Hitachi, Ltd.

Hitachi Automotive Systems, Ltd.

Renesas Technology Corp.

Other

Renesas Electronics Corporation

Hitachi Astemo Ltd.

Hitachi Cable, Inc.

Hitachi Automotive Systems Hanshin, Ltd.

Toshiaki Ishii

Nobutake Tsuyuno

Akira Nagai

Shuji Eguchi

Masahiko Ogino

Hiroyoshi Kokaku

Masanori Segawa

Eiichi Ide

Toshiya Satoh

Ichiro Anjoh

Hiroshi Hozoji

Junpei Kusukawa

Asao Nishimura

Kinya Nakatsu

Kimio Tatsuno

Tsutomu Kono

Yoshio Kawai

Takumi Ueno

Kazuyuki Fukuda

Tadaaki Ishikawa

Toshinori Hirataka

Toshimasa Miura

Koji Yoshida

Yujiro Kaneko

Ryoichi Kajiwara

Masaru Kamoshida

Haruo Akahoshi

Takeshi Tokuyama

Toshiaki Morita

Takao Miwa

Tokihito Suwa

Maki Ito

Masahiko Asano

Yusuke Yasuda

Takeshil Kato

Hideki Miyazaki

Akio Takahashi

Takeshi Kato

Naotaka Tanaka

Yoshitaka Takezawa

Chuichi Miyazaki

Masatsugu Ogata

Mamoru Mita

Akira Matsushita

Kozo Sakamoto

Shigehisa Motowaki

Norio Okabe

Tadanori Segawa

Takuya Nakajo

Katsuo Arai

Hidemasa Kagii

Eiji Nishioka

Mina Amo

Ichirou Anjou

Kazutoshi Ito

Hiroyuki Temmei

Ryo Moteki

Ryouichi Kajiwara

Hiroshi Nakano

Hiromichi Suzuki

Kazuhiro Suzuki

Satoshi Nakamura

Akitoyo Konno

Fujio Ito

Takashi Hirao

Takafumi Nishita

Ryozo Takeuchi

Atsuo Nishihara

Kazuhiko Sugita

Akihiro Namba

Hiromi Shimazu

Akihiko Kameoka

Yoichi Anzo

Hideto Yoshinari

Mitsuhiro Masuda

Masayuki Kamikawa

Itaru Tanabe

Masato Saito

Takayuki Fukuzawa

Masashi Yura

Kazutoshi Itou

Rie Hattori

Fusao Hojo

Motoko Harada

Yasuhide Sugawara

Hiroshi Houzouji

Kazuaki Naoe

Hiroshi Kameyama

Masaru Yamada

Yoshinori Negishi

Ogino Masahiko

Ryou Moteki

Hiroyuki Ikejima

Hirosi Yosikawa

Shigekazu Sakabe

Toshiaki Maehara

Hidehiko Sugimoto

Takesi Kisimoto

Yasuhiro Tsuyuki

A temperature rise due to thermal interference between electronic components is suppressed. Electronic components () are adjacently mounted on a circuit board (). The circuit board () is fixed to a base (). A rectangular convex portion () is provided on the base (). The rectangular convex portion () is disposed so as to be located below the electronic components () when the circuit board () is assembled to a housing (). The rectangular convex portion () includes N concave portions (). The concave portions () are arranged on a surface () facing the region between the electronic components (a,b).

Electronic control device

A power semiconductor device includes a circuit body, first and second insulations, first and second bases, a case, and a distance regulation portion. The circuit body incudes a semiconductor element and a conductive portion. The first insulation and the second insulation oppose each other. The first base and second base also oppose each other. The case has a first opening portion covered with the first base and a second opening portion covered with the second base. The distance regulation portion has a first end that contacts the first base and a second end, that is opposite to the first end, and that contacts the second base. The distance regulation portion regulates a distance between the first base and the second base.

