Kabushiki Kaisha Toshiba

Toshiaki Miyoshi

Tatsuya Hasegawa

Yoshikazu Yomogihara

Satoshi Yoshimura

Yasunori Fukumoto

A heater tool, which bonds by thermocompression outer leads of a TCP to electrodes on an array substrate, is fixed to a support block and is movable between a compression-bonding position, wherein the distal end portion of the heater tool presses the TCP to compression-bond the outer leads to the electrodes of the array substrate, and a waiting position wherein the distal end portion is spaced apart from the TCP. A pressing mechanism having a pressing member is mounted on the support block and movable in interlock with the movement of the heater tool. The pressing member presses the TCP to press the outer leads against the array substrate when the heater tool moves from the waiting position toward the compression bonding position.

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Hyogo-ken, Japan

Toshiaki Miyoshi