Sony Corporation

Nec Corporation

Toshihide Ueno

Masahiko Shimizu

Tomomi Kume

Takanori Shimizu

Masao Kinoshita

The present invention relates to a camera module in which a thin camera module can be realized at a low cost and an electronic device. The camera module includes a lens unit that stores a lens that condenses light on a light receiving surface of an image sensor; a rigid substrate on which the image sensor is disposed; and a flexible substrate electrically connected with the rigid substrate, wherein in the case where the light receiving surface of the image sensor locates at the top, the lens unit, the flexible substrate, and the rigid substrate are disposed in this order from the top.

Camera module and electronic device

Improvement of signal integrity, a size reduction of a device, and the like are realized. A semiconductor integrated circuit sectionand an optical wiring sectionare electrically connected to each other by a connection sectionprovided between a face of the semiconductor integrated circuit sectionand a face of the optical wiring sectionfacing each other. An electrical wiringis provided in an optical wiring section. The electrical wiringof the optical wiring sectionfunctions as a global wiring electrically connecting between a plurality of circuit blocks CB provided in the semiconductor integrated circuit section

Growing community of inventors

Kanagawa, Japan

Toshihide Ueno