Hitachi Chemical Company, Ltd.

Hitachi, Ltd.

Dai Nippon Toryo Co., Ltd.

Toshihiko Akahori

Shigeo Tachiki

Masahiko Hiro

Yasushi Kurata

Masato Yoshida

Toranosuke Ashizawa

Keizo Hirai

Kouji Yamazaki

Yuji Kobayashi

Takuro Kato

Syoichi Sasaki

Miho Kurihara

Yoichi Kimura

Hiroshi Nishizawa

Kenji Suzuki

Hajime Kakumaru

Takao Hirayama

Yoshitaka Minami

Jin Amanokura

Hiroaki Hirakura

Ken Sawabe

Michiko Natori

Toshihiko Shiotani

Katsunori Tsuchiya

Tsutomu Satoh

Tomoaki Aoki

Yoshihisa Nagashima

Toshiya Takahashi

Ritsuko Obata

Fumihiko Ota

Takuya Kajiwara

Yuhji Yamazaki

Sigeo Tachiki

An object of the present invention is to provide a process for producing a printed wiring board, which is advantageous not only in that the reduction in size and increase in density of the wiring board are achieved and further the steps are simplified, but also in that the connection reliability of mount parts and the yield are improved, and a photosensitive resin composition used in the process. The present invention is directed to a process for producing a printed wiring board, comprising the steps of: (i) forming a solder resist on a wiring board having a circuit; (ii) laminating a preliminarily molded layer of a photosensitive resin composition on the solder resist; (iii) subjecting the layer of the photosensitive resin composition to exposure and development to form a resist pattern of the photosensitive resin composition; (iv) subjecting the entire surface of the resultant board to electroless plating, and (v) stripping the layer of the photosensitive resin composition, wherein the steps are conducted in this order, as well as a photosensitive resin composition and the layer thereof used in the process.

Process for producing printed wiring board and photosensitive resin composition used in the same

A CMP abrasive comprising a cerium oxide slurry containing cerium oxide particles, a dispersant and water, and a liquid additive containing a dispersant and water; and a liquid additive for the CMP abrasive. A method for polishing a substrate which comprises holding a substrate having, formed thereon, a film to be polished against a polishing pad of a polishing platen, followed by pressing, and moving the substrate and the polishing platen while supplying the above CMP abrasive in between the film to be polished and the polishing pad to thereby polish the film to be polished. The CMP abrasive and the method for polishing can be used for polishing a surface to be polished such as a silicone oxide film or a silicon nitride film without contaminating the surface to be polished with an alkali metal such as sodium ions and with no flaws, and the CMP abrasive is excellent in storage stability.

CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate

A photosensitive resin composition comprising (A) a resin having an amide bond, an oxyalkylene group and a carboxyl group, (B) a photopolymerizable compound having an ethylenically unsaturated group and (C) a photopolymerization initiator has an alkali developability, good sensitivity and photocurability, an efficient pattern formability by photolithography, a good application workability to a film and is capable of producing cured products having good folding endurance, solder reflow heat resistance, solvent resistance, bondability and nonflammability and suitable for producing a photosensitive element, a photosensitive laminate and a flexible printed circuit board.

Photosensitive resin composition and application of its photosensitivity

A color filter having excellent optical properties can be produced in high yield using a photo-sensitive composition comprising (a) a resin, (b) one or more pigments, (c) one or more monomers, and (d) a photoinitiator to form a film on a substrate, followed by exposure to light and development using a specific developer containing ##STR1## wherein R.sup.1 is C.sub.1-19 alkyl; and R.sup.2 is C.sub.1-19 alkylene.

Production of color filter

In a colored image forming material comprising (a) a copolymer containing a carboxyl group, (b) a coloring agent, (c) a monomer containing at least one photopolymerizable unsaturated bond in the molecule, (d) a photoinitiator and, when required, (e) a specific sensitizer, the dispersion stability of pigment and the optical sensitivity can be considerably increased by using a specific copolymer of styrene derivative-maleic acid derivative as component (a) and specific benzoimidazole or benzothiazole as component (e), and a photosensitive element or a color filter with distinguished optical characteristics can be obtained therefrom.

Colored image forming material and color filter obtained therefrom

A negative type photosensitive electrodepositing resin composition comprising (a) a polymer obtained by neutralizing a copolymer of acrylic or methacrylic acid and having an acid number of 20 to 300 with a basic organic compound, (b) a non-water-soluble monomer having two or more photopolymerizable unsaturated bonds in the molecule, (c) a non-water-soluble photoinitiator, and (d) a benzotriazole derivative having one or more carboxyl groups, is effective for giving electrodeposited films with a low voltage or low electric current in a short time, and usable for forming resist patterns with high degree of resolution.

Negative type photosensitive electrodepositing resin composition

A photosensitive resin composition comprising (a) a compound having a group unstable to acids, (b) a compound generating an acid when exposed to actinic light, and (c) a benzotriazole derivative is suitable for forming a positive type photosensitive anionic electrodeposition coating material and is usable for producing printed circuit boards.

Positive type photosensitive anionic electrodeposition coating resin

A resin composition comprising (A) a copolymer obtained by copolymerizing (a) acrylic acid and/or methacrylic acid, (b) at least one compound having an unstable group against an acid such as t-amyl acrylate, t-amyl methacrylate, etc. and (c) a copolymerizable monomer such as n-butyl acrylate and (B) a photoacid generator is effective for providing an electro-deposition bath good in water dispersion stability and an electrodeposited film having high sensitivity and high resolution.

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Hitachi, Japan

Toshihiko Akahori