Kabushiki Kaisha Toshiba

Tokyo Shibaura Denki Kabushiki Kaisha

Toshiharu Sakurai

Kenji Takahashi

Yasuhiro Yamaji

Seiichi Hirata

Masamichi Shindo

Hideo Taguchi

Nobu Izawa

Hiroshi Harada

Junichi Asada

Susumu Harada

Kazuichi Komenaka

Koichi Teshima

Masakazu Yamada

Mitsugu Miyamoto

Takemi Abe

Masashi Muromachi

Atsushi Sonoda

Kazuo Numajiri

Tetsuo Ito

Haruyuki Shimakawa

Akinori Nakatsuru

First and second frame bodies are used to fabricate a semiconductor device. The first frame body includes a die pad. The second frame body only includes a plurality of leads. The die pad is depressed by a predetermined amount which is equal or greater than the thickness of a semiconductor chip to be mounted on the die pad. The two frame bodies are welded, and wire bonding and cutting of the leads are performed.

Semiconductor device having an improved lead arrangement and method for

A metal cover plate for covering a semiconductor chip mounted on a package base plate comprises an upper central portion, a flange extending outwardly from outer edges of the central portion, and a side wall portion extending perpendicularly from the flange along all sides thereof. The central portion has at least one portion in parallel with the package base plate. The central portion is formed with reinforcing portions in the form ridges of gable roofs and valleys in cross section, formed along diagonal lines of the central portion or in the form of a ridge or rib substantially semicircular in cross section extending upwardly or downwardly along each diagonal line. Deflection of the top wall portion of the package during pressure application is thus be minimized.

Cover plate for semiconductor devices

A method of sealing a semiconductor device with resin includes the steps of coupling the tie bar of a lead frame to a heat sink; die bonding a semiconductor chip to the surface of the heat sink; wire bonding and electrically connecting the semiconductor chip to leads of the lead frame; placing the heat sink on the bottom surface of a cavity of a lower mold, putting an upper mold on the lower mold, and pressing down the coupling portion between the heat sink and lead frame toward the bottom surface by using a pressure member mounted on the upper mold; and injecting melted resin within the cavity defined by the upper and lower molds, and hardening the resin.

Method of sealing semiconductor device with resin by pressing a lead

A semiconductor device of a type having a pin grid array, comprises a printed circuit board and a planar metal stem with a plurality of through holes. The stem is made of metal having a coefficient of thermal expansion .alpha.s. The printed circuit board has a predetermined wiring pattern on its upper surface and is made of a material having a maximum coefficient .alpha.p in the widthwise direction. The printed circuit board is superposed over the upper surface of the metal stem. A plurality of lead pins have upper portions inserted into the through holes of the stem and board and are in alignment with each other when the board and the stem are superposed one upon another. Connecting members connect the upper portions of the lead pins with their corresponding wiring patterns. In the semiconductor device, the absolute value .DELTA..alpha. of the difference between the maximum coefficient .alpha.p of the board and the coefficient .alpha.s of the stem (.DELTA..alpha.=.alpha.p -.alpha.s) is less than or equal to '1.52.times.10.sup.-4 /L' (.DELTA..alpha..ltoreq.1.52 .times.10.sup.-4 /L).

Semiconductor device

In a lead frame having a number of square dimples arranged on the rear side of a bed portion in a lattice form of a pitch t, each side of the square dimples is disposed to form a predetermined angle relative to either of X--Y axes of the lattice extending in lateral and longitudinal directions of the bed portion. The square dimples may be provided at entire intersecting points between two sets of lines extending in parallel with the X and Y axes, or every other intersecting points of the same, so that an equal pitch of t or 2t is maintained between the dimples arranged in X and Y directions.

Lead frame

This invention provides a semiconductor device comprising a die-pad supported by tie-bars, a semiconductor element mounted on the die-pad with the die-pad, tie-bars and semiconductor element being encapsulated in a moulding compound, means for defining an aperture which extends in to the moulding compound so as to expose a portion of a tie-bar.

Slits are formed in the metal wiring layer formed on the semiconductor of a semiconductor device to be resin sealed thereby to divide the total width of the metal wiring layer into divided widths each of the order of 30 to 40 .mu.m, whereby stress generated in the metal wiring layer is absorbed and prevented from causing cracking, deformation, and other defects. The slits are arranged to be substantially parallel to the peripheral side of the device which is most closely located to the wiring part.

Semiconductor device of resin-seal type

What is disclosed is a semiconductor apparatus comprises a semiconductor element, a pair of in-line electrode leads having a mounting island supporting the semiconductor element and a molded housing of resin compound. The electrode leads and mounting island are made of an alloy having a thermal expansion coefficient in the range of about 7.times.10.sup.-6 1/C.degree. to about 14.times.10.sup.-6 1/C.degree.. Thus, when the device is subjected to temperature variations, there is little warpage or cracking in the device.

Fe-Ni-Cu leadframe

An electronic part composed of an alloy comprising, as a basic metal or metals, Cr and Zr with the total amount thereof being between 0.3 and 2.0% by weight (provided that the amount of Cr is 1.5% by weight or less and that of Zr is 1.0% by weight or less) and Cu as a balance, the surface of said part having been coated with Sn. The electronic part according to the present invention is excellent in the wetting property of a solder, weather resistance of a solder and bonding property to Au and Al.

Growing community of inventors

Yokohama, Japan

Toshiharu Sakurai