Kabushiki Kaisha Shinkawa

Toshiaki Sasano

Ryuichi Kyomasu

Satoshi Enokido

Shigeru Hayata

In measuring the position of a bonding tool accurately in offset correction in a bonding apparatus, the tool is moved to approach a reference member, the tool is illuminated with a reference pattern by a laser diode, and the deviation between the reference member and tool in one horizontal direction is measured based upon the image of the reference pattern projected on the tool. A position detection camera images the tool in another horizontal direction, thus measuring the deviation of the tool and reference member. The position detection camera is moved to approach the reference member, and the deviation between the position detection camera and the reference member is measured by the position detection camera. The accurate offset amounts between the position detection camera and the tool are determined based upon these measured values and amounts of movement of the position detection camera and the tool.

Bonding apparatus

Offset measurement method, tool position detection method and bonding apparatus

Wire bonding method and apparatus in which axial center of a bonding tool is brought to a reference member, and light-emitting diodes are sequentially lit so that images of the reference member and bonding tool in the X and Y directions are acquired by an offset correction camera. In this way, the amount of deviation between the bonding tool and the reference member is measured. Then, a position detection camera is caused to approach the reference member, and the amount of deviation between the optical axis of the position detection camera and the reference member is measured by the position detection camera. The accurate offset amount are determined on the basis of these measured values and the amounts of movement.

Bonding apparatus and bonding method

A wire bonding apparatus and method in which an axial center of a bonding tool is moved to the vicinity of a near reference member, laser diodes are sequentially lit, images of the reference member and bonding tool in the horizontal directions are acquired by a position detection camera, and amounts of deviation between the tool and the reference member are measured. Then, the position detection camera is caused to approach the reference member, and amounts of deviation between the optical axis of the position detection camera and the reference member are measured by the position detection camera. The accurate offset amounts are determined from the measured values and amounts of movement. Image light of the tool and reference member is conducted to the position detection camera by prisms and half-mirror, without a camera for detecting the amount of deviation between the tool and reference member.

A method and apparatus for wire bonding that allows easy checking and correction of bonding point coordinates in which upon the registration of the coordinates of fixed points used for alignment in a fixed point standard pattern storage memory and the subsequent registration of the coordinates of bonding points in a bonding point coordinate memory, the coordinates of bonding points and the images of pads or leads obtained by a camera at the time of the registration of the coordinates are both registered in an image data storage memory, so that the registered images are displayed on a monitor in cases where bonding point coordinates are checked or corrected at a later time.

Wire bonding method

This method and apparatus for wire bonding allows easy checking and correction of bonding point coordinates in which upon the registration of the coordinates of fixed points used for alignment in a fixed point standard pattern storage memory and the subsequent registration of the coordinates of bonding points in a bonding point coordinate memory, the coordinates of bonding points and the images of pads or leads obtained by a camera at the time of the registration of the coordinates are both registered in an image data storage memory, so that the registered images are displayed on a monitor in cases where bonding point coordinates are checked or corrected at a later time.

Wire bonding method and apparatus

A wire bonding method and apparatus for manufacturing semiconductor devices automatically correcting, after predetermined times of bonding executions, any shifts occurring via heat, etc. in an offset distance set between a capillary through which a bonding wire passes and a camera that takes images of leads of a lead frame and pads of a semiconductor chip.

A system for teaching bonding coordinates of pads provided on a semiconductor chip including: a first arithmetic control unit for processing images of pads obtained by a camera and calculates the amount of shift of centers of the images of the pads; and a second arithmetic control unit which, for the first and second pads, corrects the bonding coordinates, thus producing new bonding coordinates for the first and second pads, and for the third and subsequent pads, the second arithmetic control unit moves the camera a distance between new coordinates of two preceding pads and corrects the coordinates of the moved camera, producing new bonding coordinates to be stored in a bonding coordinate memory.

Teaching method and teaching system for a bonding coordinate

In wire bonding used in manufacturing, for example, semiconductor devices, inputting of the coordinates of the first and second leads of a lead frame, on which a semiconductor chip is installed, into an operation controller makes it possible that the coordinates of all of the remaining leads are automatically calculated by an image processor and the bonding coordinates for such leads are also automatically calculated.

Growing community of inventors

Sagamihara, Japan

Toshiaki Sasano