Power semiconductor device having a distance regulation portion and power conversion apparatus including the same

Provided is a box-type vehicle-mounted control device that effectively increases the amount of heat transfer from electronic components and a circuit board to a casing (base and cover) and that accordingly has achieved excellent heat dissipation property. The box-type vehicle-mounted control device includes a circuit board, a base, and a cover. In addition, a first heat radiating coating layeris formed on at least one surface of the circuit board, and a second heat radiating coating layeris formed on an inner surface of one or both of the baseand the coverfacing the first heat radiating coating layer

Box-type vehicle-mounted control device

Providing a highly reliable electronic control device capable of achieving both low cost and productivity. An electronic control device including an electronic component, a control substrate on which the electronic component is mounted, and a sealing resin that seals the control substrate, the electronic control device being installed outside the vehicle cabin or in the engine compartment, the electronic control device further including a housing case that fixes the control substrate, and an outer periphery of the housing case being covered with a sealing resin.

Electronic control device, and manufacturing method for vehicle-mounted electronic control device

An object is to provide the structure of an ECU enabling resin to be filled without deformation of an electronic circuit board. A resin-sealed vehicle-mounted control device includes: a circuit board; a base member housing the circuit board; and resin filled between the circuit board and the base member. The base member has: a base portion fixing the circuit board; and a side wall opposed to the side surface side of the circuit board. The resin is provided at least between the circuit board and the base portion. The side wall has an opening at any position on the side of the base portion from a position opposed to the side surface side of the electronic circuit board.

Resin-sealed vehicle-mounted control device

There is a problem that an oxide film or high resistance abrasion powder is formed at the contact interface due to micro sliding abrasion in a high temperature environment or temperature cycle to increase the contact resistance at the contact portion of a non-noble metal connection terminal. Provided is an in-vehicle electronic module, a connector, and a connection structure thereof, which have the same connection reliability as noble metals even when exposed to a harsh environment and can reduce cost of members. The in-vehicle electronic module includes a circuit board on which an electronic component is mounted, and a protection member accommodating the circuit board and protecting the circuit board from a surrounding environment and has a structure where a surface layer at an end portion of the circuit board is made of an 1 Ag-containing Sn-based solder having average thickness of 4 &#x3bc;m or more, and a surface material of a connection terminal of one card edge connector has a two layer structure of a soft noble metal layer of Ag, Pd, Pt, or the like/a reaction layer of a hard noble metal and Sn or an Ni layer.

Vehicle-mounted electronic module, card edge connector, and connector

The invention provides an in-vehicle controller equipped with a heat radiation coating film which can efficiently radiate heat from a high temperature portion such as a heat generating body to a casing. An in-vehicle controller includes a heat radiation coating film, wherein the heat radiation coating film includes a first region that has a first boundary surface abutting on a base material, and a second region that has a second boundary surface where the heat radiation coating film abuts on air, wherein a thermal conductivity of the first region is higher than that of the second region, and wherein a thermal emissivity of the second region is higher than that of the first region.

In-vehicle controller

Provided is an inexpensive and highly reliable resin sealed-type onboard electronic control device is mounted in a vehicle such as an engine control unit and a control unit for automatic transmission, which have a heat dissipation structure for dissipating heat generated from an electronic component such as a semiconductor element. The onboard control device includes a circuit board, a member provided to face the circuit board, a heat generating electronic component mounted between the circuit board and the member, a heat dissipating material provided between the heat generating electronic component and the member, and a sealing resin to seal the circuit board and the heat generating electronic component. And a space between the member and the circuit board is at least a part of a range where the heat dissipating material is not provided, and is narrower than a range where the heat dissipating material is provided.

Onboard control device

An internal combustion engine ignition coil according to the present invention includes: a central iron core; a primary coil disposed on an outer circumference of the central iron core; a secondary coil disposed on an outer circumference of the primary coil; a side iron core disposed on an outer circumference of the secondary coil; and an insulating material sealing the central iron core, the primary coil, and the secondary coil on an inner side of the side iron core. A first layered silicate having a particle diameter less than a winding diameter of the secondary coil is present at a higher concentration in a vicinity of the secondary coil than that in a vicinity of the side iron core in the insulating material. A second layered silicate having a particle diameter greater than the winding diameter of the secondary coil is present at a higher concentration than that of the first layered silicate between the outer circumference side of the secondary coil and the side iron core. The second layered silicate has an aspect ratio of 50 or more, the aspect ratio being a ratio of a long side of a particle of the layered silicate to a thickness of the particle.

