Hitachi Chemical Company, Ltd.

Toshihiko Ito

Takao Hirayama

Hiroaki Hirakura

Toshizumi Yoshino

Kuniaki Sato

Kenji Suzuki

Yoshiyuki Mukoyama

Atsushi Takahashi

Kazunori Yamamoto

Ken Nanaumi

Akinari Kida

Koji Morita

Kengo Kobayashi

Masayuki Mogami

Kiyoshi Hirosawa

Shinji Ogi

A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can give a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.

Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film

A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can gives a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.

Photo curable resin composition and photosensitive element

A photosensitive resin composition comprising (A) a photosensitive resin having one or more carboxyl groups, (B) a special epoxy curing agent, and (C) a photopolymerization initiator is excellent in adhesiveness, heat resistance, resistance to PCT and developability and suitable as a solder resist composition.

Photosensitive resin composition

Provided is bonding film for printed circuit boards which is resistant to cracking even when bent with a small radius of curvature, has a sufficient mechanical strength even in its semi-cured state so that the handling may be facilitated, is not undesirably brittle and therefore does not produce undesired debris when cut, and is flexible and flame retardant at the same time. The bonding film may consist of (i) high polymer epoxy resin; (ii) denatured polyamide obtained by reacting epoxy resin and polyamide; (iii) polyfunctional epoxy resin; and (iv) curing agent. Preferably, the denatured polyamide includes a polyalkylene-glycol residue or a polycarbonate-diol residue. Preferably, the high polymer epoxy resin is produced by the polymerization of bifunctional epoxy resin and bifunctional phenol resin, and has a weight averaged molecular weight equal to 50,000 or higher.

Bonding film for printed circuit boards

An epoxy-modified polyamide resin obtained by reacting a diisocyanate(A) with at least one member selected from the group consisting of a dicarboxylic acid and a tricarboxylic acid anhydride (B) in a nitrogen-containing aprotic solvent to form a polyamide resin intermediate and reacting this polyamide resin intermediate with an epoxy resin (C) in the nitrogen-containing aprotic solvent. This epoxy-modified polyamide resin has a high molecular weight and can provide a film with excellent heat resistance and flexibility, and its composition can be used as a coating material, adhesive or such in the form as it is.

Epoxy-modified polyamide resin

An amide group-containing epoxy resin obtained by reacting an epoxy resin with an amide group-containing diisocyanate obtained by reacting a diisocyanate with a dicarboxylic acid gives a uniform cured article showing high adhesiveness and is usable as an adhesive, a coating composition, and the like.

Amid group-containing diisocyanates and amide group-containing epoxy

Amide group-containing diisocyanates and amide group-containing epoxy

A coating resin composition comprising a chlorinated polyolefin-containing polymer obtained by polymerizing a monomer blend containing 0.01 to 5% by weight of an unsaturated organic silane compound in the presence of a chlorinated polyolefin resin having a chlorine content of 50% by weight or less can yield molded articles or coatings excellent in adhesiveness, gloss, resistance to gasoline, resistance to alcohol, or the like.

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Ibaraki-ken, Japan

Toshihiko Ito