Nec Corporation

Nec Electronics Corporation

Toshiaki Shironouchi

Yoichiro Kurita

Takao Yamazaki

Yoshimichi Sogawa

Hiroshi Ise

Takashi Tetsuka

Kenji Ohyachi

There is provided an electronic device package and the like in which it is not likely that damage occurs in a wiring pattern of an interposer substrate in a gap section formed, for example, between an electronic device and an insertion substrate. The semiconductor package in accordance with the present invention is a package of fan-out type including an interposer substrate and a semiconductor device and an insertion substrate which are arranged on the substrate. The interposer substrateincludes a wiring pattern therein. A gap is formed between the semiconductor device and the insertion substrate; in an area corresponding to the gap, a reinforcing member (a metallic film) is formed to increase strength of the wiring pattern.

Electronic package device, module, and electronic apparatus

There is provided a semiconductor device in which a plurality of semiconductor chips is stacked in layers and sealed in a package, including: a lower-layer semiconductor chip which is mounted on a package board; an upper-layer semiconductor chip which is stacked via a plurality of spacers on the lower-layer semiconductor chip; at least one first conductor interconnecting electrically at least one first electrode on the lower-layer semiconductor chip and at least one first internal terminal on the package board; at least one second conductor electrically interconnecting at least one second electrode on the upper-layer semiconductor chip and at least one second internal terminal on the package board; and the package for sealing therein the lower-layer semiconductor chip, the upper-layer semiconductor chip, and the at least one first conductor and the at least one second conductor which are all on the package board.

Semiconductor device and method for manufacturing the same

Semiconductor chips are arranged on a panel in matrix, scaled in a piece of synthetic resin through a transfer molding, and the resultant structure is separated into dices through a cutting operation so that small semiconductor devices are economically produced.

Semiconductor device with economical compact package and process for fabricating semiconductor device

A die bonder for a semiconductor producing apparatus is disclosed. The die bonder is capable of dealing with packages having a standard structure and packages having an LOC (Lead On Chip) structure, as needed.

Growing community of inventors

Kanagawa, Japan

Toshiaki Shironouchi