C.uyemura Co., Ltd.

Fuji Electric Co., Ltd.

Toshiaki Shibata

Katsuhisa Tanabe

Hiroki Uchida

Yukinori Oda

Kazuki Yoshikawa

Takuma Maekawa

Hiromu Inagawa

Yoshito Ii

Sho Kanzaki

Yoshihito Ii

The present invention provides a bump that can prevent diffusion of a metal used as a base conductive layer of the bump into a surface of an Au layer or an Ag layer. A conductive bump of the present invention is a conductive bump formed on a substrate. The conductive bump comprises, at least in order from the substrate:

Conductive bump and electroless Pt plating bath

An object of the present invention is to provide an electroless plating bath having excellent property in plating film deposition without containing halides such as chloride in the electroless plating bath. A halogen-free electroless plating bath of the present invention comprising:

Electroless plating bath

Disclosed herein is an aluminum oxide film remover for removing an oxide film on the surface of aluminum or aluminum alloy, which comprises silver ions and/or copper ions, a solubilizing agent for silver ions and/or copper ions, and a quaternary ammonium hydroxide compound, and has a pH value of 10 to 13.5. A method for surface treatment of aluminum or aluminum alloy is also disclosed, which comprises immersing a workpiece having aluminum or aluminum alloy at least on the surface thereof in the aluminum oxide film remover, and depositing the silver and/or copper contained in the remover on the surface of aluminum or aluminum alloy while removing the aluminum oxide film.

Aluminum oxide film remover and method for surface treatment of aluminum or aluminum alloy

A solution for removing an aluminum oxide film from an aluminum or aluminum alloy surface, which includes a salt or oxide of a metal capable of substituting aluminum, a solubilizing agent for ions of the metal, and an alkali, and which has a pH of 10 to 13.5. The removing solution makes it possible to form a film of the metal derived from the metal salt or oxide contained in the removing solution by dissolving away the oxide film from the aluminum or aluminum alloy surface at a low temperature and a high speed while restraining, as securely as possible, erosion of the aluminum or aluminum alloy surface. The removing solution ensures that even in the case where the thickness of the aluminum or aluminum alloy basis material is very small, the aluminum or aluminum alloy surface can be activated while assuredly leaving the aluminum or aluminum alloy basis material.

Solution for removing aluminum oxide film and method for surface treatment of aluminum or aluminum alloy

A workpiece including aluminum or an aluminum alloy on a surface thereof is subjected to surface treatment including the steps of immersing in an acidic or alkaline aluminum oxide film-removing solution containing a salt or oxide of a metal capable of substitution with aluminum and forming a substituted metal layer and contained in the removing solution on a surface of the aluminum or aluminum alloy while removing an aluminum oxide film on aluminum or aluminum alloy surface, forming a substituted zinc film by zinc substitution treatment without removing the substituted metal layer, removing the substituted metal layer and substituted zinc film with an oxidizing liquid, and subjecting again to zinc substitution treatment, forming a substituted zinc film.

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Hirakata, Japan

Toshiaki Shibata