Omron Corporation

Toshiaki Okuno

Hayami Hosokawa

Naru Yasuda

Junichi Tanaka

Akihiko Sano

Hiroshi Sameshima

Akira Enami

Hiroto Nozawa

Yoshihisa Ishida

Takeshi Fujiwara

Katsuyuki Inoue

Yoshitaka Adachi

Tomonori Seki

Junya Yamamoto

Hirokatsu Nakayama

Takaaki Miyaji

Takayuki Haruyama

Po-Hsiu Lin

Kenichi Hinuma

Yoshiki Ashihara

Provided is a technique capable of detecting deformation based on an abnormality such as heat generation in an article by a simpler, smaller, or lower-cost configuration, to suppress occurrence of an accident due to the abnormality of the article. An abnormality detector for measuring deformation of a battery B, such as a lithium-ion battery, to detect an abnormality of the battery, the abnormality detector includes: a sealed container disposed in close contact with at least a part of an outer surface of the battery, while containing and sealing a fluid such as water, the sealed container having flexibility; and a pressure sensor configured to measure a change inside the sealed container, accompanying deformation of the battery.

Abnormality detector

A method for bonding wafers includes forming a first bonding part on a surface of a first wafer by stacking a diffusion preventing layer formed of a material having low wettability with AuSn above the first wafer and forming a bonding layer on a surface of the diffusion preventing layer such that the bonding layer stays back of an edge of the diffusion preventing layer, forming a second bonding part on a surface of a second wafer, and bonding the first bonding part and the second bonding part by eutectic bonding with an AuSn solder under a condition that the first wafer and the second wafer are opposed to each other.

Method for bonding wafers and structure of bonding part

A wafer level package has a first wafer having a plurality of chips mounted or formed thereon in a plane, and a second wafer that is opposed to the first wafer. The first wafer and the second wafer are joined while a seal frame that seals a periphery of each chip is interposed therebetween. A gap is formed between the seal frames of the chips adjacent to each other. A partial connect part that partially connects the seal frames to each other is provided in the gap formed between the seal frames of the chips adjacent to each other.

Wafer level package, chip size package device and method of manufacturing wafer level package

An optical module has a support board, an optical transmission path, and at least a single optical element having a light receiving function or a light emitting function provided on the support board. A light emission surface of the optical transmission path or a light incidence surface of the optical transmission path is arranged such that the optical element and the optical transmission path are optically coupled to each other, with respect to a light receiving surface or a light emitting surface of the optical element. The optical element is sealed by a sealing agent. A gap is provided between the optical transmission path and the surface of the sealing agent on the light receiving surface or the light emitting surface of the optical element.

Optical module, method of producing optical module, optical transmission module, and electronic apparatus

A connection member (), which electrically connects a package () on which an optical element that converts an electric signal to an optical signal or converts an optical signal to an electric signal and at least one end portion including an incident/releasing port for an optical signal of an optical waveguide () that is optically coupled with the optical element to transmit the optical signal are mounted, and a second substrate () to each other, is provided with a holding unit having elasticity, which holds the package (), and a connection unit that is connected to the substrate ().

Optical transmission module, connecting part, and electronic device having optical transmission module

An optical module has an optical element which transmits or receives an optical signal, an optical transmission line optically coupled to the optical element to transmit the optical signal, and a board to which at least one end portion including an incident and outgoing port of the optical signal in the optical transmission line and the optical element are fixed. A wall facing a side surface of the optical transmission line is provided in the board. A first space is provided between the board and the optical transmission line, and a second space is provided between the side surface of the optical transmission line and the wall. The first and second spaces are filled with a bonding agent.

Optical transmission module

A connection member electrically connects an optical element configured to convert an electric signal to an optical signal or to convert an optical signal to an electric signal, a first substrate including an incident/releasing port of an optical transmission path for an optical signal at least one end portion thereof, and a second substrate to each other. The optical transmission path is optically coupled with the optical element to transmit the optical the connection. The connection member includes a connection unit connected to the second substrate and a holding unit having elasticity and holding the first substrate. The holding unit is provided with an electrode at a connecting position to the first substrate, and the holding unit holds the first substrate by connecting the first substrate to the electrode.

An optical cable module has an optical waveguide formed by surrounding a core with a clad layer and a light-receiving/emitting element, installed on a supporting substrate. A light-releasing face of the optical waveguide or a light-incident face to the optical waveguide is aligned so as to face a light-receiving face or a light-emitting face of the light-receiving/emitting element. The optical waveguide is formed into a film shape having flexibility, and provided with a reinforcing member that prevents a deflection from occurring in the optical waveguide. The optical waveguide is placed on a protruding portion from a supporting face of the optical waveguide on the supporting substrate.

Growing community of inventors

Nara, Japan

Toshiaki Okuno