Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Matushita Electric Industrial Co., Ltd.

Toshiaki Takenaka

Shinji Nakamura

Kunio Kishimoto

Toshihiro Nishii

Yoshihiro Kawakita

Shigeru Yamane

Hideaki Komoda

Toshikazu Kondo

Shintaro Hayashi

Akihiro Miura

Fumiya Yagi

Shogo Motegi

Yuichiro Sugita

Takeshi Abe

Hirofumi Konishi

Fumio Echigo

Eiji Kawamoto

Tadashi Tojyo

Kiyohide Tatsumi

Yukihiro Hiraishi

Tadashi Tojo

Hiroshi Tahara

Yudai Shibata

Takashi Umehara

Mitsunori Maeda

Kazuhiko Ooyama

Toshikazu Kondou

Yutaro Matsui

Shinya Maeda

The light source device includes at least one excitation light source which emits primary light, a light conversion member which emits secondary light that contains the primary light and wavelength-converted light obtained by converting a wavelength of at least part of the primary light, a sensor which detects the primary light and the wavelength-converted light, and a controller which obtains a first signal which is a signal indicating the detected primary light and a second signal indicating the wavelength-converted light detected by the sensor. The controller determines an operation safety parameter based on a ratio of an output value of the first signal to an output value of the second signal, and controls the at least one excitation light source based on the operation safety parameter with respect to a predetermined threshold or an amount of change of the operation safety parameter from that during normal operation.

Light source device

A light source device includes a plurality of light sources; a condensing optical member; a fluorescent unit that converts at least a portion of the light from the light sources and condensed by the optical member into light including converted light and light from the light sources; and a sensor that detects an anomaly in the fluorescent unit, such sensor disposed within a circular area circumscribed by the light sources.

Light source device with sensor for detecting anomaly in wavelength converting member

A device includes a light source; a first lens for condensing light emitted by the light source; a member for converting at least a portion of the condensed light; a sensor for detecting light traveling from the member back towards the light source; and a second lens for directing light traveling back toward the light source to the sensor. The first lens includes a curved first face facing the light source, and a flat second face opposite the first face; the second lens has a curved third face facing away from the first lens and with a curvature different from a curvature of the first face of the first lens, and a flat fourth face facing the second face of the first lens. The second lens is provided between the first lens and the wavelength converting member.

Lighting system includes light source that includes at least one light-emitting device and emits first light (laser light); wavelength conversion member that converts part of the first light into second light having a different wavelength from that of the first light; an optical system (light guide member) where the first light enters and that applies the first light to wavelength conversion member; optical sensor that receives part of the second light as monitor light and outputs monitor signal corresponding to the intensity of monitor light; and output control circuit that controls light source and optical sensor. Output control circuit performs an optical system inspection of conditions of the optical system and wavelength conversion member and a light source inspection of a condition of light source in accordance with monitor signal, using a time division method.

Lighting system and method of controlling lighting system

Lighting system includes light source that includes a plurality of light-emitting devices and emits first light; wavelength conversion member that converts part of the first light into second light; an optical system that applies the first light to wavelength conversion member; optical sensor that output monitor signal corresponding to the intensity of the second light; and output control circuit that controls light source and optical sensor. Output control circuit performs a light source inspection of a condition of light source and an optical system inspection of conditions of the optical system and wavelength conversion member in accordance with monitor signal. In the light source inspection, the output control circuit inspects each of light-emitting devices in sequence, and after having inspected one of light-emitting devices, suspends the light source inspection and performs the optical system inspection before inspection of another one of the light emitting devices.

A strobe device is provided with a light-emitting unit rotatably coupled to a strobe body unit detachable from a bracket together with an imaging apparatus, a variable mechanism configured to allow a change in an angle of orientation of the light-emitting unit with respect to the strobe body unit, a driving unit configured to drive the variable mechanism, and a control section configured to control the driving unit. The control section has a control mode to restrain the light-emitting unit from moving to a region in which the imaging apparatus is located when it is detected that the strobe body unit is attached to the bracket. As a result, the strobe device whose the light-emitting unit does not bump against the imaging apparatus can be realized.

Strobe device and imaging device provided with strobe device

A highly reliable and productive manufacturing method of boards and a manufacturing apparatus are provided. The manufacturing apparatus includes heater-punches () and () disposed above and under pressuring holes () provided on positioning stage () which positions and laminates board materials. The apparatus also includes a supplying and discharging means of a mold-releasing sheet, and the means is formed of supply reel (), take-up reel (), and guide rolls () and (). The sheet is supplied and discharged passing between heater-punches () placed above pressuring holes () and heater-punches () placed under pressuring holes ().

