Canon Kabushiki Kaisha

Toppan Printing Co., Ltd.

Toshiaki Kurosu

Yoshinori Tagawa

Takanobu Manabe

Masataka Nagai

Makoto Watanabe

Kenji Fujii

Satoshi Ibe

Hiroyuki Murayama

Kazuhiro Asai

Jun Yamamuro

Hiroto Komiyama

Mitsuru Chida

Koji Sasaki

Kouji Hasegawa

Shiro Sujaku

Takao Tomono

Hiroshi Sugimura

Kazuhiko Shiomitsu

Gaku Suzuki

Yukuo Yamaguchi

Chiaki Muraoka

Shin Ishimatsu

Kazumasa Matsushita

Keiji Edamatsu

Sayaka Takahashi

Provided are a liquid ejection head capable of preventing deformation and breakage of a filter and a method of manufacturing the liquid ejection head. The liquid ejection head comprises: a substrate comprising a supply port through which to supply a liquid and an element configured to produce energy for ejecting the liquid; a resin layer comprising an ejection port through which the liquid is ejectable with the energy produced by the element, and a flow channel connecting the supply port and the ejection port; a filter disposed between the supply port and the flow channel; and a support portion supporting a surface of the filter on the supply port side and a surface of the filter on the flow channel side.

Liquid ejection head and method of manufacturing liquid ejection head

A method for manufacturing a liquid ejection head having a substrate, heat generating elements formed at the front surface side of the substrate, and a nozzle layer forming liquid chambers and liquid ejection ports at the front surface side of the substrate, and the method includes a process of preparing a substrate having heat generating elements and a nozzle layer formation material layer at the front surface side, a process of driving the heat generating elements for heating to form air bubbles serving as the liquid chambers in the nozzle layer formation material layer, and a process of forming liquid ejection ports which communicate with the liquid chambers in the nozzle layer formation material layer, and then forming a nozzle layer forming the liquid chambers and the liquid ejection ports at the front surface side of the substrate.

Method for manufacturing liquid ejection head

A process for producing a semiconductor chip having a substrate and a bump formed on the substrate including (1) forming, on a substrate, a conductor gold for plating to be a base of plating growth; (2) forming a mask for plating on the conductor gold for plating; (3) performing plating using the mask for plating to form the bump and a dummy pattern; (4) removing the mask for plating; (5) etching the conductor gold for plating; and (6) applying a shock to at least the dummy pattern. The amount of side etching of the conductor gold for plating is grasped from a state of separation of the dummy pattern due to the shock in the step (6).

Process for producing a semiconductor chip

The invention discloses a method of manufacturing a microneedle including the steps of forming an island etching mask having thickness distribution on a substrate, and processing the substrate into a needle by taking advantage of a difference in etching rates between the etching mask and the substrate. The invention enables to readily control a point angle and height of the manufactured needle.

Method of manufacturing microneedle

A liquid ejection head includes a substrate which has an energy-generating element that generates energy to be utilized for ejecting a liquid, and a supply orifice for supplying the liquid to the energy-generating element; and an ejection orifice forming member that has a plurality of ejection orifices through which the liquid is ejected, and at least one beam-like projection which projects toward the substrate and extends along an array direction of the ejection orifices at a position corresponding to the supply orifice. A sectional area perpendicular to the array direction of the ejection orifices at the central part of the beam-like projection in the array direction of the ejection orifices is larger than a sectional area in the direction perpendicular to the array direction of the ejection orifices at both ends of the beam-like projection in the array direction.

Liquid ejection head

A method of making a nozzle chip includes a step of reduction-projection-exposing a photosensitive resin material to exposure light through a mask by using a reduction-projection-exposure apparatus, the mask having a light-transmitting pattern formed thereon; and a step of forming an ejection orifice pattern corresponding to the light-transmitting pattern on the photosensitive resin material by performing a developing operation. The exposure light in the step of reduction-projection-exposing is passed through a correction mechanism before the exposure light reaches the photosensitive resin material, the correction mechanism being configured to suppress an inclination of a chief ray due to off-axis telecentricity that occurs in the reduction-projection-exposure apparatus.

Method of making nozzle chip

An object of the present invention is to provide a liquid ejection head capable of suppressing the capture of bubbles into the liquid ejection head including ejection ports having different opening areas so as to satisfactorily fill a liquid channel and the ejection ports with liquid. In order to achieve the object, the liquid ejection head according to the present invention includes a liquid supply port communicating with a plurality of kinds of ejection ports, and further, a defoaming opening communicating with another ejection port except an ejection port having a large opening area out of the plurality of kinds of ejection ports via a defoaming channel.

