Namics Corporation

Toshiaki Enomoto

Masaaki Hoshiyama

Toyokazu Hotchi

Toshiyuki Sato

Shien Ri

Qinghua Wang

Arata Hayashigaki

A residual thermal strain distribution measurement method of measuring a residual thermal strain distribution as residual thermal deformation in a sample generated under application of a thermal load, comprises recording images of a periodic pattern present on the surface of the sample by an image recording unit at a first temperature and a sample formation temperature at which the sample is formed, generating moire fringes based on each recorded image of the periodic pattern, calculating a phase of the moire fringes for the sample at the first temperature, calculating a phase of the moire fringes for the sample at the sample formation temperature, acquiring a phase difference of the moire fringes at the sample formation temperature with respect to the first temperature, and calculating a residual thermal strain of the sample at the first temperature with respect to the sample formation temperature based on the acquired phase difference.

Residual thermal strain measurement method, residual thermal strain measurement device, and program therefor

Provided is a thermosetting resin composition, which can be used as underfill for obtaining favorable solder connectivity while suppressing the formation of voids in the case of treating under heating conditions required by the underfill in a semiconductor chip thermocompression bonding step using the thermal compression bonding technique. The thermosetting resin composition contains a thermosetting resin, a curing agent and a fluxing agent, and the temperature at which the rate of temperature change of viscosity when temperature is increased according to a prescribed heating profile reaches 30 Pa&#xb7;s/&#xb0; C. is 200&#xb0; C. to 250&#xb0; C.

Thermosetting resin composition and method of producing same

A method of predicting viscosity behavior of a thermosetting resin is provided that is capable of predicting viscosity behavior of a thermosetting resin and void generation in the underfill is suppressed while good solder connection is obtained. The method includes: measuring a reaction rate and measuring viscosity behavior to measure a calorimetry peak and viscosity behavior of the thermosetting resin with three or more rates of temperature increase respectively; fitting a reaction rate to fit measurement data with each rate of temperature increase obtained by the measuring a reaction rate to a Kamal model formula to obtain fitting curves; fitting viscosity behavior to fit parameters in the Kamal model formula and the measurement data for each rate of temperature increase obtained by the measuring viscosity behavior to a Castro-Macosko model formula to obtain fitting curves; and calculating virtual viscosity behavior to calculate virtual viscosity behavior of the thermosetting resin at the arbitrary rate of temperature increase by simulation based on each fitting curve for each rate of temperature increase obtained by the fitting viscosity behavior.

Method of predicting viscosity behavior of thermosetting resin, simulation software, method of producing thermosetting resin, and underfill produced in the production method

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Niigata, Japan

Toshiaki Enomoto