Manufacturing method of boards, mold-releasing sheet, manufacturing apparatus for board

A mask film, where squeegee cleaning part has been formed at a predetermined position, and another mask film are attached to both sides of a substrate. A through-hole is formed by using a laser, and conductive paste is filled into the through-hole by using a squeezing method. As discussed above, a paste-residue can be prevented on the through-hole, so that a circuit board having high quality of connection can be obtained.

Method and apparatus for manufacturing circuit board

A method of manufacturing a multi-layer circuit board including preparing a laminated member formed of (i) a core circuit board having a circuit pattern thereon and (ii) a prepreg sheet having a through-hole filled with conductive paste, forming a laminated structure such that the laminated member is sandwiched by lamination plates, and applying heat and pressure to the laminated structure. According to this method, selecting a lamination plate that has a thermal expansion coefficient that is equivalent to that of a core circuit board will protect the conductive paste from distortion, thereby offering a high-quality multi-layer circuit board having a reliable connection resistance.

Method of manufacturing multi-layer circuit board

An intermediate material which is adapted to manufacture a circuit board includes a prepreg sheet having a through-hole provided therein, a first film provided on a surface of the prepreg sheet and having a first hole communicating with the through-hole, a second film provided on another surface of the prepreg sheet and having a second hole communicating with the through-hole, and a conductive paste filling the though-hole, the first hole, and the second hole. The thickness tof the prepreg sheet, the minimum diameter rof the through-hole, the thickness tof the first film, the diameter rof the first hole, the thickness tof the second film, the diameter rof the second hole satisfy a relation: r/t&#x2267;3, r/t&#x2267;3, and r/(t+t+t)&#x2266;1.5. This intermediate material provides a circuit board having a fine via-conductor connected to a metal foil securely and stably.

Intermediate material for manufacturing circuit board and method for manufacturing circuit board using such intermediate material

After disposing metallic foils on either surface of a prepreg sheet of low compressibility having conducting holes filled with conductive paste, the prepreg sheet is compressed in a state of being kept at a relatively low temperature, and after that, the temperature is raised under pressure to melt and harden the resin in the prepreg sheet, and thereby, the connecting resistance is stabilized, and a high-quality circuit board can be obtained.

Circuit board

A pre-preg sheet includes a substrate and a resin impregnated in the substrate. A first metal foil is placed on the pre-preg sheet to provide a laminated body. The laminated body is put in a heating device having a temperature maintained at a temperature close to a softening temperature of the resin. The laminated body is compressed at the temperature at a predetermined pressure. The first metal foil is bonded to the pre-preg sheet of the laminated body and hardening the resin, thus providing a circuit board. This method provides a stable resistance of a conductive paste filing a through-hole in the pre-preg sheet to be compressed at a small rate.

Method of manufacturing circuit board

Method for producing a circuit board

It is possible to obtain a clean high-quality circuit board by removing affected material and foreign matter produced when a hole is formed. A manufacturing method of the circuit board includes (a) preparing a film-coated board material by bonding a film material as a mask to a board material, (b) forming a hole in the film-coated board material by applying a laser beam thereto, and (c) selectively removing the unnecessary material sticking to the film-coated board material from the film-coated board material by supersonic cleaning without peeling the film material off the board material. Unnecessary material such as foreign matter is produced when the hole is formed, and the unnecessary material sticks to the board material. After removal of such unnecessary material, a conductive material is disposed in the hole, using the film material as a mask, and the film material is later removed from the board material.

Method of manufacturing a circuit board and its manufacturing apparatus

The present invention aims to provide a printing plate capable of preventing paste of high viscosity adhering to an edge of a squeegee from being transferred to and left on a through hole of a printed circuit board when the paste is being filled by a squeegeeing method. The printing plate has a metal sheet () provided with a squeegee cleaning section () formed thereon and fixed to the back surface of a slanting area () of mask () attached to a plate framework (). The through hole of the printed circuit board is filled with paste only after paste of high viscosity adhering to the edge of the squeegee is removed by the squeegee cleaning section (), to prevent the paste from being left on the through hole, and thereby achieving the printed circuit board of excellent quality.

Growing community of inventors

Kyoto, Japan

Toshiaki Takenaka