Sumitomo Electric Industries, Limited

Sumitomo Electric Device Innovations, Inc.

Toshiaki Kihara

Hisao Go

Kiyoshi Kato

Eiji Tsumura

Hiromi Nakanishi

Akihiro Moto

Hiromi Kurashima

Yasushi Fujimura

Michio Suzuki

Toshio Takagi

Kuniyuki Ishii

Noriyuki Hirakata

Nobuyuki Shimizu

Sayuri Ichida

The transmitter module including a semiconductor laser chip, a first carrier, a second carrier, and a lens is disclosed. The first carrier mounts the semiconductor laser chip thereon. The second carrier includes a first surface, a second surface, and a connection surface connecting the first surface with the second surface. The first surface faces in a first direction intersecting an axis direction of the chip to mount the first carrier thereon. The second surface faces in the first direction and is provided at a position farther away from the axis of the chip than the first surface. The lens is fixed to the second surface by an adhesive resin. The connection surface is set back far from a front end of the first carrier adjacent to an emission end of the chip toward a back end of the first carrier opposite to the front end in the axis direction.

Transmitter module

A light emitting module including a semiconductor light emitting element, a first lens, a second lens, and an optical fiber stub, is disclosed. The first lens collimates light output from the semiconductor light emitting element. The second lens is a meniscus lens and condenses the collimated light to the optical fiber stub. A light entering surface of the second lens has a cross-sectional shape in which an increase rate of a curvature radius is zero or more. A light exiting surface of the second lens includes a first region and a second region. The first region has a cross-sectional shape in which a sign of the increase rate of the curvature radius is positive. The second region surrounds the first region and has a cross-sectional shape in which a sign of the increase rate of the curvature radius is negative.

Light emitting module

A method of controlling a semiconductor element that includes a semiconductor laser diode (LD), a semiconductor modulator, and a semiconductor optical amplifier (SOA) is disclosed. The LD generates CW light supplied with the first bias current. The semiconductor modulator generates a modulated light by modulating the CW light supplied with a driving signal. The SOA generates an optical signal by amplifying the modulated light supplied with the second bias current. The method first sets the second bias current in a region where the output power of the optical signal shows negative dependence of the second bias current. Then, a temperature of the semiconductor element, the first bias current, and the driving signal are adjusted such that the optical signal shows performance in respective preset ranges.

Method of controlling semiconductor optical device that includes semiconductor optical amplifier

An optical transceiver is disclosed, where the optical transceiver includes an optical subassembly (OSA) with a bottom plate for dissipating heat and connected to an electronic circuit with a flexible printed circuit (FPC). The FPC is soldered with the side electrodes of the OSA as forming a solder fillet in the plane electrode, or the FPC is soldered with the plane electrodes of the OSA as forming the solder fillet in the side electrodes, and leaving a limited room for receiving the curved FPC in peripheries of the OSA.

Optical transceiver implementing with flexible printed circuit connecting optical subassembly to circuit board

An optical module with some OSAs and a fiber unit is disclosed. The fiber unit includes a stub and a flange. A portion of the stub extrudes from the flange; while, the housing of the module that assembles the OSAs includes a pocket with a diameter substantially equal to or slightly greater than a diameter of the stub. Setting the portion of the stub into the pocket, the fiber unit may be automatically aligned with the OSAs through the housing.

Optical module with fiber unit automatically aligned with housing

An optical module with an arrangement is disclosed in which the module has the LD, the TEC, and the lens with the lens carrier also mounted on the TEC. The signal light from the LD is concentrated by the lens and reflected by the mirror each assembled with the lens carrier mounted on the TEC. The TEC is mounted on the bottom metal that covers the bottom of the ceramic package, the first layer of which is widely cut to set the TEC therein. The FPC is coupled in at least two edges of the first ceramic layer left from the cut.

Optical module with ceramic package

A bi-directional optical module with an improved optical crosstalk between the transmitter unit and the receiver unit is disclosed. The optical module provides the LD, the PD, the WDM filter secured with the block, and the package with the co-axial shape. The block provides a slant surface, where the WDM filter is secured thereon, the bottom surface facing the PD mounted on the package, and an aperture connecting the slant surface and the bottom surface. The PD is enclosed within a space formed by the bottom surface and the primary surface, which electrically and optically isolates the PD from the LD.

Bi-direction optical module installing light-emitting device and light-receiving device in signal package

The bi-directional optical module, which installs the receiver and the transmitter within one package, is disclosed with an improved optical crosstalk. The optical module provides a lens, a WDM filter and a photodiode (PD) on an axis of the single mode fiber coupled with the module, while, a laser diode (LD) in a position perpendicular to the optical axis. The WDM filter provides a multi-layered optical film on a primary surface and an edge in a side far from the LD and the (PD) makes an obtuse angle to the primary surface so as to prevent light from the LD and reflected at this edge from entering the PD.

