Nichia Corporation

Toshiaki Yamashita

Akinori Hara

Masahiko Sano

Hiroaki Yuto

Naoki Eboshi

Hiroki Sakata

A light emission device includes: a plurality of semiconductor light-emitting elements; an optical element configured to collimate light emitted from each of the plurality of semiconductor light-emitting elements and output a plurality of collimated beams; and a paraboloid reflector configured to be irradiated with the plurality of collimated beams. The plurality of collimated beams reflected by the paraboloid reflector are converged.

Light emission device

A method of manufacturing a metal-coated member includes: providing a composite ceramic member including a ceramic part, and a connection part connected to the ceramic part; disposing a precious metal layer on a surface region that includes at least a portion of a surface of the ceramic part and a portion of a surface of the connection part, the precious metal layer including a precious metal; and removing at least a portion of the precious metal layer that is on the surface of the ceramic part and delineated by the boundary between the ceramic part and the connection part. The connection part has stronger adhesion to the precious metal than the ceramic part.

Method of manufacturing metal-coated member, metal-coated member, wavelength conversion member, and light emitting device

A light-transmissive member includes: a light transmitting portion having an emission surface from which light is emitted; and a metal region on the emission surface, wherein the metal region comprises either (i) a metal film having a thickness in a range of 1 nm to 10 nm, or (ii) dispersed metal particles each having a maximum length in a direction perpendicular to the emission surface in a range of 1 nm to 100 nm.

Light-transmissive member and method of manufacturing the same, optical member, and light emitting device

A wavelength conversion member includes three or more light-emitting portions, and two or more light shielding layers. Each of the three or more light-emitting portions has a phosphor, is separated from each other, and is disposed to be aligned in a first direction. Each of the two or more light shielding layers is disposed between the two light-emitting portions adjacent to each other. The light-emitting portion and the light shielding layer are alternately aligned in the first direction. In the first direction, a length of each of the light-emitting portions is in a range of 0.3 mm to 2.0 mm. An interval in the first direction between the two light-emitting portions adjacent to each other is in a range of 0.1 mm to 2.0 mm.

Wavelength conversion member and light-emitting device

A wavelength conversion member includes: a sintered body that has a light incidence face, a light emission face, and a light reflecting face that is different from the light incidence face and the light emission face, wherein the sintered body contains phosphor particles. The light reflecting face of the sintered body has a plurality of recessed portions. A distribution of the phosphor particles at the light reflecting face is lower than a distribution of the phosphor particles at a cross-section inside the sintered body.

Method of manufacturing wavelength conversion member and wavelength conversion member

A method for manufacturing a wavelength conversion member, includes: providing a wavelength conversion layer having a phosphor-containing portion and a light reflecting portion surrounding the phosphor-containing portion, and the wavelength conversion layer having an upper surface, a bottom surface and at least one side surface; forming a light-blocking film on the upper surface of the wavelength conversion layer; and removing a part of the light-blocking film by laser processing to expose at least a part of the phosphor-containing portion from the light-blocking film.

Method for manufacturing wavelength conversion member and light emitting device

A method of manufacturing a wavelength conversion member that includes a sintered body having a light incidence face, a light emission face, and a light reflecting face different from the light incidence face and the light emission face, the method comprising: providing a sintered body containing inorganic particles and phosphor particles, and forming a plurality of recessed portions on the light reflecting face of the sintered body, which comprises acid treating the sintered body.

A light emission device includes: a plurality of semiconductor light-emitting elements; an optical element configured to collimate light emitted from each of the plurality of semiconductor light-emitting elements and output a plurality of collimated beams; a converging portion having a surface of a hyperboloid or a paraboloid configured to converge the plurality of collimated beams; and a wavelength-converting portion including a transmissive region, and a reflective region that surrounds the transmissive region, the transmissive region including a light-incident surface at which the plurality of collimated beams that have been converged by the converging portion enter, wherein the transmissive region includes a phosphor adapted to be excited by the plurality of collimated beams that have been converged by the converging portion.