Liquid ejection head and fabricating method therefor

A liquid ejection head is provided with a recording element substrate having a plurality of ejection orifices for ejecting a liquid, the plurality of ejection orifices being arranged to form a row of the ejection orifices. In at least some of the plurality of the ejection orifices, each having one side and another side, the area of an inner wall of the ejection orifices is set to be larger on the other side than on the one side, the one side and the other side being defined by a plane which passes through the center of the ejection orifice, intersects with the row of the ejection orifices at right angles and extends along the direction of the depth of the ejection orifice.

A liquid ejection head chip includes a liquid ejection unit having a plurality of ejection orifices for ejecting a liquid, a flow path in communication with the ejection orifices, and an energy generating element that generates energy for ejecting the liquid, the liquid ejection unit being provided on an upper surface formed of a (100) surface of a silicon single-crystal substrate. The side surfaces in at least one of two combinations of opposing side surfaces of the substrate have (111) surfaces of silicon single crystal and the angles of the (111) surfaces relative to the (100) surface are supplementary to each other.

Liquid ejection head and method for manufacturing the same

An ink jet recording head includes a substrate having a plurality of discharge energy generation elements and having an ink supply port, a protective film provided on the substrate and configured to protect wiring connected to the discharge energy generation elements, and an ink discharge port forming member, wherein the protective film has a protruding portion, wherein the ink discharge port forming member has a beam-like protrusion, wherein the beam-like protrusion has a reinforcing rib, and wherein a separation film containing gold is formed at a portion where the protruding portion and the reinforcing rib are held in close contact with each other.

Ink jet recording head and method for manufacturing the same

Provided is a method of manufacturing a liquid ejection head, including: forming, on a substrate, a flow path mold pattern that becomes a mold of a liquid flow path; forming a negative photosensitive resin layer on the flow path mold pattern; subjecting the negative photosensitive resin layer to exposure processing with use of a reduction projection exposing apparatus and a mask pattern having an ejection orifice mask shape for forming ejection orifices; and subjecting the negative photosensitive resin layer obtained after the exposure processing to development processing to form the ejection orifices, in which the ejection orifices are formed by correcting, by the ejection orifice mask shape, an inclination of an ejection angle due to an off-axis telecentricity caused by the reduction projection exposing apparatus so as to be close to a direction perpendicular to a surface of the substrate.

Method of manufacturing liquid ejection head

This invention is a manufacturing method of a liquid discharge head that includes a substrate having a plurality of discharge energy generating elements that generate energy that is utilized for discharging a liquid, and a discharge port forming member that constitutes a discharge port group including a plurality of discharge ports that discharge the liquid and flow paths that communicate with the discharge port group. The manufacturing method includes (1) disposing a photosensitive resin as material of the discharge port forming member on or above the substrate, and (2) forming an exposure pattern of the discharge port group using ultraviolet light in the photosensitive resin. In the aforementioned (2), the discharge port group is divided in a longitudinal direction and exposed, and the exposures are respectively performed so that regions in which there is a high degree of telecentricity face each other.

Manufacturing method of liquid discharge head

A liquid ejection head includes a silicon substrate and an orifice plate disposed on or above the silicon substrate. The silicon substrate has a concave portion formed therein, and the orifice plate is disposed in the concave portion.

Liquid ejection head having protected orifice plate and method for manufacturing liquid ejection head

The present disclosure provides a method of making a nozzle chip including a step of forming an ejection orifice row by performing irradiation with light rays using a mask having ejection orifice row patterns that form an ejection orifice row pattern of one nozzle chip when the ejection orifice row patterns are connected to each other through a connection portion. The mask is configured such that, with respect to a direction in which ejection orifices of the ejection orifice row are arranged, an absolute value of off-axis telecentricity of one of the light rays with which an ejection orifice that is at the smallest distance from the connection portion is irradiated is less than an absolute value of off-axis telecentricity of one of the light rays with which an ejection orifice that is at the greatest distance from the connection portion is irradiated.

Provided is a liquid ejection head, including: an ejection orifice forming member having an ejection orifice for ejecting liquid; a substrate having a supply port for supplying the liquid to the ejection orifice; and a filter disposed at a position upstream of the ejection orifice when the liquid is supplied to the ejection orifice, in which the filter includes an opening having a diameter smaller than or equal to a diameter of the ejection orifice, and a tapered shape structure disposed at a position upstream of the opening when the liquid is supplied to the ejection orifice, the tapered shape structure having a distal end directed toward an upstream side.

Growing community of inventors

Oita, Japan

Toshiaki Kurosu