Fujitsu Corporation

Fujitsu Vlsi Limited

Toshihiko Iryu

Hiroyuki Sugamoto

Hidenori Nomura

Toshiaki Murao

Takeo Kikuchi

A wafer-scale semiconductor integrated circuit device includes a wafer, a plurality of chips formed on the wafer, each of the chips having an internal logic circuit, interconnection lines mutually connecting the chips, and clamping circuits which are coupled to chips from among the chips which are located at a periphery of an arrangement of the chips and which prevent the interconnection lines related to the chips located at the periphery from being in a floating state.

Wafer-scale semiconductor integrated circuit device and method of

A wafer-scale integrated circuit includes a plurality of functional blocks, a plurality of respectively corresponding connection terminals being provided in each of the functional blocks. Respectively corresponding pluralities of layered wirings and bonding wires interconnect predetermined, respective ones of said corresponding connection terminals in parallel for supplying power source and other voltages in common to the plurality of functional blocks. The parallel interconnections by the layered wirings and bonding wires, due to different, respective failure modes, affording increased reliability.

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Kawasaki, Japan

Toshihiko Iryu