Bi-directional optical module with improved optical crosstalk

A bi-directional optical subassembly (BOSA) is disclosed. The BOSA of the present invention provides first and second optical devices, a WDM filter and the body that is configured to secure two optical devices and to install the WDM filter. The body has a cylindrical shape with a large bore, a small bore and a joint bore connecting two bores. The WDM filter is attached to the tapered surface of the joint bore.

Bi-directional optical module and a method for assembling the same

The present invention provides an optical transmitting module, in which a laser diode and a termination resistor are provided without sizing up the package thereof and degrading the thermal characteristic due to heat generation by the termination resistor. The transmitting module of the present invention includes the semiconductor laser diode, and the resistor. The laser diode is mounted on the side surface of the block extruding from the base. The resistor is mounted on the flat side portion of the end of the lead. The lead is secured in the through hole provided in the base with seal glass being filled in the gap between the through hole and the lead. In the transmitting module thus configured, the laser diode is thermally isolated from the heat generated by the resistor due to the seal glass.

Can-type optical transmitting module utilizing a laser diode with impedance matching resistors

The present invention relates to an optical transceiver that installs an optical transmitting assembly and an optical receiving assembly both are compact, inexpensive, and capable of operating at a high speed. The optical transmitting assembly of the present invention provides the metal bottom that installs the thermoelectric cooler thereon and the semiconductor optical device is mounted, via the insulating substrate, on the thermoelectric cooler. The first and second multi-layered ceramic substrates are provided to surround the thermoelectric cooler. The DC signal or the low-frequency signal for the thermoelectric cooler and the semiconductor optical device is supplied through the first ceramic substrate, while the high frequency signal for the semiconductor device, with the complementary signal having the opposite phase to the high frequency signal, is provided to the semiconductor device through the inner layer of the second ceramic substrate and the insulating substrate. The semiconductor light-receiving device, which monitors light emitted from the semiconductor light-emitting device, is mounted on the top layer of the second ceramic substrate. Thus, the transmission path for the high frequency signal from the drive circuit installed outside of the transmitting assembly to the light-emitting device becomes substantially linear.

Optical sub-assembly having a thermo-electric cooler and an optical transceiver using the optical sub-assembly

The present invention provides an optical transmitting module capable of outputting a signal for precisely controlling bias and modulation current, and a transmitting optical sub-assembly using the same. The optical transmitting module of the invention builds a semiconductor laser diodeand a temperature sensor within a CAN type package. The CAN type package includes a base, a block provided on the base and mounting the laser diode on a side thereof, and a plurality of leads secured to the base. The laser diode is supplied current signal Sthrough one of leads, while the temperature sensor outputs a signal Sthrough the other of leads. The temperature sensor is mounted immediately close to the laser diode, accordingly, capable of monitoring the temperature of the laser diode.

Optical transmitting module having a can type package and providing a temperature sensor therein

The present invention provides an optical transmitting module or optical transmitting sub-assembly in which an inductor for de-coupling the bias circuit of the semiconductor laser diode is built. The laser diode is mounted on the side surface of the block provided on the stem, while the inductor is installed on the lead, which is secured by the stem, such that one electrode of the inductor is in contact to the lead and the other electrode of the inductor is connected to an electrode of the laser diode. The electrode of the laser diode is also connected to the other lead. Thus, the electrode of the laser diode is connected to two leads, one of which is through the inductor.

Optical transmitting module having a de-coupling inductor therein

The present invention relates to a method for manufacturing an optical transceiver that installs an optical transmitting assembly and an optical receiving assembly both are compact, inexpensive, and capable of operating at a high speed. The optical transmitting assembly of the present invention provides the metal bottom that installs the thermoelectric cooler thereon and the semiconductor optical device is mounted, via the insulating substrates, on the thermoelectric cooler. The first and second multi-layered ceramic substrates are provided to surround the thermoelectric cooler. The DC signal or the low-frequency signal for the thermoelectric cooler and the semiconductor optical device is supplied through the first ceramic substrate, while the high frequency signal for the semiconductor device, with the complementary signal having the opposite phase to the high frequency signal, is provided to the semiconductor device through the inner layer of the second ceramic substrate and the insulating substrate. The semiconductor light-receiving device, which monitors light emitted from the semiconductor light-emitting device, is mounted on the top layer of the second ceramic substrate. Thus, the transmission path for the high frequency signal from the drive circuit installed outside of the transmitting assembly to the light-emitting device becomes substantially linear.

Method for manufacturing a transmitting optical sub-assembly with a thermo-electric cooler therein

A light-transmitting module of the present invention includes a light-emitting device such as a laser diode (LD), a transistor for shunting-drive the LD and a CAN type package with a base and an electrically conductive block. The LD and the transistor are mounted on a side of the block in side-by-side arrangement such that the LD substantially positions a center of the package. One of the current terminals of the transistor and one electrode of the LD are connected via the conductive block. The other of the current terminal of the transistor and the other of the electrodes of the LD are connected to one lead, while the control terminal of the transistor is connected to the other lead. Since the present module includes the transistor within the CAN type package, the size thereof may be miniaturized, and the quality of the optical output can be enhanced.

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Yokohama, Japan

Toshiaki Kihara