Kabushiki Kaisha Toshiba

Honda Giken Kogyo Kabushiki Kaisha

Toshiharu Obu

Hiroki Sekiya

Nobumitsu Tada

Shimpei Yoshioka

Keizo Hagiwara

Gou Ninomiya

Kazuhiro Ueda

Iwao Shimane

Atsushi Amano

Shinichi Baba

Yoshiyuki Shimizu

Masami Nakamura

Shigekazu Saito

Yasuyuki Danjou

A power semiconductor module includes semiconductor elements of a first system constituting each of arms in a circuit of the first system, semiconductor elements of a second system constituting each of arms in a circuit of the second system, a plurality of DC electrode conductors including a common DC electrode conductor joined to the semiconductor elements of the first and second systems, and a plurality of AC electrode conductors joined to the respective semiconductor elements of the first and second systems. Each of the semiconductor elements of the first and second systems is interposed between the DC electrode conductor and AC electrode conductor.

Power semiconductor module and semiconductor power converter provided with the same

To provide an inverter unit with excellent manufacturing performance and with current carrying capacity increased and size reduced by further increasing the cooling efficiency of a power efficiency device. The inverter unit includes: a semiconductor chip constituting an arm of an inverter; a first conductorjoined to a positive side of the semiconductor chip; and a second conductorjoined to a negative side of the semiconductor chip. The first and second conductors are disposed above a coolercooling the semiconductor chip so that a joint surface of the first conductorwhich is joined to a positive electrode of the semiconductor chip and a joint surface of the second conductorwhich is joined to a negative electrode of the semiconductor chip are not in parallel to a surface of the cooler

Inverter unit

By providing a plurality of semiconductor chips that are connected in parallel and constitute one arm of an inverter; a first conductor to which a face on one side of said plurality of semiconductor chips is connected; a wide conductor to which a face on the other side of said plurality of semiconductor chips is connected; a second conductor said first conductor and second conductor are connected connected to said wide conductor; and a cooler to which through an insulating resin sheet, part of the heat loss generated in the semiconductor chips is thermally conducted to the first conductor and is thence thermally conducted to the cooler, producing cooling, while another part thereof is thermally conducted to the wide conductor and thence to the second conductor, whence it is thermally conducted to the cooler, producing cooling.

Method of manufacturing an inverter device

By providing a plurality of semiconductor chips that are connected in parallel and constitute one arm of an inverter; a first conductor to which a face on one side of said plurality of semiconductor chips is connected; a wide conductor to which a face on the other side of said plurality of semiconductor chips is connected; a second conductor connected to said wide conductor; and a cooler to which said first conductor and second conductor are connected through an insulating resin sheet, part of the heat loss generated in the semiconductor chips is thermally conducted to the first conductor and is thence thermally conducted to the cooler, producing cooling, while another part thereof is thermally conducted to the wide conductor and thence to the second conductor, whence it is thermally conducted to the cooler, producing cooling.

Inverter device and method of manufacturing the device thereof, and electric automobile incorporating the inverter device thereof

In an inverter apparatus in which a three-phase inverter main circuit having a plurality of arms comprises a plurality of semiconductor chips for electric power, one arm of the three-phase inverter main circuit includes IGBTs and diodes of semiconductor chips having a size of 10 mm by 10 mm or less with the semiconductor chips connected in parallel, while the IGBTs and the diodes are bonded to a conductor having a thickness of 1.5 mm or more and 5 mm or less, and the conductor is glued to a cooler through an insulating resin sheet containing ceramics.

Inverter apparatus and method of manufacturing the same

Growing community of inventors

Kanagawa-ken, Japan

Toshiharu Obu