Ajinomoto Co., Ltd.

Toshihiko Hatajima

Kenichi Mori

Takashi Ito

Koji Takeuchi

Tadahiko Yokota

Kiyomiki Hirai

Tatsuya Hattori

Tatsuru Tabohashi

Naoya Yamato

Shuji Mochizuki

Kiyonori Furuta

Yasuaki Seki

Hiroyuki Sakata

A gelling agent for an oil, which contains at least one compound (A) and at least one compound (B), and a gel composition containing the gelling agent and an oil: wherein Ris a straight chain or branched chain, saturated or unsaturated hydrocarbon group having 7 to 17 carbon atoms, Ris a straight chain or branched chain, saturated or unsaturated hydrocarbon group having 1 to 26 carbon atoms, Rand Rare each independently a straight chain or branched chain, saturated or unsaturated hydrocarbon group having 1 to 26 carbon atoms, and Ris a straight chain or branched chain, saturated or unsaturated hydrocarbon group having 7 to 17 carbon atoms.

Gelling agent for oil

Herein is disclosed an insulating resin composition for a multilayer printed-wiring board, comprising two or more kinds of resins which are different in etching rate by plasma treatment and which are not compatible with each other, so that the surface of the resulting insulating layer can be made uneven by the plasma treatment, whereby the bonding strength of the conductor layer to the said resulting insulating layer can be ensured, and heat resistance and electrically insulating properties required can be satisfied.

Insulating resin composition for multilayer printed-wiring board

There is provided a process for producing an N-acyl amino acid amide, comprising a condensation reaction of an N-acyl amino acid with an amine and/or an ammonia, preferably a primary amine, a secondary amine and/or an ammonia under dehydration in the presence of a boron compound as the catalyst under coexistence of an alcohol as the auxiliary solvent, at a high yield for a short time. A medium for hylotropic dehydration such as hydrocarbon compounds may be used in the reaction.

Process for production N-acyl amino acid amide

Epoxy resin compositions which contain (1) an epoxy resin which has two or more epoxy groups in its molecule, (2) a polythiol compound which has two or more thiol groups in its molecule and (3) an accelerator which is (i) a solid dispersion-type amine adduct latent curing accelerator or (ii) the product of a reaction between a compound which contains one or more isocyanate groups in its molecule and a compound which has at least one primary and/or secondary amino group in its molecule, exhibit excellent curability at relatively low heating temperatures as well as a long working life.

Epoxy resin and polythiol composition

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Kawasaki, Japan

Toshihiko Hatajima