Nissan Chemical Industries Limited

Nissan Chemical Corporation

Toshiaki Takeyama

Yuki Endo

Kazuhiro Yamagishi

Naohiko Suemura

Junichi Watanabe

Masanori Nishioka

Hiroyuki Suzuki

Keiko Yoshitake

Takeo Moro

Toshimasa Hamada

Hiroaki Takahashi

Sayoko Yanagisawa

Yasuhiro Gunji

Hideo Suzuki

Takeshi Mita

Masami Hanaue

Masao Nishikubo

Motohiko Hidaka

Shojiro Yukawa

Takamasa Kikuchi

Yasuyuki Nakajima

Kentaro Ohmori

Shinya Arase

Yoshinori Ochiai

Shigeaki Akiyama

Takashi Furusato

Kazuhiko Akimoto

Hiroshi Ohya

Yoshiaki Yasumi

Shigeru Sasabe

A crystalline epoxy resin is modified to provide an epoxy resin composition capable of producing a cured product with excellent cured product properties. The modified epoxy resin composition comprises compound A having in its molecule a functional group represented by formula (1): (where each of Rand Ris an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an aralkyl group, a heterocyclic group, or a halogenated, aminated or nitrated derivative thereof), and compound B having a glycidyl group in its molecule. The compound A is preferably a compound resulting from replacement of from at least one to at most n glycidyl groups among n glycidyl groups in a molecule (where n is an integer of from 2 to 16) with the functional group of the formula (1). The compound B is preferably a compound having n glycidyl groups (where n is an integer of from 2 to 16) in its molecule.

Modified epoxy resin composition

There is provided colloidal silica particles comprising at least one polyvalent metal element M selected from a group consisting of iron, aluminum, zinc, zirconium, titanium, tin, and lead in an average content of 0.001 to 0.02 in terms of an M/Si molar ratio, and having an average primary particle diameter of 5 to 40 nm, wherein the content of the polyvalent metal element M present in an outermost layer of the colloidal particles is 0 to 0.003 atom per square nanometer (nm) of a surface area of the colloidal particles; and a silica sol that the colloidal silica particles are dispersed in an organic solvent, a silica sol that the colloidal silica particles are dispersed in a polymerizable compound, and a silica sol that the colloidal silica particles are dispersed in a dicarboxylic anhydride.

Colloidal silica particles, process for producing the same, and organic solvent-dispersed silica sol, polymerizable compound-dispersed silica sol, and dicarboxylic anhydride-dispersed silica sol each obtained from the same

There is provided an epoxy resin composition having low viscosity and a high cationic curing property. An epoxy compound of Formula (1): (in Formula (1), A is an (n4)-valent Clinear hydrocarbon group optionally containing an epoxy group, an (n4)-valent Ccyclic hydrocarbon group optionally containing an epoxy group, or an (n4)-valent group of a combination of the linear hydrocarbon group and the cyclic hydrocarbon group; Rand Rare each independently a hydrogen atom or a Calkyl group; n1 is an integer of 2 to 6; n2 is an integer of 2; n3 is an integer of 1; and n4 is an integer of 3 to 8). For example, A is an (n4)-valent organic group formed by removing (n4) hydrogen atoms from butane, pentane, or hexane, or an (n4)-valent organic group formed by removing (n4) hydrogen atoms from cyclobutane, cyclopentane, cyclohexane, epoxycyclohexane, alkyl-substituted epoxycyclohexane, bicycloheptene, or bicyclooctene.

Polyfunctional epoxy compound

Process for producing colloidal silica particles

There is provided an epoxy compound that provides properties of cured products combining high transparency with high flexural strength by being thermally cured while maintaining advantageous handling properties in a liquid state thereof; and a method for producing a composition by using the epoxy compound. A method for producing an epoxy compound of Formula (1): (in Formula (1), n1, n2, and n3 are individually any one of integers of 2 to 6; n4, n5, and n6 are individually an integer of 2; n7, n8, and n9 are individually an integer of 1; and R, R, R, R, R, and Rare independently a hydrogen atom or a Calkyl group), including: reacting cyanuric chloride with a Calkenol and reacting the obtained compound having an unsaturated bond with a peroxide.

