Sumitomo Bakelite Company Limited

Toshiaki Chuma

Masayoshi Kondo

Satoshi Tanaka

Kenichi Kanemasa

Masaaki Kato

Satoru Nakao

Kentaro Fujiura

Disclosed is an electronic component package () including a circuit board (), an electronic component (), and an adhesive layer (). The circuit board () is provided with an electrically-conductive conductor post () which is buried in a base member (), and a solder layer () which is provided at the front end () of the conductor post () while exposed from a surface () of the base member (). An electrode pad () having a metal layer () mounted thereon is provided on the main surface () of the electronic component (). The adhesive layer () contains a flux activating compound, and bonds the surface () of the base member () and the main surface () of the electronic component (). Then, the metal layer () and the solder layer () are metal-bonded.

Electronic component package and method for producing electronic component package

A joint structure of the present invention includes a conductive member containing copper as a major component thereof, an electrode member containing copper as a major component thereof, and a joint portion formed by fusion welding the conductive member and the electrode member with a brazing material containing tin as a major component thereof and containing substantially no copper, wherein the amount of copper atoms contained in the alloy in the central part of the joint portion is higher than that in the outer circumference part.

Joint structure, joining method, wiring board and method for producing the same

A multilayer flexible wiring board including (1) plural single-sided wiring boards each having a wiring pattern on one side of the corresponding substrate and two-layer conductor posts projecting from the wiring pattern to the side of the substrate opposite from the wiring pattern, wherein the substrates other than that of the outermost layer have the pads to be connected to the two-layer conductor posts on the side opposite from the conductor posts, and the wiring pattern has no surface coating; (2) a flexible wiring board having on at least one side thereof the pads for connection to the conductor posts and including a wiring pattern with surface coating applied on the flexible portion but no surface coating applied on the multilayer portion, and (3) an adhesive layer having a flux function, wherein the conductor posts and pads are connected by a metal or an alloy, and the wiring patterns are electrically connected.

Growing community of inventors

Tokyo, Japan

Toshiaki Chuma