ltd.

Hitachi, Ltd.

Toshihiko Kato

Yasuo Miyadera

Masami Yusa

Fumio Inoue

Nobuo Miyadera

Katsuji Shibata

Mitsumasa Kojima

Hidetaka Satou

Masatoshi Yoshida

Shigeki Ichimura

Hidekazu Matuura

Masahiro Kawakami

Hideyuki Hashimoto

In the present invention, an insulating film adhesive material is attached onto the wirings in the form of a tent so that an empty space communicating with a vent hole is provided. Use of this chip-supporting substrate makes it possible to produce small-sized semiconductor packages preventive of package cracking and having a high reliability, because the function of the vent hole is not damaged and also gases and water vapor which are generated from the insulating film adhesive material at the time of reflowing can be driven off surely outside the package.

Chip supporting substrate for semiconductor package, semiconductor device, and method for manufacturing them

An alignment film for liquid crystal is provided which comprises a polyimide comprising a repeating unit of the general formula (I): ##STR1## wherein n is an integer of from 2 to 16 and R.sup.1 represents a divalent organic group. This polyimide is obtained for example, from a reaction between ethylene glycol bis(trimellitate dianhydride) and 4,4'-diaminodiphenyl ether. This polyimide or a varnish of a precursor thereof is coated on a plate, and dried to obtain an alignment film for liquid crystal, which stably exhibits a high pretilt angle, irrespective of curing temperatures. The present invention further provides a liquid crystal-sandwiched panel and a liquid crystal display module prepared using the alignment film as well as a material for the preparation of the alignment film.

Alignment film for liquid crystal, liquid crystal-sandwiched panel,

Disclosed herein are processes for the preparation of polyimide-isoindroquinazolinediones and precursor thereof. These polymers are useful as heat-resistant electric insulation materials, surface coating films for electronic instrument parts and especially suitable for manufacturing a photoresist. The above precursor is produced by reacting a an alkylenebistrimellitate dianhydride, a diaminoamide compound and the other amine. The precursor is readily dehydrated and ring-closed to produce polyimide-isoindroquinazolinedione, which is often conveniently conducted by producing a varnish of the precursor, applying it onto adequate substrates such as silicon wafers, glass plates, metal plates, etc. and then subjecting the coated film to dehydration. The resulting films have excellent physical properties such as good adherence, high tensile strength, low elasticity, etc.

Processes for preparation of polyimide-isoindroquinazolinedione and

A heat curable resin composition comprising (A) a polyimide and (B) a polymaleimide is excellent in heat resistance and suitable for use as a film-shaped adhesive, a laminate or a molding material.

Heat curable resin composition

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Tsukuba, Japan

Toshihiko Kato