Fujitsu Ten Limited

Denso Ten Limited

Toshihiko Fujii

Takashi Ohta

Shinichi Sugiura

Yasuaki Takeda

Katsufumi Morimune

Toshimasa Akamatsu

Nobutaka Watanabe

An electronic device includes: a circuit board; a case within which the circuit board is provided and which has a plurality of first contact parts to contact with the circuit board; a cover which has a plurality of second contact parts to contact with the circuit board; a hook part which is provided to one of the case and the cover; and a receiving part which is provided to other of the case and the cover and which corresponds to the hook part, and the hook part engages with the receiving part, whereby the cover is fitted onto the case and the plurality of first contact parts of the case and the plurality of second contact parts of the cover hold and fix the circuit board interposed therebetween.

Electronic device

In a state where an engaging tab and a tab receiver are engaged with each other, the engaging tab is elastically deformed and thus a first end of a second portion applies a force to the tab receiver, the force applied toward a first side of a case.

Fixing structure

A die bonding apparatus for die bonding at least two members, which are heated in a heat treatment furnace, comprising a first member having a surface to be die bonded on which solder is disposed and a second member disposed to face the first member in a state in which the solder disposed on the surface of the first member to be die bonded is interposed therebetween, and a base portion for mounting the first member thereon in a predetermined position, wherein the base portion has a temperature distribution so that a temperature of a vicinity of a central portion in a predetermined direction of the base portion is higher than that of a vicinity of an end portion of the base portion in a state in which heating is effected in the heat treatment furnace to, so that it is possible to suppress the occurrence of bubbles in the solder.

Die bonding apparatus

A die bonding apparatus includes a first member having a surface to be die bonded on which solder is disposed, a base portion for mounting the first member thereon in a predetermined position, a second member disposed in an inclined manner with respect to the first member and faces the solder, and an inclination attenuating member for inclining and holding the second member with respect to the first member to attenuate an angle of inclination &thgr;1 of the second member with respect to the first member in a state where the solder is melted. In a state where the first, second members, and the solder are heated and the solder is melted, die bonding is effected while the inclination attenuating member gradually attenuates the angle of inclination &thgr;1, so that it is possible to suppress the occurrence of bubbles in the solder.

Growing community of inventors

Kobe, Japan

Toshihiko Fujii