Matsushita Electric Industrial Co., Ltd.

Toshiharu Okada

Izuru Nakai

Shinji Nakamura

Toshihiro Nishii

Hideaki Mukae

Masaru Higashionji

Akio Murata

Yuji Uesugi

Shigeru Yamane

Takaaki Maegawa

Hidenori Hayashi

Toru Fujimoto

Haruhiro Yuki

Ken Muneyuki

Shoro Mochida

Katsuhiro Kuriyama

Kazuyoshi Yamaguchi

When drilling a multi layered sheet-like material, drilling is first made with pulses having energy that generates an inter-layer pull-off force smaller than the adhesion force between the layers. Then pulses with higher energy are radiated for trimming the shape of the holes, and thus through-holes having a desired shape are drilled without causing delamination of the layers.

Laser drilling

In a laser processing apparatus including a laser oscillator for emitting laser light onto a workpiece through an f&thgr; lens for drilling a hole in the workpiece, a wavelength selector for passing only a light ray having a specific wavelength is disposed between the laser oscillator and the workpiece.

Laser processing apparatus and method

In manufacturing a double-layered or a multi-layered printed wiring board, a layer of metamorphic substance, which is created by transmuting a substrate material, is formed on an inner wall of a hole during a perforation process of the substrate utilizing radiation energy. The layer of metamorphic substance prevents conductive materials constituting electrical connection means formed on the inner wall of the hole from dispersing over a surface of the substrate or permeating into the substrate.

Printed wiring board, and method and apparatus for manufacturing the same

In manufacturing a double-layered or a multi-layered printed wiring board, a layer of metamorphic substance, which is created by transmuting a substrate material, is formed on an inner wall of a hole during a perforation process of the substrate utilizing radiation energy. The layer of metamorphic substance prevents conductive materials constituting electrical connection formed on the inner wall of the hole from dispersing over a surface of the substrate or permeating into the substrate.

Printed wiring board

A head base has at least one head chip fixed thereto. A position of the head chip is adjusted to a predetermined position by applying a laser beam to the head base to cause plastic deformation of the head base. Appropriate laser radiation conditions are set depending upon a necessary amount of positional adjustment of the head chip fixed to the head base.

Rotary magnetic head having head base which is bent along thermal plastic deformation line

A laser processing method is to be executed by a pair of turning mirrors of which axes of rotation are arranged in mutually twisted positions, a flat field lens for converging a laser beam reflected on the pair of turning mirrors on a specified plane, and an X-Y stage which carries and moves thereon an object to be processed to which the laser beam is applied, the object having a plurality of rectangular planar areas of the same shape as each other in a matrix form and adjoining the rectangular planar areas while not overlapping the rectangular planer area nor leaving any space therebetween. The method includes a first step of executing application of the laser beam of which a laser applying position is determined by the pair of turning mirrors and the flat field lens to one of the rectangular planar areas of the object, a second step of moving an X-axis stage or a Y-axis stage of the X-Y stage after the first step is completed, a third step of executing application of the laser beam to one of the rectangular planar areas which is adjacent to the rectangular planar area to which the latest application of the laser beam is performed, and a fourth step of executing the second and third steps alternately to process the plurality of rectangular planar areas of the object.

Laser processing method

A laser processing apparatus includes a laser beam source, a focusing optical system for focusing a laser beam from the source as a processing laser beam to a surface of an article, an illuminating optical system using a laser beam of the same frequency as that of the processing laser beam as an illumination laser beam for illuminating the surface of the article, and a photographing device for detecting the illumination laser beam reflected from the article through the focusing optical system to thereby monitor a position to be processed. Since the laser beam of the illuminating optical system is of the same frequency as that of the processing beam chromatic aberration is prevented. This allows increased monitoring accuracy so that an article such as copper foil can be processed by a laser beam with an accuracy of 10 microns to monitor and correct a processing position.

Apparatus for laser processing and monitoring

A laser processing method is carried out by a laser apparatus comprising: an oscillator; a spatial filter comprising a first convex lens, a member having a pinhole portion, and a second convex lens on an optical axis of the laser beam from an oscillator; two galvano-mirrors; and an f.theta. lens. The method includes: emitting a laser beam from the oscillator, focusing the laser beam by the first convex lens, removing non-focusing components in a peripheral portion of a focusing spot performed by the first convex lens by passing the laser beam which has passed through the first convex lens through the pinhole portion, a focal distance of the first convex lens being set so that a focusing diameter of the laser beam at the pinhole portion of the member is equal to or smaller than a focusing diameter of the laser beam which has passed through the f.theta. lens, restoring the laser beam which has passed through the pinhole portion into a parallel laser beam by the second convex lens, scanning the laser beam which has passed through the second convex lens by means of the two galvano-mirrors, and focusing the scanned laser beam by means of the f.theta. lens on a work to execute processing of the work.

Rotary head adjuster

The frequency conversion element for producing light of higher harmonic wave from the fundamental wave laser oscillator is provided with strain gauges 4, 4 or piezoelectric elements 4', 4' or thermo-couples 6, 6, output signals whereof are led to a signal processor and to a comparator, thereby to issue a control signal to decrease power of the input laser light, to prevent thermal breakdown of the frequency conversion element.

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Ibaraki, Japan

Toshiharu Okada