Hitachi Chemical Company, Ltd.

Toshiaki Shirasaka

Masami Yusa

Shigeki Katogi

Hidehiro Nakamura

Masato Kaneeda

Hiroyuki Izawa

Houko Sutou

Takanobu Kobayashi

Atsushi Kuwano

Hideyuki Katagi

Kazuhiro Enomoto

Tomoo Nishiyama

Naoki Hara

Kohei Yoshikawa

Yasuhiko Awano

Kensuke Yoshihara

Kouhei Yoshikawa

Kenetsu Kitamura

Disclosed is a COconcentration reducing device for separating and removing COfrom a gas containing COwith a COadsorbent, the COconcentration reducing device including: an adsorbent container which contains the COadsorbent; and a heating unit which heats the COadsorbent by an induction heating or a dielectric heating. Thus, a ventilation quantity can be reduced when COaccumulated in a room is removed, and an electric power required for the ventilation and the electric power required for air conditioning can be reduced.

COconcentration reducing device

A COremoval device includes: a COcapturing material which captures HO and COin a gas; a reaction container which contains the COcapturing material; an HO measuring unit for measuring the concentration of HO in the gas; an HO concentration adjustment device which adjusts the concentration of HO on the basis of information obtained by the HO measuring unit; a gas introduction path introducing the gas into the reaction container from the HO concentration adjustment device and bringing the gas into contact with the COcapturing material; a first gas discharge path discharging the gas from the reaction container after the gas has been brought into contact with the COcapturing material; and a second gas discharge path discharging the gas that has been desorbed from the COcapturing material from the reaction container.

CO2 removal device

The present invention provides a resin composition including an epoxy resin monomer, a novolac resin containing a compound having a structural unit represented by the following general Formula (I), and a filler, in which a particle size distribution of the filler, measured using laser diffractometry, has peaks in the respective ranges of from 0.01 &#x3bc;m to less than 1 &#x3bc;m, from 1 &#x3bc;m to less than 10 &#x3bc;m, and from 10 &#x3bc;m to 100 &#x3bc;m, and the filler contains boron nitride particles having particle sizes of from 10 &#x3bc;m to 100 &#x3bc;m. In the general Formula (I), Rrepresents an alkyl group, an aryl group, or an aralkyl group. Each of Rand Rindependently represents a hydrogen atom, an alkyl group, aryl group, or an aralkyl group. m represents a number from 0 to 2; and n represents a number from 1 to 7. 

Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for producing same, semiconductor device and LED device

The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.

Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device

Growing community of inventors

Tokyo, Japan

Toshiaki Shirasaka