Mitsubishi Denki Kabushiki Kaisha

Mitsubishi Electric Corporation

Panasonic Intellectual Property Management Co., Ltd.

Panasonic I-pro Sensing Solutions Co., Ltd.

Thk Co., Ltd.

Mitsubushi Denki Kabushiki Kaisha

Toshiaki Shinohara

Yoshiharu Takahashi

Takanobu Yoshida

Hisashi Kawafuji

Gourab Majumdar

Mitsutaka Iwasaki

Yasushi Yokomitsu

Youhei Koide

Kazuya Waniguchi

Yasuo Yomogida

Tatsuo Ota

Hiroyuki Seguchi

Hiroya Ikuta

Mamoru Terai

Kenichi Hayashi

Takashi Nishimura

Jun Fujita

Tetsuhiro Nishide

Naoki Yoshimatsu

Kazuyasu Nishikawa

Hiroshi Kobayashi

Kei Yamamoto

Akira Fujita

Masahiko Yoshino

Yoshinori Yokoyama

Tetsu Negishi

Akihisa Fukumoto

Yoshito Touzawa

Toru Terada

Provided is a semiconductor device free from chipping of a thin semiconductor element during transportation. The semiconductor device includes: a thin semiconductor element including a front-side electrode on the front side of the semiconductor element, and including a back-side electrode on the back side of the semiconductor element; a metallic member formed on at least one of the front-side electrode and the back-side electrode, the metallic member having a thickness equal to or greater than the thickness of the semiconductor element; and a resin member in contact with the lateral side of the metallic member and surrounding the periphery of the metallic member, with a part of the front side of the semiconductor element being exposed.

Semiconductor device, method for manufacturing the same, and semiconductor module

In a surveillance system, a server and a plurality of cameras provided in a surveillance area are communicably connected to each other. The server includes a table memory that retains information on free resources of each of cameras. The server determines for each camera, a process to be executed by the camera, based on the information on the free resources of the camera, and transmits an instruction to execute the determined process to each camera. Each of the cameras executes a process corresponding to the instruction to execute, based on an instruction to execute the process transmitted from the server.

Surveillance system and surveillance method

A screw apparatus with a seal ring is provided which has a reduced number of components and is easy to be assembled. The screw apparatus includes a screw shaft, a nut that includes a through-hole penetrated by the screw shaft and threadedly engages with the screw shaft via a rolling element, seal rings that include holes fitting the shape of a cross-section of the screw shaft, the cross-section being perpendicular to an axis thereof, and prevent the entry of dust into the inside of the nut, and/or prevent the leaking of lubricant in the nut, and a cap attached to the nut, the cap including protrusions fitted into indentations of the seal rings to effect positioning of the seal rings in a circumferential direction, the cap including a step in contact with the seal rings to effect positioning of the seal rings in an axial direction.

Screw apparatus

A log generator generates log data including a processing time and processing contents, as data indicating a history of each of processes including input of video data recorded in a storage of a case video management system by a video input unit, image processing including a masking process to be performed on the video data by an image processor, and output of the video data by an encoder and a video output unit, at the time of performing processing for the video data, and records the log data in the case video management system in association with the processed video data.

Case video log data generating apparatus, case video processing system, and case video log data generating method

An image pickup device of the present invention includes an image pickup unit that captures a video image, a mask area determination unit that determines a mask area, for which processing for detection of a characteristic part of a target is excluded, among a portion or the entirety of an area of image data of the video image captured by the image pickup unit, and a characteristic part detector that performs the detection processing of the characteristic part of the target on a detection target area obtained by excluding the mask area determined by the mask area determination unit from the portion or the entirety of the area of the image data of the video image captured by the image pickup unit.

Target pickup device and target detection method

A power module includes a power semiconductor element, an interconnection material, a circuit board, an external terminal, a joining material, and a sealing resin. A clearance portion is continuously formed between the sealing resin and each of an end surface of the joining material and a surface of the interconnection material so as to extend from the end surface of the joining material to the surface of the interconnection material, the end surface of the joining material being located between the power semiconductor element and the interconnection material, the surface of the interconnection material being located between the end surface and a predetermined position of the interconnection material separated by a distance from the end surface.

