Fujikoshi Kikai Kogyo Kabushiki Kaisha

Toshiaki Seki

Yoshio Nakamura

Yasuhide Denda

Masahiro Takeuchi

Makoto Nakajima

Atsushi Kajikura

Satoru Arakawa

Yoshio Otsuka

Satoru Kitta

Toshihisa Yanagisawa

Mitsue Ogawa

Masanori Fukushima

Kiyokazu Gonda

Takuya Kakegawa

The disk edge polishing machine is capable of polishing an inner edge of a center hole of a disk and an outer edge thereof. In the disk edge polishing machine, a sucking member has a cylindrical end section. The sucking member sucks the disk by the cylindrical end section and exposes the inner edge and the outer edge of the disk. The sucking member spins together with the disk. An outer polishing member polishes the outer edge of the disk. An inner polishing member is inserted into the center hole and simultaneously polishes the inner edge of the disk. A first driving mechanism relatively moves the outer polishing member and the sucking member close to and away from the outer edge of the disk along a predetermined course. A second driving mechanism relatively moves the inner polishing member and the sucking member close to and away from the inner edge of the disk along another predetermined course extended from the predetermined course.

Disk edge polishing machine and disk edge polishing system

In the polishing system of the present invention, a adhering unit adheres a wafer on a carrying plate using liquid. A polishing unit polishes the wafer using a polishing plate. A feeding unit conveys the carrying plate from the adhering unit to the polishing unit. A dismounting unit removes the wafer from the carrying plate. A first discharging unit conveys the carrying plate from the polishing unit to the dismounting unit. A cleaning unit cleans the vacant carrying plate. A second discharging unit conveys the carrying plate from the dismounting unit to the cleaning unit. A third discharging unit conveys the carrying plate from the cleaning unit to the adhering unit. The units are formed into a loop lines so that the carrying plate is circulated in the loop line and the wafers are polished therein.

Polishing system for polishing wafer

Growing community of inventors

Nagano, Japan

Toshiaki Seki