Ngk Spark Plug Company, Limited

Nor Spark Plug Co., Ltd.

Toshifumi Kojima

Hiroki Takeuchi

Hisahito Kashima

Kazushige Obayashi

Toshikatsu Takada

Toshikazu Horio

Ayako Kawamura

Kazushige Ohbayashi

Takeshi Ohno

Makoto Wakazono

Susumu Wakamatsu

Mitsugu Onoda

Masaki Ono

Takeshi Oono

Masahiko Okuyama

Hiroshi Sumi

Norihiko Ikai

Toshikatu Takada

There is provided an optical module for coupling with a fiber optic cable through an optical connector, including a module body connectable with a plug of the optical connector by a dedicated guide pin, with a side surface of the module body being opposed to a mating surface of the connector plug at which an end face of the fiber optic cable is exposed, and an optical element mounted to the module body and having an optical axis brought into alignment with an optical axis of the fiber optic cable upon fitting of the guide pin into the module body and the connector plug.

Optical module, optical module substrate and optical coupling structure

A solvent-free filling material comprising a filler, a thermosetting resin, a curing agent, and a curing catalyst, wherein the thermosetting resin is an epoxy resin, and the curing agent is a dicyandiamide curing agent; a multilayer printed wiring board comprising a substrate, a through-hole, the filling material filling the through-hole, and a conductor layer formed on an exposed surface of the filling material in the through-hole; and a process for producing the multilayer printed wiring board.

Filling material, multilayer wiring board, and process of producing multilayer wiring board

A substrate assembly for supporting an optical component includes a substrate having a front surface and a first recess, a second recess formed portion disposed in the first recess and having a second recess smaller in diameter than the first recess and having an open end at least at a side corresponding to the front surface, the second recess formed portion being made of a material having a machinability better than a material forming the substrate, and an alignment guide member fitted in the second recess and having a protruded portion protruding from the front surface of the ceramic substrate and fittingly engageable in an alignment hole of the optical component. A method of producing such a substrate assembly is also provided.

Substrate assembly for supporting optical component and method of producing the same

A multilayer wiring board () is provided which includes a core substrate () including a plurality of through-holes (). The through-holes () include through-hole conductors () on the inner walls of corresponding penetration holes () of a diameter of 200 &#x3bc;m or less. Interlayer insulating layers () are disposed on opposite sides of the principal planes () of the core substrate (). Wiring layers () are disposed on the surface of interlayer insulating layers (). The through-holes () are filled with a hardened filling material (). Lid conductors () close the openings of the through-holes (). The value of linear expansion of the hardened filling material () is 1.2% or less in the temperature region from room temperature to the solder reflow temperature. The board has excellent connection reliability and exhibits little or no cracking or delamination in the lid conductor closing the openings of the through-holes and in the surrounding conductor area.

Multilayer wiring board

An optical device mounted substrate assembly includes a ceramic substrate having a first recess, an optical device mounted on the ceramic substrate and having one of a light emitting portion and a light receiving portion, the optical device being to be optically connected to one of an optical waveguide and an optical fiber connector in way as to align optical axes of the optical wave guide or the optical fiber connector with each other, a resin layer disposed in the first recess and having a second recess smaller in diameter than the first recess, and an alignment guide member fitted in the second recess and having a protruded portion protruding from a front surface of the ceramic substrate and fittingly engageable in an alignment hole of one of the optical waveguide and the optical fiber connector. A fabrication method of such a substrate assembly is also provided.

Optical device mounted substrate assembly

The present invention provides a wiring board in which electronic components are embedded by means of an embedding resin which attains a high mounting density of the electronic components in the wiring board, which exhibits excellent electrical properties such as insulating property, which prevents random reflection of light, and which reduces non-uniformity in color of the resin during curing thereof. The present invention includes a wiring board in which electronic components are embedded by use of an embedding resin having a dielectric constant of less than or equal to about 5 and tan &#x3b4; of less than or equal to about 0.08. The embedding resin preferably contains carbon black in an amount of less than or equal to about 1.4 mass %. Moreover, the embedding resin preferably contains at least a thermosetting resin and at least one inorganic filler.

Wiring board

In an embedding resin for embedding electronic parts, after a substrate in which a copper layer is formed on a cured product of the embedding resin is subjected to a pressure cooker test, the copper layer has a peeling strength of at least 588 N/m (0.6 kg/cm), wherein the conditions of the pressure cooker test are 121&deg; C., 100% by mass humidity, 2.1 atm and 168 hours, and the measurement method of the peeling strength is according to JIS C 5012, and the width of the copper layer is 10 mm.

Embedding resin and wiring substrate using the same

A wiring substrate includes (1) an insulating substrate having an opening, or a core substrate and a build-up layer wherein at least one of the core substrate and the build-up layer has an opening, (2) at least one electronic part disposed in the opening, and (3) an embedding resin comprising a thermoplastic resin, an acid anhydride curing agent, a curing accelerator, and a filler, wherein the embedding resin shows a viscosity of not higher than 85 Pa&middot;s in a shear rate of 8.4 s after allowing to stand for 24 hours at 25&deg; C.&plusmn;1&deg; C.

Wiring substrate using embedding resin

An embedding resin for embedding an electronic part in a wiring substrate, includes at least one of a soluble resin and a soluble organic filler as a soluble component to be dissolved with an oxidizing agent.

Embedding resin, wiring substrate using same and process for producing wiring substrate using same

An embedding resin embeds an electronic part in an object and has a dielectric constant of about 5 or less and tan &dgr; of about 0.08 or less.

Embedding resin

A wiring board includes a substrate having an opening, and an electronic part placed in the opening, wherein a space left in the opening is filled with an embedding resin having a base color tone selected from black, blue, green, red, orange, yellow, and violet.

Wiring board and method for fabricating the same

The invention relates to a wiring circuit board including an electronic device disposed in a hole of the wiring circuit board; a resin filling the hole such that the electronic device is embedded in the resin; a wiring layer formed on the resin; and an interface between the resin and the wiring layer. This interface has a roughness in a range of 2-6 &mgr;m in terms of ten-point mean roughness.

Wiring circuit board and method for producing same

A paste for filling through-holes of a printed wiring board contains 100 parts by weight of an epoxy resin composition containing 90 to 99.5 parts by weight of an epoxy resin and 0.5 to 10 parts by weight of a curing agent; and (B) 500 to 1000 parts by weight of a metallic filler having an average particle size of 0.5 to 20 &mgr;m. The paste has a viscosity of not higher than 20,000 poise at 25&deg; C. and a volatile content of not more than 1.0% when heated in a filling step. The paste exhibits such shrink-resistance properties that when a first cured resin obtained by heating in a filling step is re-heated and cooled in a solder reflow step to obtain a second cured resin, the shrinkage percentage of the first cured resin to the second cured resin in the longitudinal direction of the through-hole is not greater than 0.1%.

Growing community of inventors

Komaki, Japan

Toshifumi Kojima