Power module

A video input unit inputs case video data to be processed, a face detector detects a face region of a person included in an image of video data, a target manager registers the face region as a region to be masked, an operation input inputs a user's instruction regarding the face region, a target manager excludes a region designated by the user's instruction from targets to be masked and registers the region as a region not to be masked, an image processor performs a masking process on the region to be masked, and a video output unit outputs video data having been subjected to image processing including the masking process.

Case video processing apparatus, case video processing system, and case video processing method

A power semiconductor device is provided with a semiconductor-element substrate in which a front-surface electrode pattern is formed on a surface of an insulating substrate; semiconductor elements for electric power which are affixed to the surface of the front-surface electrode pattern; a partition wall which is provided on the front-surface electrode pattern so as to enclose the semiconductor elements for electric power; a first sealing resin member which is filled inside the partition wall; a second sealing resin member which covers the first sealing resin member and a part of the semiconductor-element substrate which is exposed from the partition wall, wherein an electrode for a relay terminal is provided on a surface of the partition wall, and a wiring from inside of the partition wall to outside of the partition wall is led out via the electrode for a relay terminal.

Power semiconductor device

A power module according to the present invention is a power module configured such that a power device chip is arranged within an outer casing and an electrode of the power device chip is connected to an external electrode that is integrated with the outer casing. The power module includes: a heat spreader fixed inside the outer casing; the power device chip solder-bonded on the heat spreader; an insulating dam formed on the heat spreader so as to surround the power device chip; and an internal main electrode having one end thereof solder-bonded to the electrode of the power device chip and the other end thereof fixed to an upper surface of the dam. The external electrode and the other end of the internal main electrode are electrically connected to each other by wire bonding.

A semiconductor module includes: an insulating plate; a plurality of metal patterns formed on the insulating plate and spaced apart from each other; a power device chip solder-joined on one the metal pattern; a lead frame solder-joined on the metal pattern to which the power device chip is not solder-joined, and on the power device chip; an external main electrode provided to an outer casing, and joined by wire bonding to the lead frame above the metal pattern to which the power device chip is not joined; and a sealing resin formed by potting to seal the power device chip, the lead frame, and the metal patterns.

Semiconductor module

A power module includes a power device having a top electrode and a bottom electrode, an upper metal block connected to the top electrode, a lower metal block connected to the bottom electrode, a resin covering the power device, the upper metal block and the lower metal block so as to expose a upper surface of the upper metal block and a lower surface of the lower metal block, an upper terminal-cooling power-applying block connected to the upper metal block, a lower terminal-cooling power-applying block connected to the lower metal block, an upper terminal connected to the upper terminal-cooling power-applying block, a lower terminal connected to the lower terminal-cooling power-applying block, and a insulating case covering all elements so as to expose a part of the upper terminal and a part of the lower terminal.

The circuit breaker according to the present invention has first and second terminals having favorable electric conductivity and joined to each other with solder; and a heater whose circumference is insulated installed for melting the solder and supplied with electric power from the current path separate from current paths passing through the first and second terminals; wherein the first and second terminals are separated by a spring force and insulated when the solder is melted.

Circuit breaker

One of the aspects of the present invention is to provide a power semiconductor device, which includes at least one pair of power modules, each of which has a molding surface covered with molding resin and a radiating surface opposite to the molding surface. Also, the power semiconductor device includes a pair of radiating fins sandwiching the power modules such that the molding surfaces of the power modules contact each other and the radiating surfaces thereof each contact the radiating fins.

The semiconductor device according to one of the embodiments of the present invention includes a metal block having first and second main surfaces and defining a recess on the first main surface. It also includes a semiconductor chip received within the recess of the metal block and mounted on the metal block. Further, a first terminal electrically connected with the semiconductor chip is provided, and a second terminal electrically connected with the metal block is also provided.

Growing community of inventors

Tokyo, Japan

Toshiaki Shinohara