Yamaha Corporation

Nippon Gakki Seizo Kabushiki Kaisha

Richstone Limited

Toshiharu Hoshi

Yuma Horio

Kenzaburo Iijima

Hiroyuki Yamashita

Kenzaburou Iijima

Yoshinori Hayashi

Masayuki Takamura

Takeo Sata

Mutsumi Harada

Kazuhiro Tsuchiya

Takashi Iijima

Atsushi Tsuchida

Katsuhiko Onoue

Tomoo Yamagishi

Kazumoto Asano

Osamu Mochizuki

Hiroaki Itoh

Naoki Kamimura

Satoru Tomaru

Yoshikazu Ishii

Katsunori Suzuki

Kazuo Kurahashi

Takahiro Hayashi

Kunio Suzuki

Masayoshi Yamashita

BooSeok Hwang

Nobuji Kato

Hidetoshi Yasutake

Nanayuki Takeuchi

Fumiyasu Tanoue

Tekeo Sata

Yoshimi Iitake

Katsuhiko Kosugi

Kikuo Nishida

A thermoelectric module is constituted by a pair of substrates having electrodes, which are arranged opposite to each other with a prescribed space therebetween, in which a prescribed number of thermoelectric elements are arranged in such a way that a p-type and an n-type are alternately arranged, so that the thermoelectric elements are connected in series or in parallel together with the electrodes. Herein, one substrate is a heat absorption side, and other substrate is a heat radiation side. In addition, a current density in a current transmission area of the heat-absorption-side electrode is set to 50 A/mmor less, and a height of the thermoelectric element is set to 0.7 mm or less. Furthermore, a temperature-controlled semiconductor module can be realized by combining a thermoelectric module with a semiconductor component such as a semiconductor laser.

Thermoelectric module

An optical fiber coupler reinforcing member comprises an approximately rectangular member formed by a hard material, and has a flat surface along the longitudinal direction thereof. In addition, the shape thereof in cross-section is a hexagonal shape which inscribes a cylindrical member. Furthermore, a recess having a U-shaped cross-section is formed in the longitudinal direction of the above-mentioned approximately rectangular member and houses coupling section. The coupling section housed within the recess is fixed at both ends of the recess by an adhesive or the like. In addition, both ends of the inner wall surface of the recess have been given bevel sections. As a result, the optical fiber coupler reinforcing member having high reliability at low cost, with which the strength with respect to external force is improved and with which processability and the assembly operations of the optical fiber coupler are easy, are provided.

Optical fiber coupler reinforcing member and optical fiber coupler

A heat radiator for dissipating heat from an electronic device, which is mounted on a board or which is installed in a casing, to the outside thereof is basically composed of a substrate having plenty of through holes, which are produced by press molding and sintering. The substrate having a low thermal expansion coefficient is made of a copper-tungsten alloy or a copper-molybdenum alloy in which the copper content is smaller than the tungsten content or molybdenum content. The through holes each having a circular shape or a rectangular shape are infiltrated with the compound having a high thermal conductivity and composed of a copper-tungsten alloy or a copper-molybdenum alloy in which the copper content is greater than the tungsten content or molybdenum content. Thus, the heat radiator allows thermal conduction along axial directions of the through holes while substantially avoiding unwanted thermal expansion thereof.

Heat radiator for electronic device and method of making it

Thermoelectric material of (Bi, Sb)(Te, Se) system is produced through a liquid quenching method and an extrusion from a die unit having an inlet portion and an outlet portion crossing each other at 30-150 degrees so that the crystal grains have an average grain size equal to or less than 30 microns and (001) planes mostly oriented in parallel to a direction in which electric current to flow, thereby achieving the figure of merit equal to or greater than 3.0&times;10 /K.

Thermoelectric material improved in figure of merit, process for producing thereof and peltier module using the same

A thermoelectric module includes n-type semiconductor columns and p-type semiconductor columns connected in series through metal electrodes formed on inner surfaces of a pair of electrically insulating substrates, and the semiconductor columns are arranged so dense that the total cross sections of the semiconductor columns occupy at least 42 percent of one of the inner surfaces, whereby the converting efficiency is improved by virtue of restriction of the convective heat transfer between the electrically insulating substrates.