A method of manufacturing a wavelength conversion member includes: preparing a composite by layering a layered body and a ceramic sheet that includes a phosphor, the layered body including a pair of light-reflective green sheets each containing a reflective material, and a light-shielding green sheet containing a light shielding material with the light-shielding green sheet being layered between the pair of reflective green sheets; and pressurizing and firing the composite.

Wavelength conversion member, method of manufacturing same, and light-emitting device

A light emitting device includes: a light emitting element; and a wavelength conversion member including: a wavelength conversion part configured to convert light emitted from the light emitting element into light having a different wavelength and to output the light having the different wavelength, an enclosing part enclosing the wavelength conversion part, and a conducting layer disposed on the enclosing part and surrounding the wavelength conversion part. The conducting layer comprises ruthenium oxide.

Light emitting device and optical part

A wavelength conversion part includes: a wavelength conversion member formed primarily of a ceramic material; an enclosing member formed primarily of a ceramic material, wherein the enclosing member surrounds one or more lateral faces of the wavelength conversion member; and a heat dissipating member having an upper face, wherein the heat dissipating member is fixed to the wavelength conversion member, and wherein the upper face of the heat dissipating member opposes lower faces of the wavelength conversion member and enclosing member. The lower face of the wavelength conversion member projects towards the heat dissipating member beyond the lower face of the enclosing member. A portion of the lower face of the enclosing member is separated from the upper face of the heat dissipating member by an air gap.

Wavelength conversion part, method of manufacturing wavelength conversion part, and light emitting device

A light emission device includes: a plurality of semiconductor light-emitting elements; an optical element configured to collimate light emitted from each of the plurality of semiconductor light-emitting elements and output a plurality of collimated beams; a converging portion having an aspheric surface configured to converge the plurality of collimated beams; and a wavelength-converting portion including a transmissive region and a reflective region that surrounds the transmissive region, the transmissive region including a light-incident surface at which the plurality of collimated beams enter, wherein the transmissive region includes a phosphor adapted to be excited by the plurality of collimated beams that have been converged by the converging portion.

A wavelength conversion part includes: a wavelength conversion member formed primarily of a ceramic material, wherein the wavelength conversion member has a lower face and one or more lateral faces; an enclosing member formed primarily of a ceramic material, wherein the enclosing member has a lower face, and wherein the enclosing member surrounds the one or more lateral faces of the wavelength conversion member; and a heat dissipating member having a upper face, wherein the heat dissipating member is fixed to the wavelength conversion member, and wherein the upper face of the heat dissipating member opposes the lower face of the wavelength conversion member and the lower face of the enclosing member. The lower face of the wavelength conversion member projects towards the heat dissipating member beyond the lower face of the enclosing member.

A light-emitting device includes: a semiconductor laser element; a surrounding member surrounding the semiconductor laser element; a fluorescent member containing a fluorescent material that is excitable by light emitted from the semiconductor laser element so as to emit light having a wavelength different from a wavelength of the light emitted from the semiconductor laser element; a supporting member located above the surrounding member, wherein the supporting member comprises a through-hole that allows light emitted from the semiconductor laser element to pass therethrough, and wherein the fluorescent member is located in the through-hole; a light-transmissive heat dissipating member, wherein a lower surface of the heat dissipating member is bonded to the surrounding member, and an upper surface of the heat dissipating member is bonded to the supporting member; and a reflective film disposed on the heat dissipating member.

Light-emitting device

A light emitting device includes a plurality of semiconductor laser elements, a light-transmissive member, and a wavelength conversion member. Each of the semiconductor laser elements is configured to emit light having a first wavelength. The light-transmissive member includes a plurality of first inclined surfaces and a lower surface. The light-transmissive member is positioned with respect to the semiconductor laser elements so that beams of the light emitted from the semiconductor laser elements enter the light-transmissive member respectively through the first inclined surfaces and exit from the lower surface. The wavelength conversion member is disposed in contact with the lower surface of the light-transmissive member and configured to convert at least a portion of the light exiting from the lower surface to wavelength-converted light having a second wavelength.

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Komatsushima, Japan

Toshiaki Yamashita