Matsushita Electric Industrial Co., Ltd.

Toshiaki Nakashima

Hiroshi Haji

Wataru Hidese

Kenshu Oyama

Toru Akasaka

An electronic parts mount apparatus for taking out electronic parts from a parts supply sectionby a transfer headand transporting and mounting the electronic parts to and on a boardhas a board recognition cameramoving independently of the transfer headand advancing to and retreating from the boardpositioned on a transfer passagefor picking up an image of the boardto detect the position thereof. The image pickup step of the boardby the board recognition cameraand the parts taking out step in the parts supply section by the transfer headare performed concurrently. Thus, the tact time can be shortened and the electronic parts can be mounted on the board efficiently.

Method for mounting an electronic part by solder position detection

Method for taking out electronic parts from a parts supply section by a transfer head and transporting and mounting the electronic parts to and on a board positioned on a transfer passage. In an image pickup step, a board recognition camera moves independently of the transfer head and advances to and retreats from the board for picking up an image of the board to detect the position thereof in a position detecting step. The image pickup step of the board by the board recognition camera and the parts taking out step in the parts supply section by the transfer head are performed concurrently. Thus, the tact time can be shortened and the electronic parts can be mounted on the board efficiently.

Method for mounting electronic parts on a board

There are irregularities in the thicknesses, longitudinal and lateral sizes of electrical components, which cause placement errors of the electrical components on substrates. Therefore, the thickness, longitudinal and lateral sizes of the electrical component is measured during feeding the electrical component to the substrate. The irregularity of the thicknesses of the electrical components can be corrected by regulating the vertical stroke of a nozzle. The temporary values of the longitudinal and lateral sizes of the electrical component are registered in advance in a computer. When the measured values fall within the allowable range of the temporary values, the correction value of the temporary value based on the measured value is corrected, and the correction value is registered as a new reference value in the computer.

Electrical component placing apparatus and placing method therefor

A tapered surface is formed on a nozzle for picking up an electrical component and placing it on a printed circuit as a light diffusing surface. When a light is radiated to the tapered surface, the light is scattered, and the tapered surface becomes bright. Therefore, the electrical component is clearly observed as a black contour in the bright tapered surface by an observing unit.

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Fukuoka, Japan

Toshiaki Nakashima