Internal combustion engine ignition coil and method for manufacturing internal combustion engine ignition coil

An object of the present invention is to provide a power module capable of realizing a superior heat radiation property while satisfying a high insulation property. A power module according to the present invention includes: a conductor plate to which a switching element is connected; a heat radiation plate which is disposed to face the conductor plate; an insulating member which is disposed between the conductor plate and the heat radiation plate; and a conductive intermediate conductor which is disposed in the insulating member in a state of being electrically insulated from the conductor plate and the heat radiation plate, wherein the intermediate conductor has a communication region which communicates between the insulating member disposed on the side of the conductor plate with respect to the intermediate conductor and the insulating member disposed on the side of the heat radiation plate with respect to the intermediate conductor.

Power module

An electronic component has a semiconductor element and a thermally conductive support member. A heat sink is disposed on one surface of the circuit body, and a thermally conductive insulating member is interposed between the heat sink and the support member. Input and output terminals and a ground terminal are also provided. A sealing resin is formed to expose a part of each of the input and output terminals and the ground terminal and one surface of the heat sink, and to cover a periphery of the electronic component structure. A main body conductor layer is formed to be insulated from the input and output terminals and cover an immersion region of the sealing resin and one surface of the heat sink immersed in a cooling medium. A ground conductor layer covers at least a part of the ground terminal and is electrically connected with the main body conductor layer.

Electronic device and method of manufacturing the electronic device

A waterproof electronic device includes: an electronic component module having an electronic component including a semiconductor element, a heat dissipating member provided on the electronic component in a thermally conductive manner, and an insulating material that surrounds the electronic component in such a manner that one surface of the heat dissipating member is exposed; and a waterproof film that is formed at least on whole surfaces in regions of the electronic component module that are to be immersed in a coolant.

Waterproof electronic device and manufacturing method thereof

There is a problem that contact resistance increases due to formation of an oxide film on a contact interface or biting of abrasion powder caused by micro-sliding when a contact connecting portion of a connection terminal including non-noble metal members is exposed to high temperature environment or a repetitious temperature cycle. An object of the present invention is to provide an in-vehicle electronic module that has connection reliability equivalent to that of the conventional in-vehicle electronic module even when being placed in the environment of an engine compartment and can achieve cost reduction by reducing the number of parts and assembly steps. The electronic module includes a mounting board having a circuit board on which an electronic component is mounted, and a case member for accommodating and protecting the mounting board from surrounding environment, The electronic module has a connection structure in which a portion of the circuit board is protruded to the outside through an opening of the case and inserts a board terminal into an external female connector to obtain electrical continuity, and a portion of the case member forms a connector housing that receives the female connector and isolates a space in which the board terminal is present from surrounding environment and an insulating resin member for fixing the circuit board in the case is integrally molded or joined with the circuit board.

In-vehicle electronic module

There is provided an on-vehicle electronic module that includes an external connecting function and environment resistant reliability similar to a previous on-vehicle electronic module and that simultaneously achieves downsizing without a male connector housing component and cost reduction due to reduction of the number of components and assembly man-hours. There are included a circuit boardincluding a mounting regionand a terminal forming region, and a case housing the mounting regionof the circuit board. Electronic componentsandare mounted on the mounting region. A board terminal is formed in the terminal forming region. The case includes a case memberintegrally formed with a wall surface and a male connector housing. The wall surface forms a case internal spacethat houses the mounting region. A female connector is mounted to the male connector housing. The circuit boardpenetrates the case membersuch that the terminal forming regionis exposed to a housing spaceside of the male connector housing

Vehicle-mounted electronic module

An insulation film that strongly adheres to a power semiconductor module having a resin sealer and a conductor plate and has high thermal conductivity is provided. An insulation layeris provided between a power semiconductor moduleand a heat dissipation portionB. The power semiconductor moduleincludes a resin sealer, which covers a circumferential side surface of a conductor plate, and a plurality of recessesD are provided in the resin sealer. The insulation layeris formed of a spray coated film, an insulation film, and a resin layer, and the spray coated filmis formed on the surface of the resin sealerincluding recessesD to form a seamless flat surface. The planar size of each of the recessesD is greater than the planar size of each flat portion, which forms the spray coated film

Power semiconductor module and power module

Growing community of inventors

Hitachi, Japan

Toshiaki Ishii