Kanegafuchi Kagaku Kogyo Kabushiki Kaisha

Kanegafuchi Chemical Industry Co., Ltd.

Kaneka Corporation

Nippon Oil Company

Toshifumi Hirose

Katsuhiko Isayama

Sadao Yukimoto

Fumio Kawakubo

Hiroshi Wakabayashi

Takahisa Iwahara

Ayako Yano

Katsuhiro Ando

Jun Kotani

Jun Hattori

Manabu Tsumura

Tadashi Minokami

Miyako Hosaka

Katsuya Ouchi

Makoto Sasaki

Hiroshi Awaji

Junji Takase

Kazuhiko Ueda

Toyohisa Fujimoto

Ryotaro Tsuji

Masafumi Hiraishi

Masaki Yamakawa

Kawakubo Kawakubo

Shintaro Kohmitsu

An object of the present invention is to improve a drying property of paint in application of alkyd paint to the surface of a cured material resulting from the curable composition containing an oxyalkylene polymer having at least one silicon-containing functional group capable of cross-linking by formation of at least one siloxane bond, and to provide a composition that contains an oxyalkylene polymer (A) having at least one silicon-containing functional group capable of cross-linking by formation of at least one siloxane bond and 2,6-di-t-butylhydroxytoluene wherein the content of the above-described 2,6-di-t-butylhydroxytoluene is 350 ppm or less relative to the above-described polymer (A).

Curing composition and method for applying alkyd coating material with the same

Process for fitting glass members onto vehicles

A curable resin composition containing an oxyalkylene polymer having at least one silicon-containing reactive group in a molecule, and at least one compound selected from the group consisting of (1) a compound having at least one amino group and at least one trialkylsiloxy group in a molecule and (2) a silylamine derivative having at least one group with a hydroxy or hydrolyzable group bonded to the silicon atom and can be crosslinked through the formation of a siloxane bond, which provides a cured material having good adhesion properties with coatings and less residual tack.

Curable resin composition with improved adhesion of coatings

A curable resin composition containing (a) an oxyalkylene polymer which comprises at least one silicon-containing group having at least one hydroxyl or hydrolyzable group bonded to a silicon atom, (b) an epoxy resin, (c) a ketimine compound and (d) a carbonyl compound, which has improved storage stability.

Curable resin composition

A silicon-containing polymer comprising a structural unit of the formula (1): ##STR1## wherein R.sup.1 and R.sup.2 are the same or different and represent a monovalent organic group having 1 to 20 carbon atoms, and the benzene ring may have a substituent, which has good heat resistance.

Silicon-containing polymer, process for preparing the same and monomer

a tape or sheet form pressure-sensitive adhesive material which comprises a substrate which is obtainable by curing a curable resin composition comprising: (A) an organic elastomeric polymer which is liquid at room temperature and has, in a molecule, at least one silicon-containing group to the silicon atom of which at lease one hydroxyl group or hydrolyzable group is bonded and which is cross linkable through formation of a siloxane bond, (B) a curing catalyst

Pressure-sensitive adhesive material

A curable composition providing a cured product having a silicon type interpenetrating polymer network, which comprises (A) a silsesquioxane ladder polymer, (B) a silicon compound having at least two SiH groups per molecule, (C) a silicon compound having at least two vinylsilyl groups per molecule and (D) a neutral platinum catalyst; and a process for producing a molded article comprising heating the curable composition under a controlled temperature for synchronously causing hydrolysis and condensation of the alkoxysilyl group and/or silanol group and hydrosilylation.

Curable composition and process for producing molded articles using the

When a polysiloxane or siloxane is contacted with a mixture which comprises an orthoester, a compound having an active hydrogen-containing group and an acid catalyst, it is easily decomposed even at room temperature to provide a silicon compound having a lower molecular weight such as an alkoxysilane.

Method for decomposing polysiloxane

A process for preparing an alkoxysilane of the general formula:

Process for preparing alkoxysilane

A curable composition. The composition contains

Curable composition

A curable polymer composition which comprises:

Curable polymer composition

A curable composition. The composition comprises (A) 100 parts by weight of an oxyalkylene polymer having at least one silicon-containing group in which a hydroxy group and/or hydrolyzable group is or are bonded to the silicon atom, said polymer being crosslinkable by formation of a siloxane bond, (B) from 0.1 to 20 parts by weight of a compound having one silanol group per molecule and/or a compound capable of forming a compound having one silanol group per molecule on reacting with moisture, and (C) from 0.1 to 20 parts by weight of a compound having an air oxidative curing unsaturated group. The composition provides a cured product which has low modulus and resistance to dust adhesion and on which an alkyd coating shows excellent coating properties.

A curable polymer composition comprising:

A curing composition showing improved drying characteristics of an alkyd coating which comprises:

Curing composition having enhancing effect on drying characteristics of

A curable polymer composition which comprises (A) an oxyalkylene base polymer having at least one silicon-containing group to the silicon atom of which a hydroxyl group or a hydrolyzable group is bonded and which is cross linkable through formation of a siloxane bond and (B) at least one compound selected from the group consisting of a silicon-containing compound having at least one long chain hydrocarbon group and a silicon-containing compound having at least one fluorohydrocarbon group in an amount of 0.1 to 30 parts by weight per 100 parts by weight of the polymer (A), which composition provides a cured material having improved surface properties.

Growing community of inventors

Kobe, Japan

Toshifumi Hirose