Sumitomo Chemical Company, Limited

Toshiaki Hayashi

Yasuhiro Endo

Nobuyuki Nakajima

Shuichi Kanagawa

Noriaki Saito

Mitsuhiro Shibata

Shinichiro Kitayama

Hisashi Watabu

Yoichi Ueda

Hiroshi Nakamura

Yasuhiro Hirano

Yoshiki Matsuoka

Katsuhiro Furuta

A resin film comprising (A) an epoxy resin having two or more glycidyl groups in a molecule, (B) an epoxy resin curing agent, (C) a thermoplastic resin, and (D) a filler, wherein the filler content in at least either one of the surface regions on the cross-section of the film is less than the filler concentration in the central region. The resin film has not only toughness but also fire retardancy, high interlayer adhesion strength and good processability of metal plating.

Resin film and multilayer printed wiring board using thereof

Thermosetting resin composition for build-up

A cyanate ester-epoxy resin composition that can be cured to obtain a product which has excellent mechanical properties is provided. More particularly, a cyanate ester composition comprising (A) a cyanate ester in which the total content of impurities containing imino carbonates, alkyl cyanamides, partially substituted cyanates and phenols is 5% or less, or a prepolymer thereof and (B) an epoxy resin is provided.

Cyanate ester composition and cured product thereof

Provided is a thermosetting resin composition for build-up method comprising (A) an epoxy resin having two or more glycidyl groups, (B) a curing agent for epoxy resin, (C) a poly(ether sulfone) and (D) an inorganic filler. The thermosetting resin composition does not deteriorate the processability such as that found in the conventional one and gives a cured product excellent in low-thermal expansion and low-water absorption.

Thermosetting resin compositions for build-up method

An ester compound prepared by esterifying at least one OH group of a polyhydric phenol as a condensation product of a non-substituted or substituted resorcinol and a carbonyl compound with an organic carboxylic acid having 1 to 20 carbon atoms or a derivative thereof, which necessarily contain an organic carboxylic polyacid having 1 to 20 carbon atoms or a derivative thereof. The ester compound can be used as an epoxy resin curing agent affording a cured article having low dielectric constant, low moisture absorption and sufficient heat resistance.

Ester compound and thermosetting resin composition using the same

Epoxy resin composition and resin-encapsulated semiconductor device

A cyanate resin composition comprising as essential components a cyanate compound represented by formula (1) or its prepolymer and a curing agent: ##STR1## wherein each of R.sub.1 and R.sub.2 represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms; A represents an alkyl group having 1 to 3 carbon atoms; i represents an integer of 0 to 3 alone or together with a brominated epoxy compound or a maleimide compound or its prepolymer, said cyanate resin composition giving a cured product having a low-dielectric constant, and a copper-clad laminate composed of a prepreg of said cyanate resin composition and a copper foil.

Cyanite composition and copper-clad laminate using the composition

A powder coating composition comprising as essential components: (A) polyester resin having at least two hydroxyl groups in a molecule, and (B) polyvalent organic cyanate having at least two cyanate groups in a molecule of the following formula and/or its prepolymer; ##STR1## wherein A is C1-C6 hydrocarbon group, and A may be different from each other;

Polyester powder coating composition

A cyanate resin composition suitable for a copper-clad laminate comprises components (A) and (B).

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Tsukuba, Japan

Toshiaki Hayashi