High-converting efficiency large-mechanical strength thermoelectric module

Thermoelectric materials having a high performance index and thermoelectric elements are provided. The present thermoelectric materials are constituted by at least one element selected from the group consisting of Bi and Sb, at least one element selected from the group consisting of Te and Se, and, if necessary, at least one element selected from the group consisting of I, Cl, Hg, Br, Ag, and Cu. The long axis of each crystal grain of the thermoelectric material grows in the direction parallel to the pressing direction at the time of press formation, and the aspect ratio D/d of each crystal grain, which represents a ratio between the average crystal grain size along the long axis D to the average crystal grain size along the short axis d, is more than 1.5. The C-plane is oriented parallel to the pressing direction.

Thermoelectric materials and thermoelectric conversion element

A wood or iron golf club head comprising a ball-striking part and a hosel which are formed separately and joined together into an integral unit, the hosel containing microscopic pores, thus having a lower material density compared to that of the ball-striking part.

Golf club head

Oxide is undesirably grown on the surface of grains of thermoelectric alloy, and the resistivity of the thermoelectric alloy is decreased due to the oxide; however, the oxide is reduced with hydrogen gas before the powder is solidified, and the pieces of thermoelectric alloy produced from the oxygen-free powder achieve a large figure of merit.

Thermoelectric alloy achieving large figure of merit by reducing oxide

Molten thermoelectric alloy expressed as (Bi, Sb).sub.2 (Te, Se).sub.3 is rapidly cooled at 10.sup.4 to 10.sup.6 .degree. K/second so as to crystallize the thermoelectric alloy, and powder of the thermoelectric alloy is hot pressed under the pressure equal to or greater than 400 kgf/cm.sup.2 at 200 degrees to 400 degrees in centigrade for a time period between {(-T/5)+90} minutes and 150 minutes or at 400 degrees to 500 degrees in centigrade for a time period between 5 minutes and 150 minutes so as to increase the figure of merit by virtue of the strain left in the crystal and/or micro crystal grain.

Process of manufacturing thermoelectric refrigerator alloy having large

Thermo-electric material has a composition containing at least one first element selected from the group consisting of Bi and Sb and at least one second element selected from the group consisting of Te and Se, and the crystal grains of the thermo-electric material have a mean crystal grain diameter equal to or less than 50 microns and a mean aspect ratio between 1 and 3 so as to achieve a large figure of merit equal to or greater than 3.4.times.10.sup.-3 /.degree.K.

Thermo-electric material having mean crystal grain diameter nor greater

A process wherein powder of p/n-type semiconductor thermoelectric materials expressed as (Bi, Sb).sub.2 (Te, Se).sub.3 is hot pressed under the pressure equal to or greater than 400 kgf/cm.sup.2 at 200 degrees to 400 degrees in centigrade for a time period between {(-T/5)+90} minutes and 150 minutes or at 400 degrees to 500 degrees in centigrade for a time period between 5 minutes and 150 minutes so as to increase the figure of merit by virtue of the strain left in the crystal and/or micro crystal grain, and pieces of p/n-type semiconductor thermoelectric material are assembled with electrodes so as to obtain a thermoelectric module for a high thermoelectric conversion efficiency.

Process of fabricating a thermoelectric module formed of V-VI group

Thermoelectric material contains one or more than one element selected from the transition metals and the rare earth metals, and the element promotes the amorphous phase in the thermoelectric material so as to increase the figure of merit.

Amorphous thermoelectric alloys and thermoelectric couple using same

In construction of a composite golf club head made up of several shell components united together along their mating edges, a face shell component is made of titanium alloy and a rear shell component is made of pure titanium. The titanium alloy well withstands hard impact at shooting balls by a face whereas use of cheep pure titanium allows plastic shaping of the intricate rear shell component even at a low temperature to significantly lower the total production cost of the golf club head.

In production of a shell-type golf club head made up of several different pieces, an iron-type material of a specified chemical composition and carbon equivalent is subjected to a combination of annealing before shaping with quenching after shaping. Exclusion of the conventional casting process in production much improves mechanical characteristics of the product and increase mechanical strength enables formation of a large size golf club head with an enlarged sweet spot. Limited and locally specified disposition of weld lines assures highly accurate lie and loft angles with reduced welding strain.

Golf club head and a method for producing the same

In construction of a wood club head having a main body of a hollow metallic shell construction, the face thickness is limited to 2 to 4 mm and the entire head volume is limited to 190 cc or larger for enlargement of its sweet spot. The enlarged sweet spot assures a long flying distance of a ball in an intended direction through its improved mating with the ball at the very moment of striking.

Growing community of inventors

Shizuoka, Japan

Toshiharu Hoshi