Method for producing epoxy compound having cyanuric acid skeleton

It is an object to provide a liquid thermosetting composition that yields an epoxy resin having physical properties of the cured product such as high flexural strength along with adequate handleability as liquid, to be used in transparent sealants for optical semiconductors, such as transparent sealants for LEDs (light-emitting devices) and the like. There is provided a thermosetting composition containing an epoxy compound that a side chain between a triazinetrione ring and an epoxy group substituted on the triazinetrione ring is long (elongated).

Long chain alkylene group-containing epoxy compound

There is provided a water-soluble flux composition for soldering which is excellent particularly in heat resistance and flux residues after soldering of which can be easily removed by washing with water or warm water. The flux composition for soldering contains a compound of formula (1): wherein R, R, R, R, Rand Rindependently of one another are a hydrocarbon group or hydrogen atom, and A, Aand Aindependently of one another are hydroxy group or an organic group of formula (2): and at least one of A, Aand Ais an organic group of formula (2).

Heat-resistant water-soluble flux composition for soldering

A curable composition that maintains good handleability in the liquid form and that can be photo- or heat-cured to form a cured product having physical properties including both high transparency and high flexural strength. A curable composition includes, an epoxy compound of (1): [where each of E, E, and Eis independently an organic group of Formula (2) or Formula (3); and each of R, R, and Ris independently an optionally branched alkylene group or oxyalkylene group: (where Ris a hydrogen atom or a methyl group)]; and an acid generator.

Long-chain alkylene-containing curable epoxy resin composition

There is provided a curable composition having a low viscosity and high cationic curability. A curable composition including an epoxy compound of Formula (1): [in Formula (1), A is a monocyclic aliphatic hydrocarbon group optionally containing an epoxy group; R, R, Rand Rare independently a hydrogen atom or a Calkyl group; n1 and n2 are independently an integer of 2 to 6; n3 and n4 are individually an integer of 2; and n5 and n6 are individually an integer of 1], and an acid generator.

Epdxy resin composition having monocyclic aliphatic hydrocarbon ring

There is provided a resist composition suitable for forming a microlens which is excellent in transparency, heat resistance, and sensitivity characteristics, excellent in solubility in a developer, and as the result thereof has high resolution. A positive resist composition comprising; a component (A): an alkali-soluble polymer; a component (B): a compound having an organic group to be photolyzed to generate an alkali-soluble group; a component (C): a crosslinkable compound of Formula (1): [where R, R, and, Rare independently a Calkylene group or oxyalkylene group which are optionally branched; and E, E, and Eare independently a group containing a structure of Formula (2) or Formula (3): (where Ris a hydrogen atom or a methyl group)]; and a component (D): a solvent.

Positive resist composition and method for producing microlens

There is provided a liquid preparation for forming an epoxy resin having curing properties combining high transparency and high bending strength while maintaining advantageous handling properties as in a liquid state. A liquid preparation for forming an epoxy resin comprising: an A agent; and a B agent; wherein the A agent contains a modified epoxy resin (I) formed from at least one type of compound (i) having in a molecule thereof, at least one functional group of Formula (1): (where Rand Rindividually represent an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an aralkyl group, a heterocyclic group or a halogenated, aminated or nitrated derivative of any of the groups) and a compound (ii) having a glycidyl group in a molecule thereof, and an inorganic particle (II); and the B agent contains a curing agent (III). A liquid preparation for forming an epoxy resin comprising: an A' agent; and a B&#x2032; agent; wherein the A&#x2032; agent contains the modified epoxy resin (I); and the B&#x2032; agent contains the inorganic particle (II) and the curing agent (III).

Epoxy resin-forming liquid preparation containing inorganic particle

A sulfamoyl compound of the general formulae (1): wherein The sulfamoyl compound is useful as an agricultural and horticultural fungicide.

Sulfamoyl compounds and agricultural and horticultural fungicides

Isocyanurate compound and method for producing the same

Growing community of inventors

Funabashi, Japan

Toshiaki Takeyama