Other

Hitachi, Ltd.

Renesas Technology Corp.

Hitachi Cable, Inc.

Toshiak Ishii

Akira Nagai

Kunihiro Tsubosaki

Makoto Kitano

Masahiko Ogino

Ichiro Anjoh

Shuji Eguchi

Chuichi Miyazaki

Hiroyoshi Kokaku

Nobutake Tsuyuno

Masanori Segawa

Mamoru Mita

Makoto Morishima

Norio Okabe

Rie Hattori

A semiconductor device having a superior connection reliability is obtained by providing a buffer body for absorbing the difference of thermal expansion between the mounting substrate and the semiconductor element in a semiconductor package structure, even if an organic material is used for the mounting substrate. A film material is used as the body for buffering the thermal stress generated by the difference in thermal expansion between the mounting substrate and the semiconductor element. The film material has modulus of elasticity of at least 1 MPa in the reflow temperature range (200&#x2013;250&#xb0; C.).

Circuit tape having adhesive film semiconductor device and a method for manufacturing the same

A semiconductor device having a superior connection reliability is obtained by providing a buffer body for absorbing the difference of thermal expansion between the mounting substrate and the semiconductor element in a semiconductor package structure, even if an organic material is used for mounting substrate. A film material is used as the body for buffering the thermal stress generated by the difference in thermal expansion between the mounting substrate and the semiconductor element. The film material has modulus of elasticity of at least 1 MPa in the reflow temperature range (200-250&deg; C.).

Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same

A semiconductor device having a superior connection reliability is obtained by providing a buffer body for absorbing the difference of thermal expansion between the mounting substrate and the semiconductor element in a semiconductor package structure, even if an organic material is used for the mounting substrate. A film material is used as the body for buffering the thermal stress generated by the difference in thermal expansion between the mounting substrate and the semiconductor element. The film material has modulus of elasticity of at least 1 MPa in the reflow temperature range (200-250.degree. C.).

Circuit tape having adhesive film, semiconductor device, and a method

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Hitachi, Japan

Toshiak Ishii